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Texas Instruments SN74LVC2G125YZPR
- Part No.:
- SN74LVC2G125YZPR
- Manufacturer:
- Texas Instruments
- Package:
- 8-XFBGA, DSBGA
- Datasheet:
-
SN74LVC2G125YZPR.pdf
- Description:
- IC BUF NON-INVERT 5.5V 8DSBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
SN74LVC2G125YZPR from Texas Instruments is a dual 3-state bus buffer gate IC designed for 1.65-V to 5.5-V operation, featuring two independent noninverting buffers with active-low output-enable controls (1OE, 2OE), ±24-mA drive at 3.3 V, 4.3-ns max propagation delay, and Ioff support for live insertion and partial-power-down systems - used in high-speed data acquisition, video infrastructure, and SSD interconnects.
For engineers reviewing the SN74LVC2G125YZPR datasheet, SN74LVC2G125YZPR pinout, SN74LVC2G125YZPR application, or SN74LVC2G125YZPR equivalent, key selection considerations include its DSBGA-8 (1.91 mm × 0.91 mm) NanoFree™ package, 5.5-V tolerant inputs, 3-state output behavior, and thermal performance (RθJA = 99.8°C/W) in space-constrained industrial and communications designs.
Technical Context
The SN74LVC2G125YZPR implements two independent noninverting buffer functions (Y = A) with separate active-low output-enable inputs (1OE, 2OE), enabling per-channel 3-state control. Its CMOS inputs accept voltages up to 5.5 V regardless of VCC, supporting level translation from higher-voltage domains down to the supply rail.
It integrates Ioff circuitry that disables outputs and limits leakage to ±10 µA when VCC = 0 V, preventing back-drive current during power sequencing. The balanced push-pull outputs deliver matched sourcing/sinking capability (±24 mA at 3.3 V), with ground bounce (VOLP < 0.8 V) and undershoot (VOHV > 2 V) characterized at 3.3 V and 25°C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 5.5 V - supports single-supply operation across 1.8-V, 2.5-V, 3.3-V, and 5-V logic domains. |
| Max Propagation Delay | 4.3 ns at VCC = 3.3 V, TA = –40°C to +85°C - enables reliable operation in ≤100-MHz digital interfaces. |
| Output Drive | ±24 mA at VCC = 3.3 V - sufficient to drive multiple CMOS loads or moderate PCB traces without external buffering. |
| Ioff Leakage | ±10 µA at VI/VO = 5.5 V, VCC = 0 V - ensures safe hot-plug and partial-power-down behavior in modular systems. |
| Input Voltage Tolerance | 0 V to 5.5 V - allows interfacing with 5-V signals while operating from lower VCC (e.g., 3.3 V or 1.8 V), enabling down-translation. |
| ESD Rating | 2000-V HBM, 1000-V CDM - meets industrial-grade robustness requirements without external protection. |
| Operating Temperature | –40°C to +125°C - qualified for extended-temperature industrial, automotive under-hood, and military applications. |
Pinout & Package
SN74LVC2G125YZPR uses an 8-pin DSBGA (Die Size Ball Grid Array) package measuring 1.91 mm × 0.91 mm with 0.4-mm ball pitch. The NanoFree™ construction eliminates traditional packaging - the silicon die itself forms the mechanical interface, minimizing footprint and parasitic inductance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A (B1) | Input of Buffer 1 | CMOS input accepting 0–5.5 V; drives internal noninverting buffer stage 1. |
| 2A (D2) | Input of Buffer 2 | CMOS input accepting 0–5.5 V; drives internal noninverting buffer stage 2. |
| 1OE (A1) | Active-Low Output Enable 1 | Low enables 1Y output; high forces 1Y into high-impedance state - requires pullup to VCC for power-up safety. |
| 2OE (B2) | Active-Low Output Enable 2 | Low enables 2Y output; high forces 2Y into high-impedance state - independent control from 1OE. |
| 1Y (C2) | Output of Buffer 1 | 3-state CMOS output; mirrors 1A when 1OE = L; high-Z when 1OE = H. |
| 2Y (C1) | Output of Buffer 2 | 3-state CMOS output; mirrors 2A when 2OE = L; high-Z when 2OE = H. |
| GND (D1) | Ground Reference | Primary return path for all internal logic and I/O currents; must be low-impedance connection. |
