Texas Instruments SN74LVC1G18YZAR

Overview

SN74LVC1G18YZAR from Texas Instruments is a 1-of-2 noninverting demultiplexer with 3-state deselected outputs, designed for 1.65-V to 5.5-V V_CC operation. It routes input data A to output Y0 or Y1 based on select input S, supports ±24-mA drive at 3.3 V, achieves 3.4 ns max t_pd at 3.3 V, and features I_off for partial-power-down mode - used in low-pin-count signal routing in portable logic and level-shifting interfaces.

For engineers reviewing the SN74LVC1G18YZAR datasheet, SN74LVC1G18YZAR pinout, SN74LVC1G18YZAR application, or SN74LVC1G18YZAR equivalent, key selection considerations include its NanoFree™ WCSP (YZA) 6-bump package, 3-state output behavior during deselect, V_I tolerance up to 5.5 V, and guaranteed I_off performance enabling safe bus sharing in mixed-voltage systems.

Technical Context

This device implements a single-pole double-throw (SPDT) noninverting demux function using CMOS logic with dual 3-state outputs. The select input S determines which output (Y0 or Y1) reflects the buffered A input, while the other output enters high-impedance state - no internal latching or clocking is involved.

Its I_off circuitry actively disables both outputs when V_CC = 0 V, blocking current backflow up to ±50 mA per pin. Input thresholds scale with V_CC (e.g., VIH = 0.7 × V_CC at 4.5–5.5 V), and output drive strength varies linearly with supply voltage across the full 1.65–5.5 V range.

Key Specifications

Pinout & Package

NanoFree™ WCSP (YZA) 6-bump die-size package (0.17-mm small bump, Pb-free), footprint-identical to YEA/YEP/YZP variants; no leadframe or mold compound - die serves as package.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 1-of-2 noninverting demultiplexer applications.

Compared with SN74LVC1G18YZAR, the DBVR and DCKR alternatives trade die-size miniaturization for assembly flexibility and supply-chain maturity - all three share identical functional behavior, I_off, and voltage tolerances, but only YZA delivers the smallest possible footprint for space-constrained wearables and hearing aids.

Availability

SN74LVC1G18YZAR is available at Aetrix Electronics and suitable for portable electronics, IoT edge nodes, and wearable medical devices requiring stable component supply and long-term lifecycle continuity.

Supply support for SN74LVC1G18YZAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions, with leadership in low-power logic, precision analog, and high-reliability interface products.

The SN74LVC1G18YZAR belongs to TI's LVC low-voltage CMOS logic family, engineered specifically for space-constrained, multi-rail digital systems requiring robust voltage translation, minimal power, and ultra-small packaging.

FAQ

What is the package type and dimensions of SN74LVC1G18YZAR?

SN74LVC1G18YZAR uses Texas Instruments' NanoFree™ WCSP (YZA) package - a 0.8 mm × 0.8 mm die-size ball grid array with six 0.17-mm solder bumps. It has no leadframe or encapsulant; the silicon die itself forms the mechanical and electrical interface. This package is optimized for ultra-compact PCB layouts in wearables and hearing aids, and requires specialized reflow and inspection processes due to its bump-based interconnect.

Does SN74LVC1G18YZAR support partial-power-down operation?

Yes, SN74LVC1G18YZAR fully supports partial-power-down operation via its I_off circuitry. When V_CC = 0 V, both outputs (Y0 and Y1) are actively disabled, limiting I_off to ±10 µA maximum. This prevents damaging current backflow from live I/O pins into a powered-down device - a critical feature for dynamic power gating in battery-operated systems and hot-plug interfaces.

Can SN74LVC1G18YZAR interface between 1.8-V and 5-V logic domains?

Yes, SN74LVC1G18YZAR enables seamless interfacing between 1.8-V and 5-V logic domains. Its inputs tolerate up to 5.5 V regardless of V_CC, and its outputs swing rail-to-rail (0 V to V_CC) with V_CC configurable from 1.65 V to 5.5 V. For example, with V_CC = 1.8 V, it accepts 5-V control signals on S and A while driving 1.8-V–compatible outputs - eliminating external level shifters in mixed-supply signal routing.

What is the maximum output drive capability of SN74LVC1G18YZAR at 3.3 V?

At V_CC = 3.3 V, SN74LVC1G18YZAR delivers ±24 mA output drive - 24 mA sink (I_OL) and –24 mA source (I_OH). This is verified per the datasheet's electrical characteristics table under "Recommended Operating Conditions" and supports direct driving of standard CMOS loads, LED indicators, and enable inputs of downstream ICs without external buffers - critical for minimizing component count in compact designs.

Is SN74LVC1G18YZAR pin-compatible with other variants in the SN74LVC1G18 family?

No, SN74LVC1G18YZAR is not pin-compatible with DBV (SOT-23) or DCK (SC-70) variants despite identical logic function and pin assignment order - its NanoFree™ YZA package uses a bottom-side bump layout with different mechanical footprint and solder joint geometry. While electrical pin roles (A, S, Y0, Y1, V_CC, GND) match, PCB land patterns, stencil design, and reflow profiles must be specific to the YZA package; migration requires full layout revision.