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Home > Products > Integrated Circuits (ICs) > Logic > Buffers, Drivers, Receivers, Transceivers

Texas Instruments SN74LVC1G17MDBVREP

Name: SN74LVC1G17MDBVREP
Brand: Texas Instruments
SKU: SN74LVC1G17MDBVREP
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SN74LVC1G17MDBVREP

Manufacturer:: Texas Instruments

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: SC-74A, SOT-753

Datasheet:: SN74LVC1G17MDBVREP.pdf

Description:: IC BUF NON-INVERT 5.5V SOT23-5

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Product details

Overview

SN74LVC1G17MDBVREP from Texas Instruments is a single-channel Schmitt-trigger buffer IC designed for 1.65-V to 5.5-V V_CC operation, delivering 4.6 ns max propagation delay at 3.3 V, ±24 mA output drive, and I_off support for partial power-down mode - used in noise-immune signal conditioning for industrial sensor interfaces and microcontroller GPIO debouncing.

For engineers reviewing the SN74LVC1G17MDBVREP datasheet, SN74LVC1G17MDBVREP pinout, SN74LVC1G17MDBVREP application, or SN74LVC1G17MDBVREP equivalent, key selection criteria include hysteresis voltage (ΔV_T = 0.51–0.83 V at 3 V), extended temperature range (–55°C to 125°C), SOT-23-5 package compatibility, and I_off-enabled system-level power sequencing.

Technical Context

This device implements a noninverting Schmitt-trigger buffer with asymmetric input thresholds: VT+ = 1.48–1.92 V and VT– = 0.89–1.20 V at V_CC = 3 V, yielding 0.51–0.83 V hysteresis to reject analog noise on digital inputs. It operates across 1.65–5.5 V supply, supports 5-V tolerant inputs, and features rail-to-rail CMOS-compatible outputs.

The I_off circuitry actively disables outputs during power-down, preventing back-current flow when V_CC = 0 V while inputs remain biased - critical for hot-swap and multi-rail systems. No enable pin is present; the device functions continuously as a buffer with Schmitt action.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CC Range	1.65 V to 5.5 V - enables direct interface with 1.8-V, 2.5-V, 3.3-V, and 5-V logic domains without level shifters
Max t_pd	4.6 ns at 3.3 V, CL = 15 pF - ensures timing-critical signal path integrity in high-speed microcontroller peripheral buffering
Hysteresis ΔV_T	0.51–0.83 V at 3 V - provides robust noise margin against EMI-induced glitches in motor control feedback or sensor lines
I_off	<±10 μA at V_I/V_O = 5.5 V, V_CC = 0 V - guarantees safe isolation during partial power-down in battery-backed subsystems
Output Drive	±24 mA at 3.3 V - drives multiple 74LVC inputs or LED indicators directly without external buffers
Operating Temp	–55°C to +125°C - qualified per JEDEC standards for aerospace, defense, and under-hood automotive applications
I_CC Max	10 μA - minimizes quiescent current in always-on monitoring circuits such as wake-up signal conditioners

Pinout & Package

SOT-23-5 (DBV) package: 2.92 mm × 1.3 mm × 1.45 mm body, surface-mount, lead-free (NIPDAU), moisture sensitivity level 1 (260°C peak reflow).

Pin/Terminal	Circuit Role	Design Meaning
1 (NC)	No-connect terminal	Internally unconnected; must be left floating or tied to GND per layout best practice - no electrical function
2 (A)	Input	Noninverting Schmitt-trigger input; accepts 1.65–5.5 V signals with hysteresis; 5-V tolerant
3 (GND)	Ground reference	Primary return path for I/O and supply currents; requires low-inductance PCB connection to minimize noise coupling
4 (V_CC)	Power supply	Single-supply rail for logic operation; bypass capacitor (0.1 μF) required within 3 mm of this pin
5 (Y)	Output	CMOS-compatible buffered output; drives loads up to ±24 mA; supports I_off shutdown when V_CC = 0

Key Features

Feature	Design Value
Schmitt-trigger input with programmable hysteresis	Enables reliable signal recovery from slow-rising or noisy sources like mechanical switches, thermistors, or long PCB traces
I_off partial power-down protection	Prevents destructive back-current flow when SN74LVC1G17MDBVREP is unpowered but connected to active bus lines
Extended temperature qualification (–55°C to 125°C)	Validated via HAST, temperature cycling, and bond intermetallic life testing - suitable for space-constrained military modules
NanoFree™ packaging	Die-as-package construction eliminates bond wires and mold compound; reduces parasitic inductance and thermal resistance
ESD robustness (2000-V HBM)	Withstands handling and board-level ESD events without latch-up or parametric shift - no external TVS required in most cases