| VCC (A2) | Positive Supply | Power supply for core logic and I/O; bypassing with 0.1-µF capacitor near the ball is mandatory for noise immunity. |
Key Features
| Feature | Design Value |
|---|---|
| NanoFree™ DSBGA-8 Package | 1.91 mm × 0.91 mm footprint - reduces board area by >50% vs. VSSOP/SM8, lowers trace inductance for high-speed signal integrity. |
| 5.5-V Tolerant Inputs | Enables direct connection to 5-V legacy buses while operating from 1.8-V or 3.3-V rails - eliminates level-shifters in mixed-voltage systems. |
| Ioff Partial-Power-Down Support | Prevents back-current flow when VCC = 0 V - critical for hot-swap modules, FPGA configuration interfaces, and modular backplanes. |
| ±24-mA Output Drive at 3.3 V | Drives ≥10 standard CMOS loads or 50-Ω transmission lines - supports fanout expansion without added buffers in compact designs. |
| Low ICC (10 µA Max) | Minimizes quiescent power in always-on subsystems such as sensor hubs or standby controllers - extends battery life in portable equipment. |
Applications
| Cable Modem Termination Systems | High-Speed Data Acquisition |
|---|---|
Use Scenario: Isolating and buffering bidirectional data paths between DOCSIS PHY and MAC layers in CMTS line cards. IC Role / Device Role / Timing Role: Dual 3-state buffer managing address/data bus contention during upstream/downstream channel switching. Use Value: 5.5-V tolerant inputs interface directly with legacy 5-V analog front-end components; ±24-mA drive ensures clean signal edges across long backplane traces. |
Use Scenario: Driving multiplexed ADC/DAC control lines and sample clocks in test instrumentation with tight timing margins. IC Role / Device Role / Timing Role: Noninverting buffer with independent OE controls synchronizing parallel data lanes to avoid metastability during sampling windows. Use Value: 4.3-ns max tpd at 3.3 V guarantees sub-10-ns setup/hold timing compliance; low ICC reduces thermal load in densely packed DAQ modules. |
| Video Broadcasting Infrastructure | SSD Internal Interconnect |
Use Scenario: Level-shifting and isolating GPIO and status signals between 5-V video processors and 3.3-V FPGA-based scalers in IP transcoders. IC Role / Device Role / Timing Role: Down-translating buffer enabling interoperability between heterogeneous voltage domains in scalable broadcast platforms. Use Value: Input overvoltage tolerance eliminates external resistive dividers; NanoFree™ package saves space on high-density video processing PCBs. |
Use Scenario: Enabling/disabling NAND flash command/address buses during power-gating sequences in enterprise SSD controllers. IC Role / Device Role / Timing Role: Ioff-enabled 3-state buffer preventing back-drive current from powered NAND dies into unpowered controller sections. Use Value: ±10 µA Ioff leakage at VCC = 0 V ensures safe partial-power-down; DSBGA thermal resistance (RθJA = 99.8°C/W) supports sustained burst writes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC2G125DCUR | VSSOP-8 package (2.30 mm × 2.00 mm); RθJA = 217.8°C/W; same electrical specs and pinout. | Better suited for manual assembly or prototyping due to larger pitch (0.5-mm vs. 0.4-mm) and visible leads. | Select when solder reflow process lacks fine-pitch DSBGA capability or when board-level debug access is required. |
| SN74LVC2G125DCTR | SM8 package (2.95 mm × 2.80 mm); RθJA = 199.0°C/W; identical logic function and DC/AC specs. | Offers highest thermal margin among variants; compatible with standard SOIC-handling pick-and-place equipment. | Choose for high-reliability industrial applications where thermal headroom and assembly yield outweigh size constraints. |
Compared with SN74LVC2G125DCUR and SN74LVC2G125DCTR, the SN74LVC2G125YZPR delivers the smallest footprint and lowest thermal resistance (99.8°C/W), making it optimal for ultra-compact, thermally dense designs - though its 0.4-mm ball pitch demands advanced PCB fabrication and assembly.
