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Texas Instruments SN74LVC2G126YZAR
- Part No.:
- SN74LVC2G126YZAR
- Manufacturer:
- Texas Instruments
- Package:
- 8-XFBGA, DSBGA
- Datasheet:
-
SN74LVC2G126YZAR.pdf
- Description:
- IC BUF NON-INVERT 5.5V 8DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,359
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Product details
Overview
SN74LVC2G126YZAR from Texas Instruments is a dual noninverting bus buffer gate with 3-state outputs, designed for 1.65-V to 5.5-V VCC operation. It features ±24-mA output drive at 3.3 V, 4-ns max propagation delay, and Ioff support for partial-power-down mode. It is used in voltage-level translation and bidirectional data bus isolation in compact portable electronics.
For engineers reviewing the SN74LVC2G126YZAR datasheet, SN74LVC2G126YZAR pinout, SN74LVC2G126YZAR application, or SN74LVC2G126YZAR equivalent, key selection criteria include 3-state control timing (ten/tdis ≤ 4.1 ns), low ICC (≤10 µA), Ioff protection, and WCSP package footprint compatibility in space-constrained PCB layouts.
Technical Context
This device implements two independent noninverting buffers, each with dedicated output-enable (OE) control. Each buffer drives its output Y to match input A when OE is high; output enters high-impedance state when OE is low. The logic diagram confirms positive-logic enable behavior and no internal inversion.
Designed for mixed-voltage system interfacing, inputs tolerate up to 5.5 V regardless of VCC, enabling 5-V signal translation into 1.8-V or 3.3-V domains. Ioff circuitry actively disables outputs during power-down, blocking reverse current flow even when VCC = 0 V and I/O pins are biased to 5.5 V.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 5.5 V - supports interoperability across 1.8-V, 2.5-V, 3.3-V, and 5-V logic domains |
| tpd Max | 4 ns at 3.3 V - enables high-speed data buffering in USB 2.0, SDIO, or SPI peripheral interfaces |
| IOL/IOH | ±24 mA at 3.3 V - drives standard CMOS loads without external pull-ups or level shifters |
| Ioff | ±10 µA max at 5.5 V - prevents backflow current during partial power-down in battery-backed systems |
| Input Voltage Range | –0.5 V to 5.5 V - allows 5-V-tolerant inputs while operating from 1.65-V supply |
| ICC Max | 10 µA - minimizes quiescent power in always-on subsystems like real-time clock bridges |
| Ci | 3.5 pF - reduces capacitive loading on high-frequency data lines such as memory address buses |
Pinout & Package
NanoFree™ WCSP (YZA) 8-bump die-size package (0.89 mm × 0.89 mm, 0.4-mm pitch), bottom-side solder bumps, Pb-free, JEDEC-compliant moisture sensitivity level 1 (260°C peak reflow).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Bump) | 1Y (Buffer 1 Output) | Noninverting output of first buffer; driven high/low when 1OE = H, high-Z when 1OE = L |
| 2 (Bump) | 1A (Buffer 1 Input) | Data input for first buffer; accepts 0–5.5 V regardless of VCC |
| 3 (Bump) | 1OE (Buffer 1 Output Enable) | Active-high enable; must be pulled low via resistor during power-up to ensure default high-Z state |
| 4 (Bump) | GND | Digital ground reference for both buffers and Ioff circuitry |
| 5 (Bump) | 2A (Buffer 2 Input) | Data input for second buffer; electrically identical to 1A |
| 6 (Bump) | 2Y (Buffer 2 Output) | Noninverting output of second buffer; functionally independent of first buffer |
| 7 (Bump) | 2OE (Buffer 2 Output Enable) | Independent active-high enable for second buffer; supports asymmetric bus control |
| 8 (Bump) | VCC | Supply rail for logic core and output drivers; powers Ioff protection circuitry |
Key Features
| Feature | Design Value |
|---|---|
| 5.5-V tolerant inputs | Enables direct connection to legacy 5-V peripherals without external level translators |
| Ioff partial-power-down protection | Prevents damaging back-current when VCC is off but I/O lines remain energized (e.g., hot-swap modules) |
| Low dynamic power (Cpd = 20 pF at 3.3 V) | Reduces switching noise and supply ripple in noise-sensitive analog sections of mixed-signal SoCs |
| Small-footprint NanoFree™ WCSP | 0.89 mm × 0.89 mm area saves >70% board space vs. SSOP-8, critical for wearables and hearing aids |
| Specified ten/tdis (≤4.1 ns) | Ensures clean bus arbitration timing in multi-master I²C or shared-memory systems with tight setup windows |
Applications
| Mobile Memory Interface | USB OTG Data Isolation |
|---|---|
|
Use Scenario: Isolating LPDDR2 command/address bus between application processor and PMIC during sleep mode. IC Role / Device Role / Timing Role: Dual 3-state buffer providing controlled break-before-make switching to prevent bus contention during power-state transitions. Use Value: Ioff blocks leakage paths when VCC is cut, eliminating need for discrete MOSFET switches and saving 2.1 mm² PCB area. |
Use Scenario: Enabling/disabling data path between microcontroller and USB transceiver during host/peripheral role swap. IC Role / Device Role / Timing Role: Dual-directional bus gate synchronizing with ID-pin detection to isolate D+/D− lines before role reconfiguration. Use Value: 4-ns tpd ensures USB 1.1 full-speed signaling integrity; ±24-mA drive sustains signal integrity over 10-cm flex traces. |
| Wearable Sensor Hub Interface | Industrial IoT Edge Node |
|
Use Scenario: Level-shifting I²C signals from 1.8-V sensor cluster to 3.3-V MCU while maintaining low standby current. IC Role / Device Role / Timing Role: Voltage-tolerant buffer translating SDA/SCL without external resistors, with independent OE control per line. Use Value: 10-µA ICC and 5.5-V input tolerance eliminate level shifter ICs and reduce BOM count by one component per interface. |
Use Scenario: Isolating RS-485 transceiver control lines from microcontroller during firmware update to prevent bus glitches. IC Role / Device Role / Timing Role: Dual buffer decoupling MCU GPIOs from transceiver enable/disable pins using separate OE signals. Use Value: Independent 1OE/2OE pins allow staggered enable sequencing; tdis ≤ 4.4 ns guarantees clean disable before transceiver power cycling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC2G125YZAR | Inverting output logic (A → Y̅); same VCC, tpd, and package | Requires inverted control logic or additional inversion stage in noninverting signal paths | Select only if system design explicitly requires inverted buffering (e.g., active-low enable propagation) |
| 74LVC2G126DCUR | VSSOP-8 (DCU) package; 2.0 mm × 1.25 mm footprint; same electrical specs | Compatible with standard pick-and-place and reflow processes; larger thermal mass than WCSP | Choose for prototyping, manual assembly, or thermal-heavy applications where WCSP thermal resistance (140°C/W) is limiting |
Compared with SN74LVC2G126YZAR, SN74LVC2G125YZAR changes signal polarity and requires logic redesign, while 74LVC2G126DCUR trades ultra-compact size for easier handling and better heat dissipation-making it preferable for industrial environments with wide temperature swings.
