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Texas Instruments SN74LVC2G126YEPR
- Part No.:
- SN74LVC2G126YEPR
- Manufacturer:
- Texas Instruments
- Package:
- 8-XFBGA, DSBGA
- Datasheet:
-
SN74LVC2G126YEPR.pdf
- Description:
- IC BUF NON-INVERT 5.5V 8DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,511
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Product details
Overview
SN74LVC2G126YEPR from Texas Instruments is a dual 3-state bus buffer gate designed for level-translating data paths in 1.65-V to 5.5-V systems. It features independent output-enable (OE) controls per channel, ±24-mA drive strength at 3.3 V, 4-ns max propagation delay, and Ioff support for partial-power-down operation - used in portable interface bridging between mixed-voltage logic domains.
For engineers reviewing the SN74LVC2G126YEPR datasheet, SN74LVC2G126YEPR pinout, SN74LVC2G126YEPR application, or SN74LVC2G126YEPR equivalent, key selection criteria include its NanoFree™ WCSP package with 0.23-mm large bumps, 3.3-V-compatible 3-state outputs, low ICC (≤10 µA), and robust ESD protection (2000-V HBM).
Technical Context
This device implements two noninverting buffers, each with dedicated OE control enabling independent 3-state output management. Its Ioff circuitry actively disables outputs during power-down, blocking reverse current flow when VCC = 0 V while inputs/outputs remain biased up to 5.5 V.
Designed for mixed-signal board-level interfacing, it supports voltage translation across 1.65–5.5 V rails without external level shifters. Input thresholds are VIL ≤ 0.8 V and VIH ≥ 2.0 V at 3.3 V, ensuring reliable CMOS compatibility and noise margin in noisy industrial environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 5.5 V - enables direct interface between 1.8-V, 2.5-V, 3.3-V, and 5-V logic domains |
| tpd Max | 4 ns at 3.3 V - ensures sub-250-MHz timing margin for high-speed digital control paths |
| IOL/IOH | ±24 mA at 3.3 V - drives standard 50-Ω transmission lines or multiple 74LVC loads without buffering |
| Ioff Leakage | ±10 µA max - prevents backflow damage during hot-insertion or staggered power sequencing |
| ESD Rating | 2000-V HBM - meets industrial IEC 61000-4-2 system-level surge immunity baseline |
| Package Thermal θJA | 102°C/W (YEP) - supports sustained operation at 85°C ambient in compact PCB layouts |
| Input Voltage Tolerance | Up to 5.5 V - allows 5-V-tolerant inputs even when VCC = 1.8 V, simplifying legacy interface integration |
Pinout & Package
NanoFree™ WCSP (DSBGA) package with 0.23-mm large solder bumps, bottom-side terminal layout, and Pb-free construction. Pin 1 identified by solder-bump composition marker (• = Pb-free). Footprint optimized for space-constrained portable designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Bump A1) | 1OE | Active-high enable for Buffer 1 - tie low via pulldown resistor for safe power-up high-impedance state |
| 2 (Bump A2) | 1A | Noninverting input of Buffer 1 - accepts 1.65–5.5 V logic levels regardless of VCC |
| 3 (Bump B1) | 2Y | Inverting output of Buffer 2 - not applicable; this is noninverting device; correction: 2Y is noninverting output of Buffer 2 |
| 4 (Bump B2) | GND | Digital ground reference - must be connected directly to PCB ground plane for signal integrity |
| 5 (Bump C1) | VCC | Supply rail - bypass with 0.1-µF ceramic capacitor placed within 2 mm of pin |
| 6 (Bump C2) | 2OE | Active-high enable for Buffer 2 - independent control enables dynamic channel gating |
| 7 (Bump D1) | 1Y | Noninverting output of Buffer 1 - provides 3-state drive with ±24-mA capability at 3.3 V |
| 8 (Bump D2) | 2A | Noninverting input of Buffer 2 - electrically identical to 1A; supports dual independent data paths |
Key Features
| Feature | Design Value |
|---|---|
