My Inquiry
My Account
Texas Instruments SN74LVC244APWTE4
- Part No.:
- SN74LVC244APWTE4
- Manufacturer:
- Texas Instruments
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74LVC244APWTE4.pdf
- Description:
- IC BUF NON-INVERT 3.6V 20TSSOP
- Quantity:
- Payment:
- Shipping:
Inventory:4,732
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SN74LVC244APWTE4 from Texas Instruments is an octal 3-state buffer/driver IC designed for asynchronous bus interfacing in 1.65V–3.6V systems. It features dual 4-bit banks, 5.9ns max propagation delay at 3.3V, 5.5V-tolerant inputs, and Ioff support for live insertion-used in server backplanes, LED display drivers, and telecom infrastructure signal routing.
For engineers reviewing the SN74LVC244APWTE4 datasheet, SN74LVC244APWTE4 pinout, SN74LVC244APWTE4 application, or SN74LVC244APWTE4 equivalent, this page delivers verified electrical specs, TSSOP-20 package mapping, real-world timing behavior, and validated alternatives for mixed-voltage bus translation and high-drive signal buffering.
Technical Context
The SN74LVC244APWTE4 implements two independent 4-bit noninverting buffers (xYn = xAn), each controlled by a dedicated output-enable input (1OE, 2OE). Its CMOS architecture supports bidirectional voltage translation: 5.5V inputs are safely clamped and level-shifted to VCC-level outputs without external components.
Each bank operates with balanced drive strength (±24mA at 3V), low ground bounce (<0.8V VOLP), and undershoot control (>2V VOHV). The Ioff feature disables all outputs during partial power-down, preventing back-drive current and enabling hot-swap capability in modular systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65V to 3.6V - Enables direct integration into 1.8V/2.5V/3.3V logic domains without level shifters. |
| Input Voltage Tolerance | Up to 5.5V - Allows safe interfacing with legacy 5V peripherals while powered from 3.3V rails. |
| Max Propagation Delay | 5.9ns at 3.3V - Supports >100MHz data rates on short PCB traces with minimal timing margin loss. |
| Output Drive Strength | ±24mA at VCC = 3V - Drives 50Ω transmission lines or multiple CMOS loads without external buffers. |
| Operating Temperature | –40°C to +125°C - Qualified for industrial and telecom infrastructure environments with extended thermal margins. |
| Ioff Current | ±20µA at VCC = 0V - Ensures zero-current leakage during live insertion or system sleep states. |
| ESD Rating | ±2000V HBM - Meets JEDEC JS-001 for robust handling in automated assembly and field service. |
Pinout & Package
TSSOP-20 (PW) package: 6.50mm × 6.4mm body, 0.65mm pitch, exposed thermal pad optional, RoHS-compliant lead finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A4, 2A1–2A4 | Input (I) | Eight buffered data inputs grouped into two 4-bit banks; accept 0–5.5V signals regardless of VCC. |
| 1Y1–1Y4, 2Y1–2Y4 | Output (O) | Eight 3-state outputs; high-impedance when corresponding OE is high; drive strength scales with VCC. |
| 1OE, 2OE | Input (I) | Active-low enable controls for Bank 1 and Bank 2; tied high via pull-up for power-up high-Z safety. |
| VCC | Power | Single supply pin for logic core and I/O; bypass with 0.1µF capacitor placed adjacent to pin 20. |
| GND | Ground | Common reference for all I/O and internal circuitry; connects to solid ground plane under thermal pad. |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode signal operation | Enables 5V-to-3.3V down-translation without external resistors or translators-reduces BOM count and layout area. |
| Low ground bounce (VOLP) | <0.8V at VCC = 3.3V ensures clean logic thresholds and reduces false triggering in noise-sensitive receivers. |
| Fast enable/disable timing | 7.6ns max tdis and 9.4ns max ten at 3.3V allows rapid bus arbitration and dynamic channel switching in multiplexed systems. |
| Thermal performance | RθJA = 120.3°C/W in TSSOP-20 enables 500mW operation up to +60°C ambient before derating begins. |
| Latch-up immunity | Exceeds 250mA per JESD17 - prevents destructive latch-up during transient overvoltage or ESD events. |
Applications
| Server Backplane Buffering | LED Display Column Driver |
|---|---|
|
Use Scenario: Isolating CPU/memory address/data buses from hot-pluggable I/O modules in 1U rack servers. IC Role / Device Role / Timing Role: Octal buffer providing direction-controlled, 3-state isolation between upstream controller and downstream PCIe/SATA expansion slots. Use Value: Ioff protection prevents back-drive damage during module insertion; 5.5V-tolerant inputs interface directly with legacy management controllers. |
Use Scenario: Driving 8 parallel columns of high-brightness LED arrays in indoor signage with PWM dimming. IC Role / Device Role / Timing Role: High-current sink driver translating microcontroller GPIO outputs to 24mA column currents at 3.3V logic levels. Use Value: ±24mA drive strength eliminates need for discrete transistor arrays; fast 5.9ns tpd supports >5kHz PWM without edge distortion. |
| Network Switch Data Path | Industrial I/O Expander Interface |
|
Use Scenario: Level-shifting and buffering between 3.3V FPGA MAC cores and 5V PHY transceivers in Gigabit Ethernet switches. IC Role / Device Role / Timing Role: Dual-bank buffer performing simultaneous 5V→3.3V input translation and 3.3V→5V-compatible output driving. Use Value: Input tolerance to 5.5V and rail-to-rail output swing ensure interoperability across mixed-voltage subsystems without added logic. |
Use Scenario: Extending GPIO count of PLC main controllers to manage relay banks, sensor inputs, and status indicators. IC Role / Device Role / Timing Role: Bidirectional bus isolator enabling read-back of switch states and write-control of indicator LEDs via shared 8-bit data lines. Use Value: Independent 1OE/2OE pins allow time-multiplexed access to two I/O groups; high-Z state prevents contention during firmware updates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC244ADWRE4 | SOIC-20 package (12.8mm × 10.3mm); RθJA = 114.8°C/W; no thermal pad; higher thermal resistance. | Better suited for through-hole prototyping or legacy board rework where TSSOP footprint is unavailable. | Select when mechanical compatibility with existing SOIC footprints is required; verify thermal margin at full load. |
| 74LVC244ABQ-Q100 | AEC-Q100 Grade 2 qualified (–40°C to +105°C); identical logic and pinout; automotive-grade screening and traceability. | Required for automotive infotainment head units or ADAS domain controllers needing automotive qualification. | Choose for automotive production programs; not drop-in for industrial use due to different qualification scope and cost structure. |
Compared with SN74LVC244APWTE4, the SOIC variant offers easier hand-soldering but sacrifices thermal performance and board space efficiency, while the AEC-Q100 version adds automotive reliability overhead without functional change-making the TSSOP version optimal for cost-sensitive, space-constrained industrial designs.
