Texas Instruments SN74LVC244APW
- Part No.:
- SN74LVC244APW
- Manufacturer:
- Texas Instruments
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74LVC244APW.pdf
- Description:
- IC BUF NON-INVERT 3.6V 20TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,750
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Product details
Overview
SN74LVC244APW from Texas Instruments is an octal 3-state buffer/driver IC designed for asynchronous bus interfacing in 1.65V–3.6V systems. It features dual 4-bit banks, 5.9ns max propagation delay at 3.3V, 5.5V-tolerant inputs, and Ioff support for live insertion-used in server backplanes, LED display drivers, and telecom infrastructure signal routing.
For engineers reviewing the SN74LVC244APW datasheet, SN74LVC244APW pinout, SN74LVC244APW application, or SN74LVC244APW equivalent, this page delivers verified electrical specs, TSSOP-20 package details, real-world timing behavior, and validated alternatives for mixed-voltage bus translation and high-drive digital isolation.
Technical Context
The SN74LVC244APW implements two independent 4-bit noninverting buffers, each controlled by a dedicated output-enable (OE) input. Its CMOS architecture supports bidirectional voltage translation: 5.5V inputs are safely clamped and level-shifted to VCC (1.65V–3.6V), enabling interoperability between 5V legacy peripherals and 3.3V logic domains.
Each bank operates with balanced drive strength (±24mA at 3V), low ground bounce (<0.8V VOLP), and undershoot control (>2V VOHV). The Ioff feature disables all outputs when VCC = 0V, preventing back-drive current and supporting partial-power-down operation in hot-swap systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65V to 3.6V - Enables direct integration into modern low-voltage microcontroller and FPGA I/O rails without level-shifting circuitry. |
| Input Voltage Tolerance | Up to 5.5V - Allows safe connection to 5V buses or sensors without external protection diodes or resistors. |
| Max Propagation Delay | 5.9ns at 3.3V - Supports >100MHz data rates on short PCB traces, critical for high-speed peripheral enable/disable timing. |
| Output Drive Strength | ±24mA at 3V - Sustains clean signal integrity driving 50pF loads over 12cm traces, reducing need for external line drivers. |
| Ioff Current | ±20µA at 5.5V - Ensures zero-current back-drive during power sequencing, protecting powered-down subsystems in modular hardware. |
| Operating Temperature | –40°C to +125°C - Qualified for industrial and telecom infrastructure environments where thermal margin is critical. |
| ESD Rating | ±2000V HBM - Meets standard handling requirements for automated assembly and field-replaceable module integration. |
Pinout & Package
TSSOP-20 (PW) package: 6.50mm × 6.4mm body size, 0.65mm pitch, exposed thermal pad not present. Pin 1 marked via dot or bevel; pin 10 = GND, pin 20 = VCC.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A4, 2A1–2A4 | Input | Eight independent logic inputs grouped into two 4-bit banks; accept 0–5.5V signals regardless of VCC. |
| 1Y1–1Y4, 2Y1–2Y4 | 3-State Output | Noninverting buffered outputs; high-impedance when corresponding OE is high, enabling shared bus arbitration. |
| 1OE, 2OE | Active-Low Enable | Per-bank control: low = enabled (Y = A), high = high-Z; supports independent gating of two data channels. |
| VCC (Pin 20) | Power Supply | Primary supply for logic and output stages; must be bypassed with 0.1µF capacitor placed within 3mm. |
| GND (Pin 10) | Reference Ground | Common return path for all I/O and internal circuitry; requires low-inductance connection to system ground plane. |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode signal operation | Enables 5V inputs to interface directly with 3.3V VCC systems-eliminates discrete level shifters in I/O expander designs. |
| Ioff partial-power-down | Prevents current flow from powered inputs to unpowered VCC rail, allowing safe hot-plug insertion into live backplanes. |
| Low ground bounce (VOLP) | <0.8V at 3.3V/25°C ensures stable reference for adjacent sensitive analog or RF circuits sharing same PCB ground. |
| Controlled undershoot (VOHV) | >2V at 3.3V/25°C limits negative voltage excursions that could trigger false triggering in downstream Schmitt-trigger inputs. |
| Ultra-small footprint option | TSSOP-20 (6.5×6.4mm) provides 40% area reduction vs SOIC-20-ideal for space-constrained telecom modules and LED driver boards. |
Applications
| Server Backplane Buffers | LED Display Column Drivers |
|---|---|
|
Use Scenario: Isolating CPU memory controller address/data lines from hot-swappable PCIe riser cards. IC Role / Device Role / Timing Role: Octal buffer providing per-lane enable control and noise-isolated signal re-driving across mid-plane connectors. Use Value: 5.9ns tpd ensures setup/hold timing compliance at DDR4 speeds; Ioff prevents back-drive damage during card insertion/removal. |
Use Scenario: Driving 16-column segments of high-brightness outdoor LED signage using multiplexed scanning. IC Role / Device Role / Timing Role: High-current (±24mA) column driver enabling uniform brightness across 64×32 pixel arrays. Use Value: 5.5V-tolerant inputs accept 5V scan controller logic; balanced drive minimizes column-to-column intensity variation. |
