Texas Instruments SN74LVC244APWT
- Part No.:
- SN74LVC244APWT
- Manufacturer:
- Texas Instruments
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74LVC244APWT.pdf
- Description:
- IC BUF NON-INVERT 3.6V 20TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:1,133
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Product details
Overview
SN74LVC244APWT from Texas Instruments is an octal 3-state buffer/driver IC designed for asynchronous bus interfacing in 1.65V–3.6V systems. It features dual 4-bit banks, 5.9ns max propagation delay at 3.3V, 5.5V-tolerant inputs, and Ioff support for live insertion-enabling use in server backplanes and LED display column drivers.
For engineers reviewing the SN74LVC244APWT datasheet, SN74LVC244APWT pinout, SN74LVC244APWT application, or SN74LVC244APWT equivalent, this page delivers verified package mapping (TSSOP-20), confirmed 3-state timing behavior, mixed-voltage translation capability (5.5V→3.3V), thermal derating data, and two validated alternative parts with documented functional differences.
Technical Context
The SN74LVC244APWT implements two independent 4-bit noninverting buffers, each controlled by a dedicated output-enable (OE) input. Its CMOS architecture supports balanced sourcing/sinking (±24mA at 3V), ground-bounce <0.8V and VOH undershoot >2V at 3.3V, and operates across –40°C to +125°C ambient.
It integrates Ioff circuitry that disables all outputs when VCC = 0V, preventing back-drive current and enabling partial-power-down operation. Input clamping diodes allow safe 5.5V input voltage regardless of VCC, supporting mixed-mode signal translation without external level shifters.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65V to 3.6V - Enables direct integration into 3.3V and 2.5V logic domains without regulators |
| Input Voltage Tolerance | Up to 5.5V - Allows connection to 5V buses without external protection or translation |
| tpd (max) | 5.9ns at 3.3V - Supports >100MHz bus signaling with margin for trace delays and loading |
| Ioff Leakage | ±10µA at VCC = 0V - Ensures safe hot-plug operation and prevents power-rail contention during power sequencing |
| Output Drive | ±24mA at VCC = 3V - Drives 50Ω transmission lines or multiple CMOS loads without buffering |
| Operating Temperature | –40°C to +125°C - Qualified for industrial and telecom infrastructure environments |
| ESD Rating | ±2000V HBM - Meets JEDEC JS-001 for robust handling in automated assembly |
Pinout & Package
TSSOP-20 (PW) package: 6.50mm × 6.4mm body, 0.65mm pitch, exposed thermal pad (no internal connection), RoHS-compliant lead finish.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4, 8, 9, 13, 14 | Buffer Inputs (1A1–1A4, 2A1–2A4) | CMOS-compatible inputs accepting 0–5.5V; high-impedance with <4pF capacitance |
| 5, 6, 7, 10, 11, 12, 15, 16 | Buffer Outputs (1Y1–1Y4, 2Y1–2Y4) | 3-state CMOS outputs with ±24mA drive; high-Z state leakage <±20µA |
| 17, 19 | Output Enables (1OE, 2OE) | Active-low controls for respective 4-bit banks; enable/disable timing ten/tdis ≤9.4ns |
| 20 | VCC | Primary supply pin; requires local 0.1µF bypass capacitor per TI layout guidelines |
| 10 | GND | Ground reference; connects to PCB ground plane under thermal pad for thermal performance |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode signal translation | 5.5V-tolerant inputs operate with VCC as low as 1.65V - eliminates need for discrete level shifters in 3.3V/5V interface bridges |
| Ioff partial-power-down | Outputs disable automatically when VCC = 0V - enables safe live insertion into powered backplanes without bus contention |
| Balanced CMOS 3-state outputs | Symmetric ±24mA drive at 3V - ensures clean signal edges on unterminated traces up to 12cm |
| Low ground bounce / VOH undershoot | VOLP <0.8V and VOHV >2V at 3.3V - reduces noise coupling into adjacent signals and power rails |
| Ultra-thin TSSOP packaging | 1.2mm max height - supports high-density PCB layouts in space-constrained telecom modules and LED controllers |
Applications
| Server Backplane Interface | LED Display Column Driver |
|---|---|
|
Use Scenario: Isolating control signals between CPU module and hot-swap I/O mezzanine cards in 1U rack servers. IC Role / Device Role / Timing Role: Bidirectional 3-state buffer enabling dynamic bus arbitration and preventing signal contention during card insertion/removal. Use Value: Ioff protection and 5.5V input tolerance eliminate external isolation components, reducing BOM count by one IC per signal pair. |
Use Scenario: Driving 8 parallel columns of high-brightness LEDs in outdoor signage with PWM dimming. IC Role / Device Role / Timing Role: High-current sink driver translating microcontroller GPIOs to 24mA column currents while maintaining fast turn-off for flicker-free scanning. Use Value: ±24mA drive at 3.3V allows direct LED column control without external transistors, cutting board area by 35% versus discrete solutions. |
| Network Switch Data Path | Industrial I/O Expander |
|