Availability
SN74LVC244APWTE4 is available at Aetrix Electronics and suitable for server backplanes, LED display drivers, and network switch data paths requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across manufacturing lots.
Supply support for SN74LVC244APWTE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions with over 50 years of innovation in high-reliability interface ICs.
The SN74LVC244APWTE4 belongs to TI's LVC logic family-designed specifically for low-voltage, high-speed bus interfacing in mixed-signal systems where voltage translation, low power, and robust ESD performance are critical.
FAQ
What is the maximum input voltage the SN74LVC244APWTE4 can tolerate?
The SN74LVC244APWTE4 accepts input voltages up to 5.5V regardless of VCC level-enabling direct connection to 5V logic sources while operating from 1.65V–3.6V supplies. This overvoltage tolerance is achieved via internal clamp diodes and is specified in the Recommended Operating Conditions table; exceeding 5.5V risks permanent damage per Absolute Maximum Ratings.
Does the SN74LVC244APWTE4 support hot-swap or live insertion?
Yes, the SN74LVC244APWTE4 supports live insertion via its Ioff feature: when VCC = 0V, all outputs enter high-impedance mode with leakage current limited to ±20µA. This prevents back-driving powered circuitry during board replacement-critical for modular telecom and server systems. Pull-up resistors on OE pins further ensure power-up safety.
What is the recommended bypass capacitor for the SN74LVC244APWTE4?
A 0.1µF ceramic capacitor is recommended for bypassing VCC on the SN74LVC244APWTE4, placed as close as possible to pin 20 (VCC) with a low-inductance path to GND (pin 10). For improved noise suppression, TI recommends paralleling with a 1µF capacitor. Layout guidelines specify using wide traces and an unbroken ground plane beneath the device.
Can the SN74LVC244APWTE4 be used for level translation between 5V and 3.3V systems?
Yes-the SN74LVC244APWTE4 functions as a down-translator: 5.5V-tolerant inputs allow 5V signals to be safely driven into the device while VCC = 3.3V, producing 3.3V-compatible outputs. It does not translate 3.3V outputs to 5V-output swing is rail-to-rail within VCC, so external pull-ups are needed for true 5V logic levels.
What is the thermal resistance (RθJA) of the SN74LVC244APWTE4 in its TSSOP-20 package?
The SN74LVC244APWTE4 in PW (TSSOP-20) package has an RθJA of 120.3°C/W. Power dissipation must be limited to 500mW below 60°C ambient; above that, it derates linearly at 5.5mW/°C. This value assumes standard JEDEC 2-layer board conditions-actual performance improves with thermal vias and copper pour under the thermal pad.
SN74LVC244APWTE4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-TSSOP
SN74LVC244APWTE4 FAQ
1.How can I place an order for SN74LVC244APWTE4 through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC244APWTE4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC244APWTE4 reliable?
The price and inventory of SN74LVC244APWTE4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC244APWTE4 is usually 5 days.
3.What payment methods are accepted for SN74LVC244APWTE4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LVC244APWTE4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74LVC244APWTE4?
SN74LVC244APWTE4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74LVC244APWTE4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC244APWTE4?
For technical support, including SN74LVC244APWTE4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC244APWTE4 requirements.
6.How does Aetrix verify that SN74LVC244APWTE4 is sourced from the original manufacturer or authorized distributors?
All SN74LVC244APWTE4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC244APWTE4 meets industry standards.
7.What is the process for return or replacement of SN74LVC244APWTE4?
All SN74LVC244APWTE4 units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC244APWTE4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC244APWTE4 part is unused and in its original packaging.
Return procedure for SN74LVC244APWTE4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SN74LVC244APWTE4 Tags
-
SN74LVC1G17DBVR
Texas Instruments
-
SN74LVC1G07DCKR
Texas Instruments
-
SN74LVC1G17DCKR
Texas Instruments
-
SN74LVC1G07DBVR
Texas Instruments
-
SN74LVC1G125DCKR
Texas Instruments
-
SN74AHCT1G126DBVR
Texas Instruments
-
SN74LVC1G125DBVR
Texas Instruments
-
SN74AHCT1G125DBVR
Texas Instruments
-
SN74LVC2G17DBVR
Texas Instruments
-
SN74LVC2G07DCKR
Texas Instruments
-
SN74LVC1G34DCKR
Texas Instruments
-
SN74LVC2G17DCKR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
