Texas Instruments SN74LVC244APWG4
- Part No.:
- SN74LVC244APWG4
- Manufacturer:
- Texas Instruments
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74LVC244APWG4.pdf
- Description:
- IC BUF NON-INVERT 3.6V 20TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,486
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Product details
Overview
SN74LVC244APWG4 from Texas Instruments is an octal 3-state buffer/driver IC designed for asynchronous bus interfacing in 1.65V–3.6V systems. It features dual 4-bit banks, 5.9ns max propagation delay at 3.3V, 5.5V-tolerant inputs, and Ioff support for live insertion-used in server backplanes and LED display column drivers.
For engineers reviewing the SN74LVC244APWG4 datasheet, SN74LVC244APWG4 pinout, SN74LVC244APWG4 application, or SN74LVC244APWG4 equivalent, this page delivers verified electrical specs, package mapping to TSSOP-20, functional mode behavior, and real-world signal integrity guidance for high-speed digital interface design.
Technical Context
The SN74LVC244APWG4 implements two independent 4-bit noninverting buffers, each controlled by a dedicated output-enable (OE) input. Its CMOS architecture supports mixed-mode signaling: 5.5V inputs are safely translated down to VCC-level outputs without level shifters.
Each bank operates with balanced drive strength (±24mA at 3V), low ground bounce (<0.8V VOLP), and undershoot control (>2V VOHV). Ioff circuitry disables all outputs when VCC = 0V, enabling partial power-down and back-drive protection during hot-swap events.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65V to 3.6V - Enables direct integration into 1.8V/2.5V/3.3V logic domains without external regulators. |
| Input Voltage Tolerance | Up to 5.5V - Allows safe connection to legacy 5V buses or mixed-voltage subsystems without clamping diodes or resistors. |
| Max Propagation Delay | 5.9ns at 3.3V - Supports >100MHz data rates on short traces; critical for timing-critical bus buffering in telecom switches. |
| Output Drive Strength | ±24mA at VCC = 3V - Sustains fast edge rates into 50pF loads while maintaining signal integrity on PCB traces up to 12cm. |
| Operating Temperature | –40°C to +125°C - Qualified for industrial and automotive under-hood applications where thermal margin is essential. |
| Ioff Current | ±20µA at VCC = 0V - Prevents current leakage and bus contention during power sequencing or hot-plug operations. |
| ESD Rating | ±2000V HBM - Meets JEDEC JS-001 for robust handling in automated assembly and field service environments. |
Pinout & Package
Packaged in a 20-pin TSSOP (PW) with 6.50mm × 6.4mm body size and 4.40mm width excluding leads. Thermal performance: RθJA = 120.3°C/W, RθJC(bot) not specified.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A4, 2A1–2A4 | Input (8 total) | Noninverting data inputs for two independent 4-bit banks; accept 0–5.5V regardless of VCC. |
| 1Y1–1Y4, 2Y1–2Y4 | Output (8 total) | 3-state buffered outputs; high-impedance when corresponding OE is high; drive ±24mA at 3V. |
| 1OE, 2OE | Input (2) | Active-low enable controls for Bank 1 and Bank 2; tied to VCC via pull-up for power-up high-Z state. |
| VCC | Power | Primary supply (1.65–3.6V); requires local 0.1µF bypass capacitor placed adjacent to Pin 20. |
| GND | Ground | Reference return path for all signals and power; must connect to solid ground plane beneath package. |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode voltage translation | 5.5V-tolerant inputs operate with VCC as low as 1.65V-enables direct interfacing between 5V peripherals and 1.8V controllers without external translators. |
| Ioff partial-power-down | Outputs fully disable with zero current flow when VCC = 0V-supports hot-swap capability in modular server and telecom chassis designs. |
| Balanced CMOS 3-state outputs | Symmetric ±24mA drive at 3V ensures matched rise/fall times and minimizes ground bounce (<0.8V) and VOH undershoot (>2V). |
| Ultra-low static current | ICC ≤ 40µA over full temperature range-reduces system standby power in battery-backed I/O expanders and motor driver interfaces. |
| High noise immunity | VIL = 0.35×VCC (min), VIH = 0.65×VCC (max)-provides ≥30% noise margin across entire VCC range, improving reliability in electrically noisy industrial environments. |
Applications
| Server Backplane Buffering | LED Display Column Driver |
|---|---|
|
Use Scenario: Driving address/data lines across multi-slot backplanes with trace lengths >10 cm and capacitive loads up to 50 pF. IC Role / Device Role / Timing Role: Noninverting buffer providing gain, isolation, and edge sharpening between CPU/memory controller and peripheral slots. Use Value: 5.9ns tpd and ±24mA drive maintain signal integrity without external termination, reducing BOM count and layout complexity. |
Use Scenario: Controlling 8 parallel LED columns in outdoor signage with 12-bit grayscale PWM timing. IC Role / Device Role / Timing Role: High-current sink/source buffer translating microcontroller GPIO outputs to LED driver inputs. Use Value: 5.5V-tolerant inputs accept 5V PWM signals directly; Ioff prevents ghosting during power cycling of display modules. |
| Industrial I/O Expander Interface | Network Switch Control Bus |
