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Texas Instruments SN74LVC2G126YZPR
- Part No.:
- SN74LVC2G126YZPR
- Manufacturer:
- Texas Instruments
- Package:
- 8-XFBGA, DSBGA
- Datasheet:
-
SN74LVC2G126YZPR.pdf
- Description:
- IC BUF NON-INVERT 5.5V 8DSBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
SN74LVC2G126YZPR from Texas Instruments is a dual 3-state bus buffer gate optimized for level translation and high-speed digital interfacing in space-constrained applications. It operates from 1.65 V to 5.5 V, supports 5.5-V-tolerant inputs, delivers ±24 mA output drive at 3.3 V, achieves 4 ns max propagation delay, and features Ioff for live insertion and partial-power-down protection - used in SSD interconnects and video transcoder timing control.
For engineers reviewing the SN74LVC2G126YZPR datasheet, SN74LVC2G126YZPR pinout, SN74LVC2G126YZPR application, or SN74LVC2G126YZPR equivalent, key selection criteria include its DSBGA-8 (1.91 mm × 0.91 mm) footprint, 3.3-V/5-V bidirectional voltage translation capability, 125°C operating range, and Ioff-enabled hot-swap compatibility in industrial embedded systems.
Technical Context
The SN74LVC2G126YZPR implements two independent noninverting buffers, each with dedicated active-high output-enable (OE) control. Its CMOS design enables rail-to-rail output swing and supports down-translation - e.g., 5-V logic inputs to 3.3-V or 1.8-V VCC domains - without external level shifters.
It integrates Ioff circuitry that disables outputs and blocks current flow when VCC = 0 V, satisfying JESD78 Class II latch-up immunity (>100 mA) and ESD robustness per JESD22 (2000-V HBM, 1000-V CDM), making it suitable for mixed-voltage backplane and hot-pluggable module interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 5.5 V - enables single-supply operation across 1.8-V, 2.5-V, 3.3-V, and 5-V logic domains |
| Input Voltage Tolerance | Up to 5.5 V - allows direct connection of 5-V signals into lower-VCC systems without clamping diodes |
| tpd (Max) | 4 ns at VCC = 3.3 V - supports >100 MHz data rates in buffered address/data paths |
| Ioff Current | ±10 µA max - prevents back-drive damage during power sequencing or hot insertion |
| Output Drive | ±24 mA at VCC = 3.3 V - drives multiple LVC loads or LEDs directly without external buffers |
| Operating Temp | –40°C to +125°C - qualified for automotive under-hood and industrial motor-control environments |
| ESD Rating | 2000-V HBM, 1000-V CDM - meets IPC/JEDEC standards for board-level handling and assembly |
Pinout & Package
SN74LVC2G126YZPR uses an 8-pin DSBGA (Die Size Ball Grid Array) package measuring 1.91 mm × 0.91 mm with 0.5-mm ball pitch. The bottom-side ball layout follows JEDEC MO-277, with pin 1 located in quadrant Q1 per tape-and-reel orientation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A (B1) | Input A of Channel 1 | Noninverting data input; accepts up to 5.5 V regardless of VCC |
| 1OE (A1) | Output Enable for Channel 1 | Active-high control; drives 1Y high-impedance when low |
| 1Y (C2) | Output Y of Channel 1 | Buffered, 3-state output with ±24 mA drive capability at 3.3 V |
| 2A (D2) | Input A of Channel 2 | Independent noninverting input; electrically isolated from Channel 1 |
| 2OE (B2) | Output Enable for Channel 2 | Separate enable control allows asynchronous gating of second channel |
| 2Y (C1) | Output Y of Channel 2 | Matched electrical characteristics to 1Y; supports parallel load sharing |
| GND (D1) | Ground Reference | Primary return path; must be low-inductance for noise-sensitive high-speed switching |
| VCC (A2) | Power Supply | Single supply input; powers both channels and internal logic; bypass with 0.1-µF capacitor |
Key Features
| Feature | Design Value |
|---|---|
| NanoFree™ DSBGA Packaging | 1.91 mm × 0.91 mm footprint - eliminates leadframe, reduces parasitic inductance, and enables ultra-dense PCB layouts |
| 5.5-V Input Tolerance | Enables seamless 5-V-to-3.3-V down-translation without external resistors or translators |
| Ioff Protection | Blocks current flow when VCC = 0 V - essential for live-insertion in modular computing and telecom line cards |
| Low ICC (10 µA max) | Minimizes quiescent power in always-on subsystems such as sensor hubs and battery-backed controllers |
| High-Speed Switching | 4 ns tpd at 3.3 V - ensures signal integrity in DDR clock forwarding, FPGA I/O expansion, and video pixel pipelines |
Applications
| SSD Internal Interconnect | Video Transcoder Timing Control |
|---|---|
|
Use Scenario: Buffering command/address lines between NAND controller and flash memory arrays in M.2 NVMe SSDs. IC Role / Device Role / Timing Role: Dual-channel 3-state buffer isolating shared buses during read/write arbitration and enabling low-latency chip-select handshaking. Use Value: ±24 mA drive sustains signal integrity over 8-cm FR4 traces; 4 ns tpd aligns with 200+ MHz toggle rates required by ONFI 4.x protocols. |
Use Scenario: Level-shifting and enabling clock/data paths between 5-V legacy video encoders and 3.3-V FPGA-based transcoding engines. IC Role / Device Role / Timing Role: Voltage-translating bus buffer with independent OE controls synchronizing multi-format video frame buffering and transport stream multiplexing. Use Value: 5.5-V-tolerant inputs accept SMPTE 292-compliant sync pulses; Ioff prevents backfeed during FPGA reconfiguration cycles. |
| Military Radar Signal Conditioning | Industrial Motor Drive Interface |
|