Applications

Industrial Sensor Interface	Microcontroller GPIO Debouncing
Use Scenario: Conditioning analog-output sensor signals (e.g., RTD, potentiometer) before ADC sampling in PLC I/O modules. IC Role / Device Role / Timing Role: Schmitt-trigger buffer converts slow, noisy analog thresholds into clean digital edges for edge-triggered interrupt inputs. Use Value: 0.51–0.83 V hysteresis rejects >100 mV of common-mode noise on 24-V field wiring, eliminating software debounce overhead.	Use Scenario: Cleaning mechanical switch bounce on ARM Cortex-M reset or user-input lines in medical handheld devices. IC Role / Device Role / Timing Role: Single-buffer stage providing deterministic transition timing and noise immunity prior to MCU input capture. Use Value: 4.6 ns t_pd ensures sub-microsecond response to valid transitions while rejecting transients shorter than 50 ns.
Automotive Body Control Module	Hot-Swappable Backplane Signal Conditioning
Use Scenario: Level-shifting and noise filtering for door-lock actuator feedback signals in 12-V vehicle architectures. IC Role / Device Role / Timing Role: Buffer isolates MCU GPIO from inductive load transients while maintaining 5-V tolerance for legacy sensor compatibility. Use Value: ±24 mA drive capability directly sinks relay coil leakage current; –55°C to 125°C rating meets AEC-Q100 Grade 1 requirements.	Use Scenario: Signal integrity preservation on shared backplane lines between powered and unpowered card slots in telecom line cards. IC Role / Device Role / Timing Role: I_off-enabled buffer prevents current backflow when one slot powers down while adjacent slots remain active. Use Value: <10 μA I_off leakage eliminates cross-slot power coupling, enabling true hot-swap compliance without sequencer complexity.

Industrial Sensor Interface

Microcontroller GPIO Debouncing

Use Scenario: Conditioning analog-output sensor signals (e.g., RTD, potentiometer) before ADC sampling in PLC I/O modules.

IC Role / Device Role / Timing Role: Schmitt-trigger buffer converts slow, noisy analog thresholds into clean digital edges for edge-triggered interrupt inputs.

Use Value: 0.51–0.83 V hysteresis rejects >100 mV of common-mode noise on 24-V field wiring, eliminating software debounce overhead.

Use Scenario: Cleaning mechanical switch bounce on ARM Cortex-M reset or user-input lines in medical handheld devices.

IC Role / Device Role / Timing Role: Single-buffer stage providing deterministic transition timing and noise immunity prior to MCU input capture.

Use Value: 4.6 ns t_pd ensures sub-microsecond response to valid transitions while rejecting transients shorter than 50 ns.

Automotive Body Control Module

Hot-Swappable Backplane Signal Conditioning

Use Scenario: Level-shifting and noise filtering for door-lock actuator feedback signals in 12-V vehicle architectures.

IC Role / Device Role / Timing Role: Buffer isolates MCU GPIO from inductive load transients while maintaining 5-V tolerance for legacy sensor compatibility.

Use Value: ±24 mA drive capability directly sinks relay coil leakage current; –55°C to 125°C rating meets AEC-Q100 Grade 1 requirements.

Use Scenario: Signal integrity preservation on shared backplane lines between powered and unpowered card slots in telecom line cards.

IC Role / Device Role / Timing Role: I_off-enabled buffer prevents current backflow when one slot powers down while adjacent slots remain active.

Use Value: <10 μA I_off leakage eliminates cross-slot power coupling, enabling true hot-swap compliance without sequencer complexity.

Equivalent & Alternatives

The following parts are listed as comparable options for similar Schmitt-trigger buffer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74LVC1G17MDCKREP	Identical electrical specs; SC-70-5 (DCK) package - 2.0 mm × 1.25 mm, 1.1 mm height vs. DBV's 2.92 mm × 1.3 mm, 1.45 mm height	Better suited for ultra-dense layouts where footprint area is constrained more than height; same thermal performance due to NanoFree™ die-as-package	Select SN74LVC1G17MDCKREP only when board real estate is primary constraint and reflow profile accommodates smaller pad geometry.
SN74LVC1G17-Q1	Automotive-grade variant; identical functionality and pinout, but qualified to AEC-Q100 Grade 1 (–40°C to 125°C) with enhanced reliability testing and traceability	Required for production automotive ECUs; not intended for commercial/industrial use due to cost and qualification overhead	Choose SN74LVC1G17-Q1 exclusively for automotive OEM programs requiring PPAP documentation and zero-defect reliability targets.

