Texas Instruments SN74LVC2G07YZPR

Overview

SN74LVC2G07YZPR from Texas Instruments is a dual open-drain buffer IC designed for level translation and wired-OR logic implementation in 1.65-V to 5.5-V systems. It delivers 32-mA sink current per output, supports 5.5-V tolerant inputs, and achieves 3.7-ns propagation delay at 3.3 V - enabling robust I²C bus buffering, LED driving, and mixed-voltage interface isolation in portable media players and SSD controllers.

For engineers reviewing the SN74LVC2G07YZPR datasheet, SN74LVC2G07YZPR pinout, SN74LVC2G07YZPR application, or SN74LVC2G07YZPR equivalent, key selection criteria include verified open-drain sink capability (32 mA @ 4.5 V), Ioff-enabled live insertion support, NanoFree DSBGA package footprint (1.41 mm × 0.91 mm), and guaranteed operation across –40°C to +125°C.

Technical Context

The SN74LVC2G07YZPR implements two independent non-inverting open-drain buffers with no internal pullups. Its Ioff circuitry actively disables outputs during partial power-down, blocking back-drive current when VCC = 0 V. Inputs tolerate up to 5.5 V regardless of VCC level, enabling bidirectional voltage translation between 1.8-V, 2.5-V, 3.3-V, and 5-V domains.

Each output sinks up to 32 mA while maintaining VOL ≤ 0.55 V at VCC = 4.5 V and TA = 25°C. Propagation delay remains ≤ 4.2 ns over full temperature range (–40°C to 125°C) at 3.3 V, with <10-μA ICC ensuring ultra-low static power in battery-powered applications.

Key Specifications

Pinout & Package

SN74LVC2G07YZPR uses the Texas Instruments NanoFree™ DSBGA (YZP) package: 6-terminal, bottom-side ball array, body size 1.41 mm × 0.91 mm, 0.4-mm pitch. This wafer-level chip-scale package eliminates bond wires and substrate, minimizing parasitic inductance for high-speed switching.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual open-drain buffer applications.

Compared with SN74LVC2G07YZPR, the DBVR offers easier handling but occupies 3.2× more PCB area, while the DCKR provides 40% smaller footprint than DBVR yet lacks the ultra-compact 1.41 mm × 0.91 mm form factor critical for next-gen wearables and ultra-thin tablets.

Availability

SN74LVC2G07YZPR is available at Aetrix Electronics and suitable for high-density portable media players, enterprise SSD controllers, and automotive infotainment systems requiring stable component supply, extended temperature operation, and minimal PCB footprint.

Supply support for SN74LVC2G07YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies with over 50 years of innovation in high-reliability logic and interface solutions.

The SN74LVC2G07YZPR belongs to TI's LVC logic family, engineered for low-voltage, high-speed, mixed-signal interface applications in space-constrained, thermally demanding environments like mobile and storage systems.

FAQ

What is the maximum sink current specification for SN74LVC2G07YZPR?

The SN74LVC2G07YZPR supports up to 32 mA sink current per output at VCC = 4.5 V and TA = 25°C, with VOL maintained at ≤0.55 V. This rating is validated across the full operating temperature range (–40°C to 125°C) and enables direct LED driving and high-current bus termination without external components. The SN74LVC2G07YZPR maintains this capability while consuming only 10 μA quiescent current.

Does SN74LVC2G07YZPR support level translation between different voltage domains?

Yes, the SN74LVC2G07YZPR supports bidirectional level translation due to its 5.5-V tolerant inputs and open-drain outputs. Inputs accept voltages from 0 V to 5.5 V independent of VCC (1.65–5.5 V), allowing a 1.8-V powered SN74LVC2G07YZPR to safely receive signals from 5-V microcontrollers. Output high level is defined solely by the external pullup voltage, enabling seamless up-translation (e.g., 1.8-V logic to 3.3-V bus).

What is the purpose of the Ioff feature in SN74LVC2G07YZPR?

The Ioff feature in SN74LVC2G07YZPR disables output drivers when VCC = 0 V, limiting off-state leakage to ±10 μA. This prevents damaging back-current flow during live insertion, partial power-down, or system sleep modes - critical for hot-pluggable modules and PCIe-based storage enclosures. The SN74LVC2G07YZPR maintains this protection across –40°C to 125°C without external circuitry.

What package type does SN74LVC2G07YZPR use, and what are its dimensions?

SN74LVC2G07YZPR uses the Texas Instruments NanoFree™ DSBGA (YZP) package: a 6-ball, bottom-terminal wafer-level chip-scale package measuring 1.41 mm × 0.91 mm with 0.4-mm pitch. This footprint is 72% smaller than the SOT-23 variant and eliminates bond wires to reduce parasitic inductance - making the SN74LVC2G07YZPR ideal for ultra-thin mobile devices and high-density SSD controllers.

Can SN74LVC2G07YZPR be used in wired-OR logic configurations?

Yes, the SN74LVC2G07YZPR is explicitly designed for wired-OR (active-low) and wired-AND (active-high) logic functions. Its dual independent open-drain outputs can be tied together with a shared pullup resistor to implement bus arbitration, interrupt combining, or fault-signaling networks. Each output sinks up to 32 mA, allowing multiple SN74LVC2G07YZPR devices to share a single bus line without violating current limits.