| Telecom Line Card Interfaces | Industrial I/O Expander Modules |
|
Use Scenario: Interfacing FPGA-based packet processors with legacy 5V PHY transceivers in access switches. IC Role / Device Role / Timing Role: Voltage translator and bus isolator ensuring signal integrity across mixed-supply domains. Use Value: 1.65V–3.6V operation matches FPGA I/O banks; 5.5V input tolerance eliminates external clamp diodes. |
Use Scenario: Adding 8 programmable GPIOs to PLC mainboards via SPI/I²C port expanders. IC Role / Device Role / Timing Role: Output buffer stage translating low-drive MCU GPIOs to robust 24mA sink/source capability. Use Value: Dual OE pins allow independent enable/disable of two 4-bit groups-simplifies firmware-controlled peripheral power gating. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 74LVC244ABQ | Same logic function and specs, but in 20-pin X1QFN (3.3×2.5mm) - 35% smaller footprint than PW, no exposed pad. | Better suited for ultra-dense portable equipment; thermal resistance RθJA = 79.9°C/W vs PW's 120.3°C/W. | Select when board area is constrained and thermal load is light; verify solder paste volume for fine-pitch QFN reflow. |
| SN74LVCH244A | Includes bus-hold circuitry (no external pull-ups needed); otherwise identical VCC range, drive, and timing. | Reduces BOM count in systems with floating control lines (e.g., unpopulated expansion headers), but adds ~1.5pF input capacitance. | Choose when unused inputs may float during configuration; avoid if maximum speed at 3.3V is critical due to added capacitance. |
Compared with SN74LVC244APW, the 74LVC244ABQ saves board space with superior thermal performance in compact layouts, while SN74LVCH244A simplifies input termination at minor speed cost-both require layout review for mechanical fit and thermal management.
Availability
SN74LVC244APW is available at Aetrix Electronics and suitable for server backplanes, LED display drivers, and telecom infrastructure requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for SN74LVC244APW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions with over 50 years of innovation in high-reliability interface ICs.
The SN74LVC244APW belongs to TI's LVC logic family-designed specifically for low-voltage, high-speed bus buffering and mixed-signal interfacing in industrial, computing, and communications equipment.
FAQ
What is the maximum operating voltage on the inputs of the SN74LVC244APW?
The SN74LVC244APW inputs tolerate up to 5.5V regardless of VCC level, enabling direct connection to 5V logic sources without external protection. This specification is guaranteed across the full –40°C to +125°C ambient temperature range and applies to all eight input pins (1A1–1A4, 2A1–2A4) as confirmed in Section 5.3 of the official datasheet.
Does the SN74LVC244APW support hot-swap or live-insertion applications?
Yes, the SN74LVC244APW supports live insertion via its Ioff feature: when VCC = 0V, all outputs enter high-impedance state with leakage limited to ±20µA (Section 5.5), preventing back-drive current into unpowered subsystems. This behavior is explicitly validated for partial-power-down use cases in telecom and modular server architectures.
What is the recommended bypass capacitor for the SN74LVC244APW?
A 0.1µF ceramic capacitor is recommended for SN74LVC244APW, placed as close as possible (≤3mm) to the VCC pin (Pin 20) with a low-inductance path to GND (Pin 10). TI's layout guidelines (Section 8.4.1) specify this value to suppress high-frequency switching noise and maintain stable VCC during fast output transitions.
Can the SN74LVC244APW be used for level translation between 5V and 3.3V systems?
Yes-the SN74LVC244APW functions as a down-translator: 5.5V-tolerant inputs accept 5V signals while outputs swing between 0V and VCC (1.65V–3.6V), producing valid 3.3V logic levels when VCC = 3.3V. This capability is documented in Feature #9 and Section 7.3.3 of the datasheet.
What is the thermal resistance (RθJA) of the SN74LVC244APW in its TSSOP-20 package?
The SN74LVC244APW in PW (TSSOP-20) package has a junction-to-ambient thermal resistance (RθJA) of 120.3°C/W, measured under JEDEC JESD51-2 conditions. Derating begins above 60°C at 5.5mW/°C, as specified in Section 5.4 of the datasheet-critical for thermal design in enclosed telecom enclosures.
SN74LVC244APW Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tube
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-TSSOP
SN74LVC244APW FAQ
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For technical support, including SN74LVC244APW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC244APW requirements.
6.How does Aetrix verify that SN74LVC244APW is sourced from the original manufacturer or authorized distributors?
All SN74LVC244APW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC244APW meets industry standards.
7.What is the process for return or replacement of SN74LVC244APW?
All SN74LVC244APW units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC244APW, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC244APW part is unused and in its original packaging.
Return procedure for SN74LVC244APW:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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