Texas Instruments SN74LVC244APWTG4
- Part No.:
- SN74LVC244APWTG4
- Manufacturer:
- Texas Instruments
- Package:
- 20-TSSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74LVC244APWTG4.pdf
- Description:
- IC BUF NON-INVERT 3.6V 20TSSOP
- Quantity:
- Payment:

- Shipping:

Inventory:4,180
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Product details
Overview
SN74LVC244APWTG4 from Texas Instruments is an octal 3-state buffer/driver IC designed for asynchronous bus interfacing in 1.65V–3.6V systems. It features dual 4-bit banks, 5.9ns max propagation delay at 3.3V, 5.5V-tolerant inputs, and Ioff support for live insertion-used in server backplanes, LED display controllers, and telecom switch fabric interfaces.
For engineers reviewing the SN74LVC244APWTG4 datasheet, SN74LVC244APWTG4 pinout, SN74LVC244APWTG4 application, or SN74LVC244APWTG4 equivalent, this page delivers verified electrical specs, TSSOP-20 package details, real-world timing behavior, and validated alternatives for mixed-voltage signal translation and high-drive bus buffering.
Technical Context
The SN74LVC244APWTG4 implements two independent 4-bit noninverting buffers, each controlled by a dedicated output-enable (OE) input. Its CMOS architecture supports bidirectional voltage translation: 5.5V inputs are safely clamped and level-shifted to VCC-referenced outputs, enabling interoperability between 5V legacy peripherals and 3.3V system controllers.
Each bank operates with balanced drive strength (±24mA at 3V), low ground bounce (<0.8V VOLP), and undershoot control (>2V VOHV). The Ioff feature disables all outputs when VCC = 0V, preventing back-drive current and supporting partial-power-down modes in hot-swap applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65V to 3.6V - Enables direct integration into modern low-voltage logic domains without level-shifter overhead. |
| Input Voltage Tolerance | Up to 5.5V - Allows safe connection to 5V signals without external protection diodes or resistors. |
| Max Propagation Delay | 5.9ns at 3.3V - Supports >100MHz data rates on short PCB traces in server I/O and network switch control paths. |
| Output Drive Strength | ±24mA at 3V - Sustains clean signal integrity driving 50Ω transmission lines or multiple CMOS loads. |
| Ioff Current | ±20µA at 5.5V - Ensures zero back-drive current during power sequencing, critical for hot-plug compliance. |
| Operating Temperature | –40°C to +125°C - Qualified for industrial and telecom infrastructure environments with extended thermal margins. |
| ESD Rating (HBM) | ±2000V - Meets JEDEC JS-001 for robust handling in automated assembly and field service. |
Pinout & Package
TSSOP-20 (PW) package: 6.50mm × 6.4mm body, 0.65mm pitch, exposed thermal pad optional, RoHS-compliant lead finish.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A4, 2A1–2A4 | Input (8 total) | Noninverting data inputs for two independent 4-bit banks; accept 0–5.5V regardless of VCC. |
| 1Y1–1Y4, 2Y1–2Y4 | Output (8 total) | 3-state buffered outputs; high-impedance when corresponding OE is high; drive ±24mA at 3V. |
| 1OE, 2OE | Input (2) | Active-low enable controls for Bank 1 and Bank 2; both must be low for output assertion. |
| VCC | Power | 1.65V–3.6V supply; bypass with 0.1µF capacitor placed adjacent to Pin 20 for noise suppression. |
| GND | Ground | Reference return path for all I/O and internal logic; connect to solid ground plane under thermal pad area. |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode signal operation | Enables 5V-to-3.3V down-translation on all ports without external components-critical for legacy peripheral integration. |
| Ioff partial-power-down | Prevents current flow from powered I/Os into unpowered VCC rails, satisfying hot-swap safety requirements in modular systems. |
| Balanced CMOS 3-state outputs | Symmetric sourcing/sinking capability (±24mA) ensures matched rise/fall times and reduces EMI in high-speed routing. |
| Low ground bounce (VOLP) | <0.8V at 3.3V/25°C - Minimizes switching noise coupling into shared ground planes in dense digital boards. |
| Ultra-small TSSOP footprint | 6.5mm × 6.4mm body size - Saves board space in space-constrained telecom modules and embedded controllers. |
Applications
| Server Backplane Interface | LED Display Column Driver |
|---|---|
|
Use Scenario: Buffering address/data lines between CPU module and PCIe expansion slots in rack-mounted servers. IC Role / Device Role / Timing Role: Octal noninverting buffer with 3-state control isolates hot-swappable cards and prevents bus contention during insertion/removal. Use Value: 5.9ns tpd ensures setup/hold timing margins for 100MHz parallel buses; Ioff eliminates back-drive risk during partial power-down. |
Use Scenario: Driving 8-column segments of large-format outdoor LED displays using multiplexed scanning. IC Role / Device Role / Timing Role: High-current buffer translating microcontroller GPIO outputs to column sink drivers with precise timing alignment. Use Value: ±24mA drive strength sustains brightness across long traces; 5.5V input tolerance accommodates 5V scan controller logic. |
| Network Switch Control Plane | Industrial I/O Expander Interface |
|
Use Scenario: Isolating management interface signals (I²C, SPI, GPIO) between baseboard controller and line-card processors. IC Role / Device Role / Timing Role: Dual-bank 3-state buffer enables bidirectional signal routing and dynamic bus sharing among multiple ASICs. Use Value: Independent OE pins allow time-multiplexed access to shared control buses; –40°C to +125°C rating supports fanless chassis operation. |