| Independent 3-State Control | Separate OE pins per buffer allow selective channel isolation without affecting adjacent signal paths |
| Ioff Partial-Power-Down Support | Prevents damaging current backflow when VCC = 0 V but I/Os remain active - critical for hot-swap systems |
| 5.5-V-Tolerant Inputs | Accepts 5-V logic signals even at 1.65-V VCC - eliminates need for external level translators in mixed-rail designs |
| Low Ground Bounce (VOLP) | <0.8 V at 3.3 V - maintains signal integrity during simultaneous switching of multiple outputs |
| NanoFree™ WCSP Packaging | Die-size footprint (1.3 × 1.3 mm) reduces PCB area by >70% vs. SSOP - ideal for wearables and IoT edge nodes |
Applications
| Mobile Baseband Interface | Industrial Sensor Hub |
|---|---|
Use Scenario: Level-shifting control signals between 1.8-V application processor and 3.3-V peripheral ICs in smartphone modems. IC Role / Device Role / Timing Role: Dual noninverting buffer with independent OE control manages bidirectional command/data strobes with sub-4-ns timing alignment. Use Value: Eliminates discrete level shifters while maintaining <0.8-V ground bounce - preserves ADC reference stability in RF-sensitive zones. | Use Scenario: Isolating SPI clock and data lines between 2.5-V microcontroller and 5-V analog front-end in factory-floor sensor nodes. IC Role / Device Role / Timing Role: 3-state bus buffer enables dynamic bus sharing among multiple sensors; Ioff protects MCU during field-replaceable module insertion. Use Value: 5.5-V-tolerant inputs accept 5-V sensor outputs directly; ±24-mA drive ensures clean edges over 15-cm PCB traces. |
| Wearable Health Monitor | Automotive Body Control Module |
Use Scenario: Enabling/disabling I²C pull-up networks between 3.3-V SoC and 1.8-V biometric sensor array during sleep mode. IC Role / Device Role / Timing Role: Low-leakage (≤10 µA) 3-state buffer gates I²C SDA/SCL lines to reduce quiescent current below 1 µA system-wide. Use Value: Ioff blocks reverse current from 3.3-V pull-ups into powered-down 1.8-V sensor domain - extends battery life by >12% in multi-day wearables. | Use Scenario: Buffering LIN transceiver TX/RX signals between 5-V microcontroller and 12-V vehicle bus interface. IC Role / Device Role / Timing Role: Dual buffer isolates MCU GPIOs from LIN bus transients; 2000-V HBM rating withstands automotive ESD events. Use Value: 102°C/W thermal resistance sustains operation at 85°C under hood; 4-ns tpd meets LIN 2.2 timing jitter budget. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC2G125YEPR | Inverting output logic (vs. noninverting in SN74LVC2G126YEPR); otherwise identical electrical specs and package | Requires logic inversion in upstream firmware or hardware; unsuitable where signal polarity must be preserved | Select only if system design accommodates inverted data path - no PCB change needed due to identical pinout |
| SN74AUP2G126DCUR | Lower ICC (500 nA typical), slower tpd (6.1 ns at 1.8 V), same 1.8–3.6 V VCC range; VSSOP-8 package | Better for ultra-low-power always-on monitoring; incompatible pinout and larger footprint than WCSP | Choose for battery-powered applications prioritizing standby current over speed; requires PCB redesign |
Compared with SN74LVC2G126YEPR, SN74LVC2G125YEPR offers identical performance with inverted outputs - suitable when polarity inversion is acceptable - while SN74AUP2G126DCUR trades speed for nanoamp-level quiescent current in a larger VSSOP package, demanding layout revision but enabling multi-year coin-cell operation.
Availability
SN74LVC2G126YEPR is available at Aetrix Electronics and suitable for mobile baseband interface, industrial sensor hub, wearable health monitor, and automotive body control module applications requiring stable component supply, long-term lifecycle assurance, and Pb-free compliance.
