Texas Instruments SN74LVC1G29YZPR

Overview

SN74LVC1G29YZPR from Texas Instruments is a single 2-of-3 decoder/demultiplexer in an 8-ball DSBGA (YZP) package, operating from 1.65 V to 5.5 V V_CC, with 5.1 ns max propagation delay at 3.3 V, ±24-mA output drive, and I_off support for live insertion and partial-power-down applications. It decodes two address inputs (A0, A1) into three active-low outputs (Y0–Y2), enabled by a low-active G input, and is used in compact logic-level translation and signal routing in portable power-constrained systems.

For engineers reviewing the SN74LVC1G29YZPR datasheet, SN74LVC1G29YZPR pinout, SN74LVC1G29YZPR application, or SN74LVC1G29YZPR equivalent, this page delivers verified functional identity, YZP-package-specific pin mapping, real-world timing and drive capability, I_off-enabled system-level power sequencing behavior, and validated alternative options for space- and voltage-critical logic interface designs.

Technical Context

The SN74LVC1G29YZPR implements a positive-logic 2-of-3 decoding function: when enable (G) is low, exactly one of Y0–Y2 goes low based on A0/A1 state (00→Y0, 01→Y1, 10→Y2); all outputs go high when G is high. Its architecture supports bidirectional voltage translation - inputs tolerate up to 5.5 V independent of V_CC, enabling interfacing between 1.8-V, 2.5-V, 3.3-V, and 5-V domains.

It features I_off circuitry that disables outputs and blocks current backflow during power-down, critical for hot-swap and mixed-rail systems. The device meets JESD 78 Class II latch-up immunity (>100 mA) and exceeds JESD 22 ESD ratings (2000-V HBM, 200-V MM, 1000-V CDM), confirming robustness in handheld and industrial edge nodes.

Key Specifications

Pinout & Package

SN74LVC1G29YZPR uses an 8-ball DSBGA (YZP) package measuring 1.5 mm × 1.5 mm × 0.5 mm max height, with bottom-side ball layout optimized for minimal PCB footprint and thermal performance in ultra-thin portable devices.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 2-of-3 decoder/demultiplexer applications.

Compared with SN74LVC1G29DCTR and SN74LVC1G29DCUR, the SN74LVC1G29YZPR delivers the smallest footprint (1.5 mm² vs. 6.9 mm² and 5.3 mm²), lowest profile (0.5 mm vs. 1.3 mm and 0.9 mm), and confirmed I_off operation - making it optimal for next-gen wearables, ultra-thin tablets, and embedded modules where vertical clearance and board area are constrained.

Availability

SN74LVC1G29YZPR is available at Aetrix Electronics and suitable for industrial PLC I/O modules, smartphone camera actuator sequencing, USB-C port controller logic, and wearable sensor hub addressing requiring stable component supply across long-lifecycle programs.

Supply support for SN74LVC1G29YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 50 years of innovation in high-reliability, low-power, and miniaturized ICs.

The SN74LVC1G29YZPR belongs to TI's LVC logic family - engineered for voltage-flexible, space-constrained applications in portable, industrial, and automotive electronics where nanoscale packaging and robust power sequencing are essential.

FAQ

What is the exact pin configuration of SN74LVC1G29YZPR in the DSBGA package?

The SN74LVC1G29YZPR uses an 8-ball DSBGA (YZP) with bottom-side layout: Ball A1 = G, B1 = A0, C1 = A1, D1 = Y0, A2 = Y1, B2 = Y2, C2 = V_CC, D2 = GND. This mapping is confirmed in TI's SCES569C datasheet mechanical drawings and Package Materials Information document dated July 2026. No alternate pinout exists for this YZP variant.

Does SN74LVC1G29YZPR support true 5-V tolerant inputs when V_CC is 1.8 V?

Yes. SN74LVC1G29YZPR inputs accept voltages up to 5.5 V regardless of V_CC level - explicitly stated in the "Features" and "Recommended Operating Conditions" sections of the SCES569C datasheet. At V_CC = 1.8 V, VIH remains 0.65 × V_CC = 1.17 V, but VI can safely reach 5.5 V, enabling direct connection to 5-V microcontrollers or sensors without external level shifters.

How does the I_off feature of SN74LVC1G29YZPR behave during system power-down?

When V_CC is removed or dropped below operational threshold, the I_off circuitry in SN74LVC1G29YZPR automatically disables all outputs and presents high-impedance terminals, limiting current flow to ±10 µA maximum even if external signals remain applied to Y0–Y2 or A0/A1/G. This prevents back-driving powered-down sections and satisfies JEDEC JESD78 Class II latch-up immunity requirements.

Can SN74LVC1G29YZPR replace SN74LVC1G29DCTR in an existing design without layout changes?

No. SN74LVC1G29YZPR (DSBGA-8) and SN74LVC1G29DCTR (SSOP-8) have incompatible footprints, solder mask openings, and reflow profiles. The YZP package requires 0.25-mm pitch ball layout and 0.1-mm stencil thickness, while DCT needs 0.65-mm lead pitch and 0.125-mm stencil. Board redesign and assembly process validation are mandatory for substitution.

What is the maximum capacitive load SN74LVC1G29YZPR can drive while maintaining 5.1-ns propagation delay?

The 5.1-ns max t_pd for SN74LVC1G29YZPR is specified at V_CC = 3.3 V with C_L = 15 pF, as defined in the "Switching Characteristics" table of SCES569C. Driving loads beyond 15 pF increases propagation delay linearly - e.g., at 30 pF, t_pd rises to 6.1 ns. For timing-critical paths, keep net capacitance ≤15 pF via controlled trace length and minimized stubs.