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Texas Instruments SN74LVC244ARWPR
- Part No.:
- SN74LVC244ARWPR
- Manufacturer:
- Texas Instruments
- Package:
- 20-XFQFN Exposed Pad
- Datasheet:
-
SN74LVC244ARWPR.pdf
- Description:
- IC BUF NON-INVERT 3.6V 20X1QFN
- Quantity:
- Payment:
- Shipping:
Inventory:6,110
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Product details
Overview
SN74LVC244ARWPR from Texas Instruments is an octal non-inverting 3-state buffer/driver IC designed for asynchronous bus interfacing in 1.65V–3.6V systems. It features dual 4-bit banks, 5.9ns max propagation delay at 3.3V, 5.5V-tolerant inputs, and Ioff support for live insertion-used in server backplanes, LED display controllers, and telecom switch fabric buffering.
For engineers reviewing the SN74LVC244ARWPR datasheet, SN74LVC244ARWPR pinout, SN74LVC244ARWPR application, or SN74LVC244ARWPR equivalent, this page delivers verified electrical specs, package-validated pin functions, real-world interface use cases, and two confirmed alternative parts with documented functional and application-level differences.
Technical Context
The SN74LVC244ARWPR implements two independent 4-bit CMOS buffer banks, each controlled by a dedicated output-enable (OE) input. Its balanced 3-state outputs drive high/low with matched sourcing/sinking capability up to ±24mA at 3V, enabling clean signal transmission across PCB traces up to 12cm without termination.
It supports mixed-voltage operation: 5.5V-tolerant inputs allow connection to legacy 5V logic while powered from 3.3V or lower, and Ioff protection disables all outputs during partial power-down-preventing back-drive current when VCC = 0V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65V to 3.6V - Enables direct integration into modern low-voltage digital subsystems without level-shifting. |
| Input Voltage Tolerance | Up to 5.5V - Allows safe interfacing with 5V peripherals or legacy buses without external clamping. |
| Max Propagation Delay | 5.9ns at 3.3V - Supports >100MHz bus timing margins for high-speed data transfer between controllers and peripherals. |
| Output Drive Strength | ±24mA at 3V - Sustains robust signal integrity driving 50pF loads over 12cm PCB traces per TI layout guidelines. |
| Operating Temperature | –40°C to +125°C - Qualified for industrial and automotive under-hood applications where ambient thermal stress exceeds 85°C. |
| Ioff Leakage | ±20µA at 5.5V - Ensures <100nA total off-state current per bank during hot-swap or partial-power-down sequences. |
| ESD Rating | ±2000V HBM - Meets JEDEC JS-001 for handling in standard ESD-controlled assembly environments. |
Pinout & Package
RWP package: 20-pin X1QFN, 3.30mm × 2.50mm body, 0.4mm pitch, exposed thermal pad. Designed for space-constrained PCB layouts requiring high I/O density and thermal efficiency.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A1–1A4, 2A1–2A4 | Input (8 total) | Non-inverting data inputs for two independent 4-bit banks; accept 0–5.5V regardless of VCC. |
| 1Y1–1Y4, 2Y1–2Y4 | 3-State Output (8 total) | Buffered, high-drive outputs placed in high-impedance state when corresponding OE is high. |
| 1OE, 2OE | Active-Low Enable (2) | Each controls one 4-bit bank; low enables outputs, high forces high-Z-supports independent bus gating. |
| VCC | Power Supply | 1.65V–3.6V supply for core logic and output drivers; requires local 0.1µF bypass capacitor. |
| GND | Ground Reference | Common return path for all signals and power; must connect directly to solid ground plane beneath thermal pad. |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode voltage translation | Accepts 5.5V inputs while operating at 1.65V–3.6V VCC-enables direct 5V-to-3.3V down-translation without external circuitry. |
| Ioff partial-power-down | Outputs fully disable with near-zero leakage (<20µA) when VCC = 0V-critical for hot-pluggable modules and system-level power sequencing. |
| Balanced CMOS 3-state outputs | Sources and sinks up to ±24mA symmetrically-reduces skew between rising/falling edges and simplifies termination design. |
| Ultra-small X1QFN footprint | 3.3mm × 2.5mm body with 0.4mm pitch-reduces board area by >60% vs. TSSOP while improving thermal resistance (RθJA = 79.9°C/W). |
| Controlled edge rate | Propagation delay variation ≤1.5ns (tsk(o)) across outputs-minimizes inter-channel skew in parallel bus applications. |
Applications
| Server Backplane Buffering | LED Display Column Driver |
|---|---|
Use Scenario: Isolating CPU memory controller from high-capacitance DDR address/command bus routed across multi-layer backplane. IC Role / Device Role / Timing Role: Octal buffer providing gain, noise immunity, and 3-state isolation between master and slave segments. Use Value: 5.9ns tpd ensures setup/hold timing compliance at 200MT/s; Ioff prevents data corruption during hot-swap of daughter cards. |
Use Scenario: Driving 16×8 LED matrix columns where microcontroller GPIOs lack sufficient sink current. IC Role / Device Role / Timing Role: Current-boosting buffer translating MCU logic levels to drive 20mA per column segment. Use Value: ±24mA drive at 3.3V eliminates need for discrete transistors; 5.5V-tolerant inputs tolerate open-collector feedback signals. |
| Telecom Switch Fabric Interface | Industrial I/O Expander |
Use Scenario: Interfacing FPGA-based packet scheduler to multiple PHY devices on shared control bus with varying voltage domains. IC Role / Device Role / Timing Role: Dual-bank buffer enabling independent enable/disable of PHY configuration registers and status readback paths. Use Value: Separate 1OE/2OE pins allow time-multiplexed access without bus contention; –40°C to +125°C rating suits fanless chassis. |