|
Use Scenario: Isolating and strengthening control signals between FPGA-based I/O manager and relay/solenoid drivers. IC Role / Device Role / Timing Role: Bidirectional bus buffer enabling hot-pluggable module detection and status reporting via shared control bus. Use Value: –40°C to +125°C rating and ±20µA Ioff ensure reliable operation in uncontrolled cabinet environments with frequent power cycling. |
Use Scenario: Buffering configuration and status signals between switch ASIC and management MCU across 6-layer PCB. IC Role / Device Role / Timing Role: Low-skew, 3-state buffer preventing bus contention during firmware updates and link renegotiation. Use Value: Dual OE pins allow independent bank control for staggered initialization; tsk(o) <1.5ns prevents inter-bank timing skew. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVCH244A | Includes bus-hold circuitry on all inputs; higher ICC (100µA typical); same VCC range and pinout. | Preferred where unused inputs may float (e.g., modular connectors); adds ~0.5ns tpd penalty. | Select SN74LVCH244A only if bus-hold functionality is required to eliminate external pull-ups on unterminated lines. |
| 74LVC244ABQ | Identical logic and specs but in 20-pin DHVQFN (RGY) package; 4.5mm × 3.5mm body; no exposed thermal pad. | Better thermal resistance (RθJA = 82.8°C/W) and smaller footprint-ideal for space-constrained embedded controllers. | Choose 74LVC244ABQ when board area is constrained and thermal performance outweighs TSSOP's ease of rework. |
Compared with SN74LVC244APWG4, SN74LVCH244A adds input bus-hold at the cost of higher static current and slightly slower timing, while 74LVC244ABQ offers superior thermal performance and miniaturization in a QFN package-neither is pin-compatible without PCB redesign.
Availability
SN74LVC244APWG4 is available at Aetrix Electronics and suitable for server backplanes, LED display drivers, industrial I/O expanders, network switch control buses, and motor driver interfaces requiring stable component supply across extended temperature ranges.
Supply support for SN74LVC244APWG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.
The SN74LVC244APWG4 belongs to TI's LVC logic family-designed specifically for low-voltage, high-speed, mixed-signal interfacing in space- and power-constrained systems where voltage translation and hot-swap resilience are critical.
FAQ
What is the maximum operating voltage on the inputs of the SN74LVC244APWG4?
The SN74LVC244APWG4 inputs tolerate up to 5.5V regardless of VCC level, enabling direct connection to 5V logic or legacy peripherals without level-shifting components. This specification is guaranteed across the full operating temperature range (–40°C to +125°C) and is validated per TI's absolute maximum ratings table.
Does the SN74LVC244APWG4 support hot-swap or live-insertion applications?
Yes-the SN74LVC244APWG4 includes Ioff circuitry that disables all outputs and limits leakage to ±20µA when VCC = 0V. This prevents back-driving and bus contention during hot-plug events in modular servers and telecom line cards, satisfying JESD78 latch-up immunity requirements (>250mA).
What is the recommended bypass capacitor for the SN74LVC244APWG4?
A 0.1µF ceramic capacitor is recommended for the SN74LVC244APWG4 and must be placed as close as possible to Pin 20 (VCC) with a low-inductance path to Pin 10 (GND). For improved high-frequency noise rejection, a parallel 1µF capacitor may be added-but the 0.1µF device remains mandatory per TI layout guidelines.
Can the SN74LVC244APWG4 drive long PCB traces without signal degradation?
The SN74LVC244APWG4 can reliably drive traces up to 12cm with 50pF load and maintain <10% overshoot/undershoot, provided source termination (e.g., 22Ω–33Ω series resistor near output) is used. Layout best practices-including unbroken ground plane and 8–12mil trace width-are required to avoid ringing above 100MHz.
What is the function of the two OE pins on the SN74LVC244APWG4?
The SN74LVC244APWG4 has two independent active-low output-enable pins: 1OE controls Y1–Y4 (Bank 1), and 2OE controls Y5–Y8 (Bank 2). When an OE pin is low, its four outputs follow their respective A inputs; when high, those outputs enter high-impedance state-enabling bidirectional bus sharing and dynamic bank isolation.
SN74LVC244APWG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tube
- Product Status:
- Discontinued at Digi-Key
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-TSSOP
SN74LVC244APWG4 FAQ
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6.How does Aetrix verify that SN74LVC244APWG4 is sourced from the original manufacturer or authorized distributors?
All SN74LVC244APWG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC244APWG4 meets industry standards.
7.What is the process for return or replacement of SN74LVC244APWG4?
All SN74LVC244APWG4 units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC244APWG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC244APWG4 part is unused and in its original packaging.
Return procedure for SN74LVC244APWG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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