Availability
SN74LVC2G125YZPR is available at Aetrix Electronics and suitable for high-speed data acquisition, video broadcasting infrastructure, and SSD internal interconnect applications requiring stable component supply, long-term lifecycle assurance, and consistent DSBGA-8 packaging.
Supply support for SN74LVC2G125YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of expertise in high-reliability interface ICs and advanced packaging technologies.
The SN74LVC2G125YZPR belongs to TI's LVC logic family - engineered for low-voltage, high-speed, mixed-signal interfacing in space-constrained industrial, communications, and storage systems where size, power, and robustness are critical.
FAQ
What is the maximum operating temperature for SN74LVC2G125YZPR?
The SN74LVC2G125YZPR is rated for operation from –40°C to +125°C ambient temperature. This extended range is validated per JEDEC JESD22-A108 and supports deployment in harsh environments such as industrial motor controls, automotive under-hood modules, and outdoor telecom infrastructure where thermal management is challenging. The DSBGA package's low RθJA (99.8°C/W) helps maintain junction temperature within safe limits.
Does SN74LVC2G125YZPR support level translation?
Yes, SN74LVC2G125YZPR supports down-translation: its inputs tolerate voltages up to 5.5 V regardless of VCC, allowing 5-V signals to safely drive the device while operating from 1.8-V, 2.5-V, or 3.3-V supplies. This eliminates external level shifters in mixed-voltage systems - confirmed in the "Can Be Used as a Down Translator" feature and VI absolute maximum rating (–0.5 V to 6.5 V).
How should the OE pins be biased on SN74LVC2G125YZPR?
OE pins (1OE and 2OE) on SN74LVC2G125YZPR are active-low and must be pulled high to VCC via a resistor during power-up to ensure outputs remain in high-impedance state until firmware initializes control. TI recommends a pullup resistor sized to sink the driver's current-sinking capability - typically 10 kΩ for most applications - as stated in the "Description" section and Figure 4 functional diagram.
Is SN74LVC2G125YZPR pin-compatible with other SN74LVC2G125 variants?
No - SN74LVC2G125YZPR uses an 8-ball DSBGA (YZP) package with bottom-side BGA layout (A1, B1, C1, etc.), while SN74LVC2G125DCUR (VSSOP) and SN74LVC2G125DCTR (SM8) use 8-lead surface-mount packages with different pinouts and land patterns. Though logic function and electrical specs match, PCB layout and assembly processes are not interchangeable.
What is the purpose of Ioff in SN74LVC2G125YZPR?
Ioff in SN74LVC2G125YZPR disables all outputs and limits input/output leakage to ±10 µA when VCC = 0 V, preventing damaging back-current flow during live insertion, partial-power-down, or system sleep states. This feature is explicitly tested and guaranteed per JESD78 Class II latch-up standards, making SN74LVC2G125YZPR suitable for modular backplanes and hot-swappable storage subsystems.
SN74LVC2G125YZPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 8-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DSBGA
SN74LVC2G125YZPR FAQ
1.How can I place an order for SN74LVC2G125YZPR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC2G125YZPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC2G125YZPR reliable?
The price and inventory of SN74LVC2G125YZPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC2G125YZPR is usually 5 days.
3.What payment methods are accepted for SN74LVC2G125YZPR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LVC2G125YZPR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74LVC2G125YZPR?
SN74LVC2G125YZPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74LVC2G125YZPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC2G125YZPR?
For technical support, including SN74LVC2G125YZPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC2G125YZPR requirements.
6.How does Aetrix verify that SN74LVC2G125YZPR is sourced from the original manufacturer or authorized distributors?
All SN74LVC2G125YZPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC2G125YZPR meets industry standards.
7.What is the process for return or replacement of SN74LVC2G125YZPR?
All SN74LVC2G125YZPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC2G125YZPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC2G125YZPR part is unused and in its original packaging.
Return procedure for SN74LVC2G125YZPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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