Texas Instruments SN74LVC2G04YZPR

Overview

SN74LVC2G04YZPR from Texas Instruments is a dual CMOS inverter gate operating from 1.65 V to 5.5 V, delivering ±24 mA output drive at 3.3 V, 4.1 ns max propagation delay at 3.3 V, and 10 µA max ICC. It performs Boolean inversion (Y = A) for signal polarity reversal in level-shifting and logic buffering applications within telecom baseband units and optical networking interfaces.

For engineers reviewing the SN74LVC2G04YZPR datasheet, SN74LVC2G04YZPR pinout, SN74LVC2G04YZPR application, or SN74LVC2G04YZPR equivalent, key selection criteria include overvoltage-tolerant inputs (up to 5.5 V), Ioff-enabled partial-power-down operation, DSBGA-6 package footprint (1.41 mm × 0.91 mm), and guaranteed performance across –40°C to +125°C.

Technical Context

This device implements two independent, unbuffered CMOS inverters with rail-to-rail input voltage tolerance (–0.5 V to 6.5 V) and output swing limited only by VCC and GND. Its Ioff circuitry actively disables outputs during power-down, preventing backflow current when VCC = 0 V.

The SN74LVC2G04YZPR uses NanoFree™ packaging-where the silicon die serves as the package-enabling ultra-compact board placement. Its balanced push-pull output stage supports bidirectional current sourcing/sinking up to ±32 mA at 4.5 V, with ground bounce <0.8 V and undershoot >2 V at 3.3 V.

Key Specifications

Pinout & Package

SN74LVC2G04YZPR is housed in a 6-ball DSBGA (YZP) package measuring 1.41 mm × 0.91 mm with 0.4 mm ball pitch. The package uses bottom-side solder balls and requires standard reflow profile (MSL Level-1, 260°C peak).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual inverter applications.

Compared with SN74LVC2G04DCKR and SN74LVC2G04DBVR, the SN74LVC2G04YZPR offers the smallest footprint and lowest thermal resistance-critical for fanless optical modules and compact RRUs-while maintaining identical logic behavior and Ioff functionality.

Availability

SN74LVC2G04YZPR is available at Aetrix Electronics and suitable for telecom baseband units, optical networking equipment, IP phones, and power distribution units requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for SN74LVC2G04YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and logic solutions for industrial, automotive, and communications markets.

The SN74LVC2G04YZPR belongs to TI's LVC logic family, engineered for low-voltage, high-speed operation in space- and power-constrained telecom infrastructure and optical interconnect systems.

FAQ

What is the maximum input voltage the SN74LVC2G04YZPR can tolerate?

The SN74LVC2G04YZPR accepts input voltages from –0.5 V to 5.5 V regardless of VCC level. This overvoltage tolerance enables direct interfacing with higher-voltage logic families (e.g., 5 V) while operating from 1.8 V or 3.3 V supplies-eliminating external level shifters in mixed-voltage systems like EPON optical line terminals.

Does the SN74LVC2G04YZPR support partial-power-down operation?

Yes, the SN74LVC2G04YZPR incorporates Ioff circuitry that disables both outputs when VCC = 0 V, limiting Ioff current to ±10 µA max. This feature prevents damaging current backflow in hot-swap scenarios and ensures safe operation during power sequencing in telecom DC/DC modules and remote radio units.

What is the typical propagation delay of the SN74LVC2G04YZPR at 3.3 V?

The SN74LVC2G04YZPR has a maximum propagation delay (tpd) of 4.1 ns at VCC = 3.3 V, TA = 25°C, with CL = 50 pF. This value is guaranteed across –40°C to +125°C, making it suitable for timing-critical functions such as clock inversion and control signal conditioning in baseband processing units.

How does the NanoFree™ package of the SN74LVC2G04YZPR benefit PCB layout?

The NanoFree™ DSBGA package of the SN74LVC2G04YZPR measures just 1.41 mm × 0.91 mm, reducing board area by >50% versus SC70 and >70% versus SOT-23 variants. Its die-as-package construction minimizes parasitic inductance, improving signal integrity in high-frequency telecom interfaces while enabling routing under the device in dense RF layouts.

Can unused inputs on the SN74LVC2G04YZPR be left floating?

No-unused inputs on the SN74LVC2G04YZPR must be tied to VCC or GND to prevent undefined logic states and increased power consumption. Floating CMOS inputs cause shoot-through current and potential oscillation; TI recommends connecting them directly to supply rails using short traces, especially in high-noise telecom environments.