Texas Instruments SN74LVC2G07DSF2

Overview

SN74LVC2G07DSF2 from Texas Instruments is a dual open-drain buffer IC designed for level translation and wired-OR logic implementation in 1.65-V to 5.5-V systems. It features two independent open-drain outputs capable of sinking up to 32 mA at 4.5 V, supports 5.5-V tolerant inputs, and delivers 3.7 ns max propagation delay at 3.3 V - enabling use in high-speed I²C bus buffering, LED driving, and mixed-voltage interface isolation.

For engineers reviewing the SN74LVC2G07DSF2 datasheet, SN74LVC2G07DSF2 pinout, SN74LVC2G07DSF2 application, or SN74LVC2G07DSF2 equivalent, key selection criteria include verified open-drain sink current (32 mA), input voltage tolerance (up to 5.5 V), partial-power-down support via Ioff, and compatibility with DSF (1.00 mm × 1.00 mm) SON packaging for space-constrained PCB layouts.

Technical Context

The SN74LVC2G07DSF2 implements two non-inverting open-drain buffers with independent inputs (1A, 2A) and outputs (1Y, 2Y). Its Ioff circuitry actively disables outputs during power-down, preventing back-drive current and supporting live insertion in hot-swap systems. Each output requires an external pull-up resistor to define the high logic level, enabling bidirectional voltage translation between disparate supply domains.

Electrical behavior is characterized by rail-to-rail input tolerance (VI = 0–5.5 V), low ICC (≤10 µA), and robust ESD protection (2000-V HBM, 1000-V CDM). The device operates across –40°C to +125°C and maintains VOL ≤0.55 V at IOL = 32 mA (VCC = 4.5 V), ensuring reliable low-state signaling under heavy load.

Key Specifications

Pinout & Package

SN74LVC2G07DSF2 uses the DSF package: a 6-pin, 1.00 mm × 1.00 mm SON (Small Outline No-Lead) with wettable flanks, optimized for automated optical inspection and high-density routing. Pin 1 is located at the bottom-left corner (Q3 quadrant per tape specification).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar open-drain buffer applications.

Compared with SN74LVC1G07DSF2, the SN74LVC2G07DSF2 provides dual independent channels in the same ultra-small DSF footprint - essential for space-constrained I²C expansion or dual-interrupt systems. Versus NC7SZ07P5X, it adds 5.5-V input tolerance and 2× sink current, enabling robust mixed-voltage interfacing without redesign.

Availability

SN74LVC2G07DSF2 is available at Aetrix Electronics and suitable for industrial sensor interfaces, USB-C power delivery control, embedded SSD power sequencing, and automotive infotainment I²C expansion requiring stable component supply and long-term lifecycle support.

Supply support for SN74LVC2G07DSF2 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability silicon solutions.

The SN74LVC2G07DSF2 belongs to TI's LVC logic family - engineered for low-voltage, high-speed, mixed-signal interface applications demanding robust level translation, low power, and small-form-factor packaging.

FAQ

What is the maximum sink current supported by SN74LVC2G07DSF2 at 3.3 V?

The SN74LVC2G07DSF2 supports a maximum sink current of 24 mA at VCC = 3.3 V while maintaining VOL ≤ 0.55 V. This rating is specified in the Electrical Characteristics table (IOL test condition at VCC = 3.3 V) and validated across –40°C to +125°C. Exceeding this current may cause VOL to rise above logic-low thresholds in downstream receivers.

Does SN74LVC2G07DSF2 support level translation between 1.8-V and 5-V domains?

Yes, SN74LVC2G07DSF2 supports bidirectional level translation: its inputs tolerate up to 5.5 V regardless of VCC, and its open-drain outputs rely on external pull-ups referenced to the target domain voltage. For example, with VCC = 1.8 V and a 5-V pull-up on 1Y, the device can translate a 1.8-V MCU output into a 5-V compatible signal - confirmed in the "Support Translation-Up and Down" feature list and VI specification.

What is the purpose of Ioff in SN74LVC2G07DSF2, and how does it function?

Ioff in SN74LVC2G07DSF2 disables output drivers when VCC = 0 V, limiting off-state current to ±10 µA max. This prevents damaging back-current flow from live buses into a powered-down device - critical for hot-swap, partial-power-down, and battery-backed systems. The feature is fully specified in the Recommended Operating Conditions and Electrical Characteristics tables, and functions independently per channel.

Can SN74LVC2G07DSF2 be used in wired-AND configurations?

Yes, SN74LVC2G07DSF2 is explicitly designed for wired-AND (and wired-OR) logic: its open-drain outputs allow multiple devices to share a common bus line with a single pull-up resistor. When any output is low, the bus goes low; the bus floats high only when all outputs are in Hi-Z. This behavior is documented in the Functional Description and Application sections of the datasheet, with electrical validation up to 32 mA total sink.

What is the thermal resistance (RθJA) of SN74LVC2G07DSF2 in its DSF package?

The junction-to-ambient thermal resistance (RθJA) for SN74LVC2G07DSF2 in the DSF (6-pin SON) package is 300°C/W, as specified in the Thermal Information table. This value assumes standard JEDEC 2S2P board conditions and reflects the thermal performance of the 1.00 mm × 1.00 mm DSF footprint - higher than larger packages (e.g., SOT-23 at 165°C/W) due to reduced copper exposure, necessitating careful layout with thermal vias for sustained 32-mA operation.