Texas Instruments SN74LVC1G18YEAR

Overview

SN74LVC1G18YEAR from Texas Instruments is a 1-of-2 noninverting demultiplexer with 3-state deselected outputs, designed for 1.65-V to 5.5-V V_CC operation. It routes input data A to either Y0 or Y1 based on select input S, supports partial-power-down via I_off, delivers ±24-mA drive at 3.3 V, and achieves 3.4-ns max t_pd at 3.3 V - used in low-pin-count signal routing in portable logic and level-shifting interfaces.

For engineers reviewing the SN74LVC1G18YEAR datasheet, SN74LVC1G18YEAR pinout, SN74LVC1G18YEAR application, or SN74LVC1G18YEAR equivalent, key selection criteria include its WCSP YEA package (0.17-mm bump), 3-state output behavior during deselect, I_off support for power-gated systems, 5.5-V tolerant inputs, and compatibility with 1.65-V minimum supply rails in space-constrained designs.

Technical Context

This device implements a single-pole double-throw (SPDT) noninverting demux function using CMOS logic with rail-to-rail input voltage tolerance up to 5.5 V and output drive capability of ±24 mA at V_CC = 3.3 V. Its 3-state outputs are independently controlled by the S input, with no internal inversion between A and the selected output.

The SN74LVC1G18YEAR integrates I_off circuitry that disables both outputs when V_CC = 0 V, blocking current backflow and enabling safe partial-power-down operation. It meets JESD 78 Class II latch-up performance (>100 mA) and exceeds JESD 22 ESD ratings: 2000-V HBM, 200-V MM, and 1000-V CDM.

Key Specifications

Pinout & Package

SN74LVC1G18YEAR uses a 6-bump NanoStar™ WCSP (YEA) package with bottom-side terminals. Pin 1 is identified by solder-bump composition (SnPb); Pb-free variants use dot marking. Thermal resistance θ_JA = 143°C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 1-of-2 noninverting demultiplexer applications.

Compared with SN74LVC1G18YEAR, the DBVR offers superior thermal dissipation and assembly flexibility at the cost of 2.9× larger area, while the DCKR provides intermediate size and manufacturability - all three share identical functional behavior, timing, and I/O characteristics, differing only in package form factor and thermal performance.

Availability

SN74LVC1G18YEAR is available at Aetrix Electronics and suitable for portable sensor interfaces, low-power MCU peripheral multiplexing, and industrial I/O module signal conditioning requiring stable component supply across extended temperature ranges (–40°C to 85°C).

Supply support for SN74LVC1G18YEAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.

The SN74LVC1G18YEAR belongs to TI's LVC logic family, engineered for low-voltage, high-speed operation with mixed-voltage interoperability - specifically targeting space-constrained, battery-sensitive applications demanding minimal footprint and robust power sequencing.

FAQ

What is the maximum operating temperature range for SN74LVC1G18YEAR?

The SN74LVC1G18YEAR is rated for operation from –40°C to +85°C ambient temperature. This range is validated per JEDEC JESD78 latch-up testing and JESD22 ESD stress conditions, making it suitable for industrial and automotive cabin applications where thermal cycling occurs. The YEA package's 143°C/W θ_JA must be considered in layout to maintain junction temperature within limits.

Does SN74LVC1G18YEAR support level shifting between different supply voltages?

Yes, SN74LVC1G18YEAR supports level shifting: its inputs tolerate up to 5.5 V independent of V_CC, allowing 5-V signals to be safely applied while V_CC operates at 1.65 V–3.3 V. Outputs swing rail-to-rail (V_OH ≈ V_CC – 0.1 V, V_OL ≈ 0.1 V), enabling translation from low-V_CC domains to higher-voltage receivers without external components.

How does the I_off feature function in SN74LVC1G18YEAR?

In SN74LVC1G18YEAR, the I_off circuitry automatically disables both Y0 and Y1 outputs when V_CC = 0 V, limiting I/O leakage current to ±10 µA. This prevents back-current flow from live system buses into a powered-down section - essential for reliable power sequencing in multi-rail systems like USB-C PD controllers or modular IoT nodes where subsystems power up/down independently.

Can SN74LVC1G18YEAR be used in place of a mechanical switch for signal routing?

Yes, SN74LVC1G18YEAR replaces mechanical SPDT switches in electronic signal routing applications. With 3.4-ns propagation delay, ±24-mA drive, and guaranteed break-before-make behavior (both outputs high-Z during S transition), it delivers faster, more reliable, and wear-free switching than electromechanical alternatives - especially valuable in automated test equipment and programmable logic interfaces.

What is the significance of the "YEA" package code in SN74LVC1G18YEAR?

The "YEA" suffix in SN74LVC1G18YEAR identifies the NanoStar™ WCSP package variant with 0.17-mm SnPb solder bumps, 1.0 mm × 1.0 mm body size, and bottom-terminal layout. Pin 1 is marked by SnPb composition (vs. dot for Pb-free YZA). This package enables the smallest possible footprint among LVC1G18 variants, critical for ultra-thin wearables and implantable medical devices where PCB real estate is severely constrained.