Use Scenario: Interfacing FPGA-based I/O expanders to legacy 5V sensor/actuator subsystems in factory automation PLCs. IC Role / Device Role / Timing Role: Level-translating buffer converting 3.3V FPGA outputs to 5V-compatible control signals while maintaining noise immunity. Use Value: Input overvoltage tolerance eliminates external level shifters; low VOLP minimizes false triggering in noisy industrial environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC244ADW | SOIC-20 package (12.8mm × 10.3mm); higher RθJA (114.8°C/W); no thermal pad. | Preferred for through-hole prototyping or legacy board rework where TSSOP reflow is unavailable. | Select when manual soldering, thermal derating above 70°C is acceptable, and board space is not constrained. |
| 74LVC244ABQ | Nexperia VQFN-20 (4.5mm × 2.5mm); lower RθJA (87.2°C/W); requires thermal pad soldering. | Better suited for thermally demanding, space-limited applications like 5G small-cell baseband modules. | Choose for improved thermal performance and smaller footprint, provided PCB supports QFN reflow and thermal pad attachment. |
Compared with SN74LVC244APWTG4, the SOIC alternative trades compactness for ease of hand-soldering and thermal margin, while the VQFN alternative improves thermal efficiency and size but demands stricter process control-both require layout review for signal integrity and decoupling.
Availability
SN74LVC244APWTG4 is available at Aetrix Electronics and suitable for server backplane design, LED display manufacturing, and telecom infrastructure development requiring stable component supply and long-term production continuity.
Supply support for SN74LVC244APWTG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions with over 50 years of innovation in high-reliability interface ICs.
The SN74LVC244A product line delivers robust, low-voltage octal buffers for mixed-signal system interconnect-designed specifically for industrial, telecom, and computing applications demanding voltage translation, hot-swap resilience, and fast timing.
FAQ
What is the maximum operating temperature range for the SN74LVC244APWTG4?
The SN74LVC244APWTG4 is rated for operation from –40°C to +125°C across all packages including the TSSOP-20 variant. This specification applies to ambient temperature (TA) and is validated per JEDEC JESD22-A108, making SN74LVC244APWTG4 suitable for under-hood automotive modules, industrial motor drives, and telecom base station equipment where extended thermal margins are required.
Does the SN74LVC244APWTG4 support 5V input signals while powered at 3.3V?
Yes, the SN74LVC244APWTG4 supports 5.5V-tolerant inputs across its full VCC range (1.65V–3.6V). When powered at 3.3V, it safely accepts 0–5.5V input voltages without damage or external clamping-enabling direct connection to 5V microcontrollers, sensors, or legacy peripherals in mixed-voltage systems without level-shifting circuitry.
How does the Ioff feature function in the SN74LVC244APWTG4?
The Ioff feature in SN74LVC244APWTG4 disables all outputs when VCC = 0V, limiting leakage current to ±20µA even if input or output pins are driven to 5.5V. This prevents back-drive current from powered sections into unpowered rails-essential for live insertion in modular servers, hot-swap power supplies, and redundant control systems where partial power-down occurs.
What is the recommended bypass capacitor for the SN74LVC244APWTG4?
A 0.1µF ceramic capacitor is recommended for bypassing the VCC pin of SN74LVC244APWTG4. Place it within 2mm of Pin 20 (VCC) and connect directly to the nearest GND pin (Pin 10) using a short, wide trace. For enhanced noise suppression in high-frequency environments, pair it with a 1µF capacitor in parallel-both must reference the same solid ground plane beneath the TSSOP-20 footprint.
Can the SN74LVC244APWTG4 be used as a level translator between 5V and 3.3V logic domains?
Yes, the SN74LVC244APWTG4 functions as a unidirectional down-translator: 5V inputs are safely clamped and translated to 3.3V-referenced outputs when VCC = 3.3V. It does not support bidirectional translation or 3.3V-to-5V up-translation. For true bidirectional level shifting, a dedicated translator such as TXB0108 is required-but SN74LVC244APWTG4 suffices for one-way control signal bridging in many industrial and telecom designs.
SN74LVC244APWTG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 20-TSSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-TSSOP
SN74LVC244APWTG4 FAQ
1.How can I place an order for SN74LVC244APWTG4 through Aetrix?
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6.How does Aetrix verify that SN74LVC244APWTG4 is sourced from the original manufacturer or authorized distributors?
All SN74LVC244APWTG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC244APWTG4 meets industry standards.
7.What is the process for return or replacement of SN74LVC244APWTG4?
All SN74LVC244APWTG4 units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC244APWTG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC244APWTG4 part is unused and in its original packaging.
Return procedure for SN74LVC244APWTG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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