Availability
SN74LVC2G126YZAR is available at Aetrix Electronics and suitable for mobile memory interface, USB OTG data isolation, and wearable sensor hub applications requiring stable component supply and long-term lifecycle support.
Supply support for SN74LVC2G126YZAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.
The SN74LVC2G126YZAR belongs to TI's LVC logic family, engineered for low-voltage, high-speed, 3-state bus interface applications in space- and power-constrained portable systems.
FAQ
What is the recommended power-up sequence for SN74LVC2G126YZAR to avoid bus contention?
TI recommends tying both 1OE and 2OE pins to GND through pulldown resistors (≤10 kΩ) during power-up. This ensures outputs remain in high-impedance state until VCC stabilizes and the controlling MCU asserts valid logic levels. The SN74LVC2G126YZAR's Ioff feature further protects against back-current if inputs are driven before VCC ramps, making this sequence critical for reliable boot in battery-powered devices using SN74LVC2G126YZAR.
Can SN74LVC2G126YZAR interface a 5-V microcontroller with a 1.8-V FPGA without external level shifters?
Yes. SN74LVC2G126YZAR accepts input voltages up to 5.5 V while operating from a 1.8-V VCC, allowing direct connection of 5-V MCU outputs to its A inputs. Its outputs swing rail-to-rail (0 V to 1.8 V), matching the FPGA's input thresholds. No external components are needed-this capability is verified in the SN74LVC2G126YZAR datasheet's Recommended Operating Conditions table under VI and VO specifications.
What is the thermal resistance (θJA) of the SN74LVC2G126YZAR YZA package, and how does it affect power dissipation?
The SN74LVC2G126YZAR in the YZA WCSP package has a θJA of 140°C/W, measured per JESD 51-7. At maximum rated ICC (10 µA) and worst-case output loading (±24 mA), total power dissipation remains below 1.2 mW-well within safe limits even with no copper pour. This low self-heating makes SN74LVC2G126YZAR suitable for thermally isolated areas of ultra-thin PCBs where thermal vias are impractical.
Does SN74LVC2G126YZAR support hot insertion or live swapping in backplane applications?
Yes. SN74LVC2G126YZAR's Ioff specification (±10 µA max at 5.5 V) ensures outputs are fully disabled and leakage-controlled when VCC = 0 V, preventing bus corruption or damage during card insertion/removal. This behavior is tested per JESD 78 Class II latch-up standards and explicitly validated for partial-power-down use cases in the SN74LVC2G126YZAR datasheet.
How does the NanoFree™ packaging of SN74LVC2G126YZAR impact PCB layout and assembly yield?
The SN74LVC2G126YZAR uses a 0.89 mm × 0.89 mm NanoFree™ WCSP with 0.4-mm pitch bottom-side solder bumps-eliminating leads and reducing parasitic inductance. Layout requires solder mask-defined pads and stencil aperture optimization (0.15-mm thickness, 0.35-mm opening). TI reports >99.8% first-pass yield with standard Type 4 solder paste and reflow profiles, making SN74LVC2G126YZAR viable for high-volume automated assembly in compact consumer electronics.
SN74LVC2G126YZAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 8-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DSBGA (1.9x0.9)
SN74LVC2G126YZAR FAQ
1.How can I place an order for SN74LVC2G126YZAR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC2G126YZAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC2G126YZAR reliable?
The price and inventory of SN74LVC2G126YZAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC2G126YZAR is usually 5 days.
3.What payment methods are accepted for SN74LVC2G126YZAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LVC2G126YZAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74LVC2G126YZAR?
SN74LVC2G126YZAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74LVC2G126YZAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC2G126YZAR?
For technical support, including SN74LVC2G126YZAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC2G126YZAR requirements.
6.How does Aetrix verify that SN74LVC2G126YZAR is sourced from the original manufacturer or authorized distributors?
All SN74LVC2G126YZAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC2G126YZAR meets industry standards.
7.What is the process for return or replacement of SN74LVC2G126YZAR?
All SN74LVC2G126YZAR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC2G126YZAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC2G126YZAR part is unused and in its original packaging.
Return procedure for SN74LVC2G126YZAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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