Texas Instruments SN74LVC1G18YZPR

Overview

SN74LVC1G18YZPR from Texas Instruments is a 1-of-2 noninverting demultiplexer with 3-state deselected outputs, designed for 1.65-V to 5.5-V V_CC operation. It routes input A to either Y0 or Y1 based on select input S (LOW → Y0, HIGH → Y1), features ±24-mA output drive at 3.3 V, 3.4-ns max propagation delay at 3.3 V, and I_off support for live insertion in data center switches and baseband units.

For engineers reviewing the SN74LVC1G18YZPR datasheet, SN74LVC1G18YZPR pinout, SN74LVC1G18YZPR application, or SN74LVC1G18YZPR equivalent, key selection criteria include its DSBGA-6 (1.39 mm × 0.89 mm) package, –40°C to +125°C operating range, 5.5-V overvoltage-tolerant inputs, 10-µA max ICC, and compatibility with 1.8-V/2.5-V/3.3-V/5-V logic systems.

Technical Context

This device implements a single-channel, noninverting 1:2 demux with independent 3-state control per output, enabled by the S input. Its balanced CMOS outputs support bidirectional current sourcing/sinking up to ±24 mA at 3.3 V while maintaining VOL ≤ 0.55 V and VOH ≥ 2.3 V under full load.

The I_off circuitry actively disables all I/O terminals during partial power-down, limiting leakage to ±10 µA when V_CC = 0 V and any input or output is biased to 5.5 V. Input tolerance extends to 5.5 V regardless of V_CC, enabling level translation from higher-voltage domains into 1.65–5.5-V logic rails.

Key Specifications

Pinout & Package

SN74LVC1G18YZPR uses a 6-pin DSBGA (Die Size Ball Grid Array) package measuring 1.39 mm × 0.89 mm with bottom-side ball terminations. The NanoFree™ construction eliminates traditional packaging materials, placing the silicon die directly in contact with the PCB for minimal footprint and thermal resistance (R_θJB = 38.9°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 1-of-2 noninverting demultiplexer applications.

Compared with SN74LVC1G18DCKR and SN74LVC1G18DRYR, SN74LVC1G18YZPR delivers the smallest footprint (1.39 mm × 0.89 mm) and lowest junction-to-board thermal resistance (38.9°C/W), making it optimal for thermally dense, space-constrained applications like active antenna systems and notebook PC motherboard layouts.

Availability

SN74LVC1G18YZPR is available at Aetrix Electronics and suitable for data center switch fabric cards, baseband unit calibration subsystems, and professional audio interface clock routing requiring stable component supply across extended temperature ranges and high-volume production cycles.

Supply support for SN74LVC1G18YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in precision analog, power management, and high-speed logic solutions.

The SN74LVC1G18YZPR belongs to TI's LVC low-voltage CMOS logic family, engineered for interoperability across 1.65–5.5-V supply domains and optimized for space-constrained, thermally demanding applications in communications infrastructure and industrial control.

FAQ

What is the maximum operating temperature for SN74LVC1G18YZPR?

The SN74LVC1G18YZPR is fully specified for operation from –40°C to +125°C ambient temperature. This rating is validated per JEDEC JESD22-A108 and applies across the full 1.65–5.5-V V_CC range. Thermal metrics including R_θJB = 38.9°C/W confirm suitability for placement near heat-generating components in baseband units and industrial monitors where localized board temperatures exceed 100°C.

Does SN74LVC1G18YZPR support level translation between different voltage domains?

Yes, SN74LVC1G18YZPR supports bidirectional level translation: inputs tolerate up to 5.5 V regardless of V_CC, enabling 5-V signals to drive the device when V_CC = 1.8 V or 2.5 V; outputs swing rail-to-rail (0 V to V_CC) and deliver ±24 mA at 3.3 V, allowing it to drive downstream 3.3-V or 5-V logic with appropriate pull-ups. This eliminates discrete level shifters in mixed-voltage notebook PC designs.

How does the I_off feature function in SN74LVC1G18YZPR?

In SN74LVC1G18YZPR, the I_off circuitry automatically places all inputs and outputs into high-impedance states when V_CC = 0 V, limiting leakage current to ±10 µA even if pins are biased to 5.5 V. This prevents damaging back-current flow during hot-swap events in data center switch line cards or partial power-down sequences in active antenna systems, satisfying JESD78 Class II latch-up immunity requirements.

What is the recommended bypass capacitor for SN74LVC1G18YZPR?

Texas Instruments specifies a 0.1-µF ceramic capacitor placed physically adjacent to the V_CC and GND balls of the SN74LVC1G18YZPR DSBGA package. This capacitor must be mounted with minimal trace length to reduce inductance, as outlined in TI's layout guidelines. For enhanced high-frequency noise rejection, a parallel 1-µF capacitor may be added, but the 0.1-µF unit remains mandatory for stable 3.4-ns switching performance.

Can unused inputs on SN74LVC1G18YZPR be left floating?

No, unused inputs on SN74LVC1G18YZPR must be terminated to either V_CC or GND using a direct connection or a pull-up/pull-down resistor (typically 10 kΩ). Floating CMOS inputs cause undefined logic states, increased ICC, and potential oscillation due to noise coupling - risks explicitly documented in TI's SCBA004 application report. In the SN74LVC1G18YZPR function table, both S and A are active inputs; no pins are designated as NC.