Supply support for SN74LVC2G126YEPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and personal electronics markets.
The SN74LVC2G126YEPR belongs to TI's LVC logic family - engineered for low-voltage, high-speed, mixed-rail interoperability in space-constrained portable and industrial systems.
FAQ
What is the maximum operating temperature range for the SN74LVC2G126YEPR?
The SN74LVC2G126YEPR is rated for operation from −40°C to +85°C ambient temperature. This range is validated per JEDEC JESD78 latch-up testing and JESD22 ESD stress conditions, making it suitable for extended-temperature industrial and automotive cabin applications. The NanoFree™ WCSP package's 102°C/W thermal resistance ensures junction temperatures remain within safe limits at full load under worst-case airflow conditions.
Does the SN74LVC2G126YEPR support true 5-V operation on VCC?
Yes, the SN74LVC2G126YEPR supports VCC up to 5.5 V, with recommended operation from 1.65 V to 5.5 V. At 5 V, it delivers IOH/ IOL up to ±32 mA and maintains VIH/VIL thresholds scaled to 70%/30% of VCC. All DC and AC specifications - including 4-ns tpd and 2000-V HBM ESD - are guaranteed across the full 5.5-V range, enabling direct use in legacy 5-V systems without derating.
How does the Ioff feature function in the SN74LVC2G126YEPR during power-down?
The Ioff feature in the SN74LVC2G126YEPR disables all output drivers when VCC = 0 V, limiting leakage current to ±10 µA maximum even if inputs or outputs are biased to 5.5 V. This prevents damaging reverse current flow through the device during hot-plug events or partial power sequencing - a critical requirement for PCIe add-in cards, modular instrumentation, and field-upgradeable automotive ECUs where subsystems power up/down asynchronously.
Can the SN74LVC2G126YEPR be used for level translation between 1.8-V and 3.3-V domains?
Yes, the SN74LVC2G126YEPR is explicitly designed for bidirectional level translation: its inputs tolerate up to 5.5 V regardless of VCC, and its outputs swing rail-to-rail (0 V to VCC). When VCC = 3.3 V, it accepts 1.8-V logic inputs and drives 3.3-V outputs; when VCC = 1.8 V, it accepts 3.3-V inputs (via internal clamping) and drives 1.8-V outputs - eliminating external translators in mixed-voltage FPGA I/O banks and SoC peripheral interfaces.
What is the pin 1 identifier for the SN74LVC2G126YEPR NanoFree™ WCSP package?
The SN74LVC2G126YEPR NanoFree™ WCSP package uses a solder-bump composition marker for pin 1 identification: a solid dot (•) indicates Pb-free bump material. This marker is located adjacent to bump A1 (1OE) on the bottom side of the die. Unlike leaded packages, there is no physical notch or chamfer - orientation must be verified optically using the dot under magnification before reflow assembly.
SN74LVC2G126YEPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 8-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DSBGA (1.9x0.9)
SN74LVC2G126YEPR FAQ
1.How can I place an order for SN74LVC2G126YEPR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC2G126YEPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC2G126YEPR reliable?
The price and inventory of SN74LVC2G126YEPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC2G126YEPR is usually 5 days.
3.What payment methods are accepted for SN74LVC2G126YEPR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LVC2G126YEPR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74LVC2G126YEPR?
SN74LVC2G126YEPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74LVC2G126YEPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC2G126YEPR?
For technical support, including SN74LVC2G126YEPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC2G126YEPR requirements.
6.How does Aetrix verify that SN74LVC2G126YEPR is sourced from the original manufacturer or authorized distributors?
All SN74LVC2G126YEPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC2G126YEPR meets industry standards.
7.What is the process for return or replacement of SN74LVC2G126YEPR?
All SN74LVC2G126YEPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC2G126YEPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC2G126YEPR part is unused and in its original packaging.
Return procedure for SN74LVC2G126YEPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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