Compared with SN74LVC1G17MDBVREP, SN74LVC1G17MDCKREP offers identical performance in a smaller footprint but requires tighter stencil design, while SN74LVC1G17-Q1 adds automotive qualification at higher cost and longer lead time - neither is pin-compatible drop-in replacement without layout revision due to differing package outlines.

Availability

SN74LVC1G17MDBVREP is available at Aetrix Electronics and suitable for industrial sensor interfaces, microcontroller GPIO conditioning, and automotive body control modules requiring stable component supply across extended temperature ranges and long product lifecycles.

Supply support for SN74LVC1G17MDBVREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in high-reliability IC design.

The SN74LVC1G17MDBVREP belongs to TI's LVC logic family - engineered for low-voltage, high-noise-immunity digital interfacing in harsh environments including aerospace, defense, and industrial automation.

FAQ

What is the maximum operating voltage for SN74LVC1G17MDBVREP?

The SN74LVC1G17MDBVREP supports a supply voltage range of 1.65 V to 5.5 V. Absolute maximum V_CC is 6.5 V, but operation above 5.5 V violates recommended conditions and risks parametric failure. At 5 V, it delivers ±32 mA output drive and maintains full hysteresis performance per datasheet Table 1.

Does SN74LVC1G17MDBVREP support 5-V tolerant inputs?

Yes, SN74LVC1G17MDBVREP accepts input voltages up to 5.5 V regardless of V_CC level - confirmed by VI absolute maximum rating and recommended operating conditions. This allows direct interfacing with 5-V legacy systems even when powered from 3.3-V or 2.5-V rails.

How does the I_off feature work in SN74LVC1G17MDBVREP?

The I_off circuitry in SN74LVC1G17MDBVREP automatically disables output drivers when V_CC = 0 V, limiting leakage current to <±10 μA even if input or output pins are biased to 5.5 V. This prevents damaging back-current flow in partial-power-down systems such as modular instrumentation racks.

What is the hysteresis voltage of SN74LVC1G17MDBVREP at 3.3 V supply?

At V_CC = 3.3 V, SN74LVC1G17MDBVREP exhibits VT+ = 1.48–1.92 V and VT– = 0.89–1.20 V, resulting in a hysteresis ΔV_T of 0.51–0.83 V. This value is measured across the full operating temperature range (–55°C to 125°C) and ensures consistent noise rejection in demanding environments.

Is SN74LVC1G17MDBVREP RoHS compliant and lead-free?

Yes, SN74LVC1G17MDBVREP is RoHS-compliant and uses NiPdAu (NIPDAU) lead finish. Its MSL rating is Level-1-260°C-UNLIM, and it ships in tape-and-reel packaging (3000 units per reel) with part marking "C170" - fully compatible with standard SMT assembly processes.

SN74LVC1G17MDBVREP Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74LVC

Package/Case:: SC-74A, SOT-753

Packaging:: Tape & Reel (TR)

Product Status:: Active

Logic Type:: Buffer, Non-Inverting

Number of Elements:: 1

Number of Bits per Element:: 1

Input Type:: Schmitt Trigger

Output Type:: Push-Pull

Current - Output High, Low:: 32mA, 32mA

Voltage - Supply:: 1.65V ~ 5.5V

Operating Temperature:: -55°C ~ 125°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: SOT-23-5

SN74LVC1G17MDBVREP FAQ

1.How can I place an order for SN74LVC1G17MDBVREP through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74LVC1G17MDBVREP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74LVC1G17MDBVREP reliable?

The price and inventory of SN74LVC1G17MDBVREP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC1G17MDBVREP is usually 5 days.

3.What payment methods are accepted for SN74LVC1G17MDBVREP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LVC1G17MDBVREP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SN74LVC1G17MDBVREP?

SN74LVC1G17MDBVREP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74LVC1G17MDBVREP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74LVC1G17MDBVREP?

For technical support, including SN74LVC1G17MDBVREP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC1G17MDBVREP requirements.

6.How does Aetrix verify that SN74LVC1G17MDBVREP is sourced from the original manufacturer or authorized distributors?

All SN74LVC1G17MDBVREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC1G17MDBVREP meets industry standards.

7.What is the process for return or replacement of SN74LVC1G17MDBVREP?

All SN74LVC1G17MDBVREP units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC1G17MDBVREP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74LVC1G17MDBVREP part is unused and in its original packaging.

Return procedure for SN74LVC1G17MDBVREP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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