Texas Instruments SN74LVC1G126YEPR

Overview

SN74LVC1G126YEPR from Texas Instruments is a single 3-state bus buffer gate used for signal isolation and controlled data routing in low-voltage digital systems. It features true (non-inverting) logic, ±24mA output drive at 3.3V, 3.7ns maximum propagation delay at 3.3V, 10μA maximum ICC, and over-voltage tolerant inputs up to 5.5V with 1.65V–5.5V VCC operation.

For engineers reviewing the SN74LVC1G126YEPR datasheet, SN74LVC1G126YEPR pinout, SN74LVC1G126YEPR application, or SN74LVC1G126YEPR equivalent, key selection considerations include 3-state control timing (ten/tdis), Ioff-enabled live insertion support, rail-to-rail input tolerance, and NanoFree™ DSBGA packaging for ultra-compact PCB layouts in space-constrained embedded interfaces.

Technical Context

The SN74LVC1G126YEPR implements a CMOS-based non-inverting buffer with active-high output-enable (OE) control, enabling/disabling the A→Y path without inversion. Its balanced 3-state outputs support bidirectional bus sharing and hot-swap capability via Ioff protection.

It operates across –40°C to 125°C with guaranteed switching performance at VCC = 1.65V–5.5V, supports down-translation (e.g., 5V inputs to 1.8V VCC), and meets JESD78 Class II latch-up immunity (>100mA). Input transition rate limits (5–20 ns/V) ensure stable CMOS switching behavior.

Key Specifications

Pinout & Package

SN74LVC1G126YEPR uses the YZP (DSBGA-5) package: 1.39mm × 0.89mm body size, 0.4mm pitch, bottom-side ball array. This NanoFree™ package eliminates leads, reduces parasitic inductance, and supports high-density routing in portable and aerospace-grade assemblies.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 3-state buffer applications.

Compared with SN74LVC1G126YEPR, SN74LVC1G125YEPR offers identical performance in an inverting configuration-ideal for complementing existing logic-but cannot preserve signal polarity. NC7SZ126P5X provides functional equivalence in a larger SC-70 package without Ioff certification, limiting its use in partial-power-down systems.

Availability

SN74LVC1G126YEPR is available at Aetrix Electronics and suitable for video broadcasting infrastructure, military radar signal routing, industrial motor control interfaces, and SSD internal data path isolation requiring stable component supply across extended temperature and mixed-voltage environments.

Supply support for SN74LVC1G126YEPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions for industrial, automotive, and communications markets.

The SN74LVC1G126YEPR belongs to TI's LVC low-voltage CMOS logic family, engineered for high-speed, low-power, mixed-supply interoperability in space- and power-constrained digital interfaces.

FAQ

What is the function of the OE pin on the SN74LVC1G126YEPR?

The OE (output-enable) pin on the SN74LVC1G126YEPR is an active-high control input that determines whether the device passes data from A to Y. When OE is high, the buffer operates normally (Y = A); when OE is low, Y enters high-impedance state. This enables bus sharing and signal isolation. The OE pin accepts voltages up to 5.5V independent of VCC, supporting flexible control signaling in mixed-voltage systems. SN74LVC1G126YEPR requires OE to be tied to GND during power-up to maintain high-impedance until initialized.

Does the SN74LVC1G126YEPR support live insertion or hot-swap applications?

Yes, the SN74LVC1G126YEPR supports live insertion via its Ioff feature, which disables all outputs and limits leakage to ±10μA when VCC = 0V. This prevents current backflow between powered and unpowered circuit sections during board replacement or module insertion. The feature is explicitly characterized per JESD78 Class II latch-up standards and validated across –40°C to 125°C. SN74LVC1G126YEPR is therefore suitable for telecom line cards, modular test equipment, and field-upgradeable avionics subsystems where hot-swap reliability is mandatory.

Can the SN74LVC1G126YEPR accept 5V input signals while operating at 1.8V VCC?

Yes, the SN74LVC1G126YEPR accepts input voltages from –0.5V to 5.5V on both A and OE pins, regardless of VCC setting (1.65V–5.5V). This over-voltage tolerance enables direct interfacing with 5V legacy peripherals without external level shifters or clamping diodes - a key advantage in mixed-supply systems like industrial PLCs or hybrid video gear. However, output swing remains rail-to-rail with VCC (e.g., VOH ≈ 1.8V when VCC = 1.8V), so downstream receivers must be compatible with that logic threshold. SN74LVC1G126YEPR maintains this behavior across its full temperature range.

What is the maximum capacitive load the SN74LVC1G126YEPR can drive while meeting datasheet timing specs?

The SN74LVC1G126YEPR guarantees switching characteristics (tpd, ten, tdis) up to 50pF total load capacitance, as verified in Sections 5.7 and 5.8 of the datasheet under –40°C to 125°C. Beyond 50pF, propagation delay increases nonlinearly and may violate timing margins - especially at higher VCC (e.g., 5V) or temperature extremes. For loads >50pF, TI recommends adding a series damping resistor (typically 10–33Ω) close to the Y output to suppress ringing and maintain signal integrity. SN74LVC1G126YEPR's 19pF typical Cpd and ±24mA drive strength make it well-suited for driving FR-4 traces ≤12cm long with minimal added termination.

Which package variant does SN74LVC1G126YEPR use, and why is it significant?

SN74LVC1G126YEPR uses the YZP package: a 5-ball, 0.4mm-pitch DSBGA (Die Size Ball Grid Array) with 1.39mm × 0.89mm body dimensions. This NanoFree™ package eliminates wire bonds and lead frames, reducing parasitic inductance and package capacitance - critical for maintaining 3.7ns tpd in high-speed digital paths. Its ultra-small footprint enables placement in tight spaces such as wearable sensors, UAV flight controllers, and multi-chip SiP modules. Unlike SOT-23 or SC-70 variants, YZP supports finer pitch routing and lower thermal resistance (RθJA = 132°C/W), making SN74LVC1G126YEPR ideal for thermally demanding, miniaturized designs.