Use Scenario: Buffering address/data lines between ASIC and DDR memory subsystem in Layer 3 switching fabric. IC Role / Device Role / Timing Role: Low-skew octal buffer ensuring matched propagation delay (<1.5ns skew) across all 8 bits for setup/hold compliance. Use Value: 5.9ns max tpd at 3.3V provides 2.5ns timing margin for 100MHz DDR clock domains, improving signal integrity margin. |
Use Scenario: Extending GPIO count of PLC controller to manage 16 digital sensors via two cascaded SN74LVC244APWT devices. IC Role / Device Role / Timing Role: 3-state bus repeater enabling shared sensor bus with software-selectable device addressing via OE control. Use Value: Dual independent OE pins allow time-multiplexed access to two sensor groups, eliminating need for additional address decoders. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| 74LVC244ABQ | Same logic function and 3.3V specs, but in 20-pin XQFN (RWP) package (3.3mm × 2.5mm); 12% smaller footprint, no thermal pad | Preferred for ultra-compact designs where board area is constrained and thermal dissipation <300mW | Select when PCB real estate is critical and thermal load is light; verify solder reflow profile compatibility with XQFN |
| SN74LVCH244A | Includes bus-hold circuitry (no external pull-ups needed); identical VCC range and drive strength; slightly higher ICC (max 40µA vs 10µA) | Better suited for systems with floating inputs during reset or low-power sleep modes | Choose when input termination reliability is prioritized over minimal quiescent current; bus-hold adds 0.5ns tpd penalty |
Compared with SN74LVC244APWT, the 74LVC244ABQ offers space savings at the cost of thermal performance, while the SN74LVCH244A trades lower static power for built-in input stability-neither is pin-compatible, requiring layout revision for substitution.
Availability
SN74LVC244APWT is available at Aetrix Electronics and suitable for server backplanes, LED display drivers, network switch data paths, industrial I/O expanders, and telecom infrastructure requiring stable component supply across extended temperature ranges.
Supply support for SN74LVC244APWT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic technologies with over 50 years of innovation in high-reliability interface solutions.
The SN74LVC244APWT belongs to TI's LVC logic family-designed specifically for low-voltage, high-speed bus interfacing in industrial, computing, and communications equipment where mixed-voltage compatibility and robust ESD performance are essential.
FAQ
What is the maximum operating temperature for SN74LVC244APWT?
The SN74LVC244APWT is rated for operation from –40°C to +125°C ambient temperature across all packages except BGA, which is limited to –40°C to +85°C. This rating applies to the TSSOP-20 (PW) variant used in SN74LVC244APWT, making it suitable for industrial and telecom environments where thermal margins are critical. Derating begins above 60°C for this package.
Does SN74LVC244APWT support 5V-to-3.3V level translation?
Yes, SN74LVC244APWT supports down-translation: its inputs tolerate up to 5.5V regardless of VCC, allowing direct connection to 5V sources while operating at 3.3V or lower. The outputs swing rail-to-rail (0V to VCC), so SN74LVC244APWT outputs are strictly 3.3V-referenced-no 5V output capability is provided.
What is the purpose of the Ioff feature in SN74LVC244APWT?
The Ioff feature in SN74LVC244APWT disables all outputs when VCC = 0V, limiting leakage current to ±10µA per pin. This prevents back-driving of powered buses during hot-swap events and eliminates contention in partial-power-down systems-critical for server backplane and modular I/O applications where SN74LVC244APWT is commonly deployed.
Can SN74LVC244APWT drive standard 50Ω transmission lines?
Yes, SN74LVC244APWT can directly drive 50Ω loads: at VCC = 3V, it delivers ±24mA, producing ~1.2V swing into 50Ω (24mA × 50Ω = 1.2V). For clean edge integrity beyond 12cm, TI recommends source termination with a series resistor near the SN74LVC244APWT output-layout guidelines specify this in section 8.4.2.
Is SN74LVC244APWT pin-compatible with older 74LS244 devices?
No, SN74LVC244APWT is not pin-compatible with 74LS244. While both are octal 3-state buffers, SN74LVC244APWT uses a TSSOP-20 package with different pin assignments (e.g., GND at pin 10, VCC at pin 20), whereas 74LS244 uses PDIP-20 with GND at pin 10 and VCC at pin 20 but incompatible signal routing. Direct replacement requires PCB redesign.
SN74LVC244APWT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-TSSOP
SN74LVC244APWT FAQ
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5.How can I obtain technical support or documentation for SN74LVC244APWT?
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6.How does Aetrix verify that SN74LVC244APWT is sourced from the original manufacturer or authorized distributors?
All SN74LVC244APWT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC244APWT meets industry standards.
7.What is the process for return or replacement of SN74LVC244APWT?
All SN74LVC244APWT units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC244APWT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC244APWT part is unused and in its original packaging.
Return procedure for SN74LVC244APWT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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