Texas Instruments SN74LVC1G19YZPR

Overview

SN74LVC1G19YZPR from Texas Instruments is a 1-of-2 decoder/demultiplexer IC operating from 1.65 V to 5.5 V, with active-low enable (E), single address input (A), and dual complementary outputs (Y0, Y1). It delivers ±24-mA output drive at 3.3 V, achieves 4 ns maximum propagation delay at 3.3 V, and consumes ≤10 µA ICC. It is used in portable audio docks and SSD power sequencing to route control signals between low-power subsystems.

For engineers reviewing the SN74LVC1G19YZPR datasheet, SN74LVC1G19YZPR pinout, SN74LVC1G19YZPR application, or SN74LVC1G19YZPR equivalent, key selection criteria include Ioff-enabled live insertion support, DSBGA-6 package footprint (1.41 mm × 0.91 mm), 5.5-V tolerant inputs, partial-power-down capability, and verified 1.65–5.5-V supply compatibility across industrial temperature range (–40°C to 85°C).

Technical Context

This device implements a combinational logic decoder function: when E is low, A selects either Y0 (A = L) or Y1 (A = H) to drive low; both outputs remain high when E is high. Its design integrates Ioff circuitry that disables outputs during power-off, preventing back-drive current and enabling hot-plug operation in mixed-voltage systems.

The SN74LVC1G19YZPR uses CMOS technology with balanced rise/fall times, supports down-translation (e.g., 5-V inputs into 1.8-V VCC), and features robust ESD protection (±2000-V HBM, ±1000-V CDM). Output ground bounce (VOLP < 0.8 V) and VOH undershoot (VOHV > 2 V) are characterized at 3.3 V and 25°C.

Key Specifications

Pinout & Package

SN74LVC1G19YZPR is housed in a 6-pin DSBGA (Die Size Ball Grid Array) package with bottom-side solder balls. The package measures 1.41 mm × 0.91 mm with 0.4-mm ball pitch and is marked "CY7" or "CYN" per TI orderable addendum.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 1-of-2 decoder/demultiplexer applications.

Compared with SN74LVC1G19YZPR, SN74LVC1G139YZPR offers functional density gain in identical form factor, while 74LVC1G19GW,125 trades Ioff safety and miniaturization for broader distributor availability - neither is pin-compatible, requiring layout revision.

Availability

SN74LVC1G19YZPR is available at Aetrix Electronics and suitable for AV receivers, SSD power sequencing, wireless headsets, and tablet peripheral control requiring stable component supply across industrial temperature range and long-term production continuity.

Supply support for SN74LVC1G19YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and logic solutions, with over 90 years of innovation in power management and signal chain technologies.

The SN74LVC1G19YZPR belongs to TI's LVC logic family designed for low-voltage, high-speed, mixed-supply interface applications in portable and industrial electronics where space, power, and reliability are critical.

FAQ

What is the function of the E (enable) input on the SN74LVC1G19YZPR?

The E input on the SN74LVC1G19YZPR is an active-low enable that globally controls output states. When E is high, both Y0 and Y1 are forced high regardless of A. When E is low, the A input selects which output goes low - Y0 for A = L, Y1 for A = H. This behavior is confirmed in the Function Table (Table 1) of the SCES464G datasheet and applies directly to the SN74LVC1G19YZPR variant.

Does the SN74LVC1G19YZPR support partial-power-down operation?

Yes, the SN74LVC1G19YZPR fully supports partial-power-down via its Ioff feature. When VCC = 0 V, the Ioff circuitry disables outputs to prevent damaging current backflow from live inputs or outputs. This is specified in the Features section and Electrical Characteristics table (Ioff ≤ 10 µA), and is validated for the YZP package per TI's characterization data.

What is the maximum propagation delay for SN74LVC1G19YZPR at 3.3 V supply?

The maximum propagation delay (tpd) for SN74LVC1G19YZPR is 4 ns at VCC = 3.3 V with CL = 15 pF, as specified in the Switching Characteristics table (Section 6.6) of the SCES464G datasheet. This value is measured from A or E input transition to corresponding Y output transition and applies to the SN74LVC1G19YZPR in its DSBGA-6 configuration.

Can SN74LVC1G19YZPR accept 5-V input signals while operating at 1.8 V VCC?

Yes, SN74LVC1G19YZPR accepts input voltages up to 5.5 V regardless of VCC level - a feature explicitly stated in the datasheet Features list and confirmed in Recommended Operating Conditions (VI = 0 to 5.5 V). This allows safe interfacing of 5-V control signals with 1.8-V core logic without external level translation.

What package type and dimensions does SN74LVC1G19YZPR use?

SN74LVC1G19YZPR uses the DSBGA-6 (YZP) package: a 6-ball, bottom-terminal die-size array measuring 1.41 mm × 0.91 mm with 0.4-mm ball pitch. Mechanical drawings and ordering information confirm this mapping in the "Device Information" table and Package Addendum of SCES464G, and it is distinct from DBV, DCK, DRL, and DRY variants.