Use Scenario: Extending PLC digital input/output count using SPI-to-parallel bridge with local signal conditioning. IC Role / Device Role / Timing Role: Level-translating buffer isolating 24V field-side sensors from 3.3V logic domain while providing ESD robustness. Use Value: ±2000V HBM withstands industrial ESD events; Ioff protects bridge IC during field wiring maintenance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC244APWR | TSSOP-20 package (6.5mm × 6.4mm), RθJA = 120.3°C/W, no thermal pad - higher thermal resistance and larger footprint. | Preferred for manual soldering or prototyping where X1QFN reflow is unavailable; unsuitable for >85°C ambient without derating. | Select SN74LVC244APWR only if board assembly lacks fine-pitch QFN capability or thermal requirements are ≤85°C. |
| 74LVC244ABQ,118 | NXP VQFN-20 (4.5mm × 2.5mm), RθJA = 87.2°C/W, same pinout but different thermal pad layout - not mechanically interchangeable. | Valid for cost-sensitive industrial designs where TI part availability is constrained; requires PCB redesign for thermal pad alignment. | Choose 74LVC244ABQ,118 only after validating thermal performance with revised land pattern and confirming pin compatibility per NXP datasheet. |
Compared with SN74LVC244APWR and 74LVC244ABQ,118, the SN74LVC244ARWPR offers the smallest footprint (3.3mm × 2.5mm), lowest thermal resistance (79.9°C/W), and native TI-recommended layout for high-reliability automated assembly-making it optimal for space- and thermally constrained embedded systems.
Availability
SN74LVC244ARWPR is available at Aetrix Electronics and suitable for server backplanes, LED display controllers, telecom switch fabric, industrial I/O expanders, and FPGA peripheral interfaces requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for SN74LVC244ARWPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog and embedded processing solutions, with over 50 years of innovation in logic, power management, and signal chain technologies.
The SN74LVC244ARWPR belongs to TI's LVC (Low-Voltage CMOS) logic family-designed specifically for high-speed, low-power, mixed-voltage interfacing in space-constrained industrial, computing, and communications equipment.
FAQ
What is the maximum operating temperature for SN74LVC244ARWPR?
The SN74LVC244ARWPR is rated for operation from –40°C to +125°C across all packages including RWP. This specification applies to the ambient temperature (TA) range, and thermal derating is not required up to +125°C for the X1QFN package due to its optimized thermal resistance of 79.9°C/W.
Does SN74LVC244ARWPR support 5V input signals while powered at 3.3V?
Yes, SN74LVC244ARWPR accepts input voltages up to 5.5V independent of VCC level. When powered at 3.3V, its inputs remain fully 5V-tolerant-enabling seamless down-translation from legacy 5V logic without external level shifters or clamping diodes.
How does the Ioff feature function in SN74LVC244ARWPR?
The Ioff circuitry in SN74LVC244ARWPR disables all outputs and limits leakage to ±20µA when VCC = 0V, regardless of input or output voltage. This prevents back-drive current during hot-insertion, partial power-down, or system maintenance-protecting upstream drivers and ensuring bus stability.
What is the recommended bypass capacitor for SN74LVC244ARWPR?
Texas Instruments specifies a 0.1µF ceramic capacitor placed as close as possible to the VCC pin of SN74LVC244ARWPR, with a low-inductance connection to the exposed thermal pad ground. For enhanced noise suppression, a parallel 1µF capacitor is acceptable-but placement proximity remains critical for high-frequency decoupling efficacy.
Can SN74LVC244ARWPR drive a 50pF load with controlled signal integrity?
Yes, SN74LVC244ARWPR drives 50pF loads with ≤5.9ns propagation delay at 3.3V and exhibits ≤1.5ns output skew (tsk(o)). TI's layout guidelines recommend source termination with a series damping resistor for traces >12cm-ensuring clean edges and minimal ringing in high-speed bus applications.
SN74LVC244ARWPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 20-XFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-X1QFN (3.3x2.5)
SN74LVC244ARWPR FAQ
1.How can I place an order for SN74LVC244ARWPR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC244ARWPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC244ARWPR reliable?
The price and inventory of SN74LVC244ARWPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC244ARWPR is usually 5 days.
3.What payment methods are accepted for SN74LVC244ARWPR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LVC244ARWPR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74LVC244ARWPR?
SN74LVC244ARWPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74LVC244ARWPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC244ARWPR?
For technical support, including SN74LVC244ARWPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC244ARWPR requirements.
6.How does Aetrix verify that SN74LVC244ARWPR is sourced from the original manufacturer or authorized distributors?
All SN74LVC244ARWPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC244ARWPR meets industry standards.
7.What is the process for return or replacement of SN74LVC244ARWPR?
All SN74LVC244ARWPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC244ARWPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC244ARWPR part is unused and in its original packaging.
Return procedure for SN74LVC244ARWPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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