Use Scenario: Isolating ADC/DAC control lines in phased-array radar front-ends exposed to wide temperature swings and EMI. IC Role / Device Role / Timing Role: Radiation-tolerant (EP variant available) buffer providing hot-swap-safe enable control for analog front-end calibration sequencers. Use Value: –40°C to +125°C operation maintains timing margins across thermal cycling; 2000-V HBM withstands lightning-induced transients on chassis-grounded I/O. |
Use Scenario: Interfacing microcontroller GPIOs to high-voltage gate drivers in servo motor inverters with variable DC-link voltages. IC Role / Device Role / Timing Role: Robust 3-state buffer decoupling logic-level PWM signals from noisy power-stage domains while supporting fast enable/disable sequencing. Use Value: Low ground bounce (<0.8 V) and VOH undershoot (>2 V) ensure clean edge transitions into 100-pF gate driver inputs; Ioff protects MCU during DC-link fault shutdown. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC2G125YZPR | Inverting output logic (Y = NOT A) vs. noninverting (Y = A) in SN74LVC2G126YZPR | Requires logic inversion in signal path; unsuitable where polarity preservation is mandatory (e.g., clock forwarding) | Select only if system-level inversion is acceptable or compensated elsewhere in firmware/hardware |
| SN74AUP2G126DSFR | Lower ICC (500 nA typical) and slower tpd (7.8 ns @ 1.8 V), but identical pinout and DSBGA-8 package | Better for ultra-low-power sensor nodes; not recommended for >50 MHz timing-critical paths | Prefer for battery-powered edge devices where standby current dominates; avoid for high-speed video or SSD use cases |
Compared with SN74LVC2G126YZPR, SN74LVC2G125YZPR changes signal polarity and SN74AUP2G126DSFR trades speed for sub-µA quiescent current - both require validation of timing closure and logic consistency in the target design.
Availability
SN74LVC2G126YZPR is available at Aetrix Electronics and suitable for SSD internal interconnects, video transcoder timing control, military radar signal conditioning, and industrial motor drive interfaces requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for SN74LVC2G126YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in logic IC design and high-reliability packaging.
The SN74LVC2G126YZPR belongs to TI's LVC (Low-Voltage CMOS) logic family, engineered for voltage translation, bus isolation, and high-speed signal integrity in space-constrained industrial, automotive, and communications equipment.
FAQ
What is the maximum operating temperature for SN74LVC2G126YZPR?
The SN74LVC2G126YZPR is rated for continuous operation from –40°C to +125°C ambient temperature. This specification is validated per JEDEC JESD78 latch-up testing and thermal characterization across all recommended VCC conditions (1.65 V to 5.5 V), making SN74LVC2G126YZPR suitable for under-hood automotive and industrial motor-control applications where thermal derating is critical.
Does SN74LVC2G126YZPR support 5-V to 3.3-V level translation?
Yes, SN74LVC2G126YZPR supports bidirectional down-translation: its inputs tolerate up to 5.5 V regardless of VCC, allowing 5-V signals to safely drive the device when powered at 3.3 V or 1.8 V. The output swing remains rail-to-rail relative to VCC, so SN74LVC2G126YZPR outputs 3.3-V logic levels when VCC = 3.3 V - confirmed in Section 6.5 Electrical Characteristics of the datasheet.
What is the purpose of the Ioff feature in SN74LVC2G126YZPR?
The Ioff feature in SN74LVC2G126YZPR disables output buffers and blocks current flow when VCC = 0 V, preventing damaging back-current from live backplanes or powered peripherals into an unpowered device. This enables safe hot insertion in modular systems and protects against partial-power-down faults - a requirement verified per JESD78 Class II latch-up testing and explicitly documented in Section 8.3 Feature Description.
Can SN74LVC2G126YZPR drive LEDs directly?
Yes, SN74LVC2G126YZPR can drive LEDs directly: each output delivers ±24 mA at VCC = 3.3 V, sufficient for standard indicator LEDs or low-current segments. However, current-limiting resistors must be used to prevent exceeding absolute max ratings (±50 mA per output), and thermal limits should be checked under sustained DC load - guidance provided in Section 9.1 Application Information confirms LED driver suitability.
What package type does SN74LVC2G126YZPR use, and what are its dimensions?
SN74LVC2G126YZPR uses an 8-ball DSBGA (Die Size Ball Grid Array) package designated YZP, with nominal body size 1.91 mm × 0.91 mm and 0.5-mm ball pitch. Mechanical drawings and tape-and-reel orientation (Q1 pin 1 quadrant) are specified in TI's PACKAGE MATERIALS INFORMATION document, confirming SN74LVC2G126YZPR's NanoFree™ footprint for ultra-compact PCB designs.
SN74LVC2G126YZPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 8-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DSBGA
SN74LVC2G126YZPR FAQ
1.How can I place an order for SN74LVC2G126YZPR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC2G126YZPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC2G126YZPR reliable?
The price and inventory of SN74LVC2G126YZPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC2G126YZPR is usually 5 days.
3.What payment methods are accepted for SN74LVC2G126YZPR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LVC2G126YZPR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74LVC2G126YZPR?
SN74LVC2G126YZPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74LVC2G126YZPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC2G126YZPR?
For technical support, including SN74LVC2G126YZPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC2G126YZPR requirements.
6.How does Aetrix verify that SN74LVC2G126YZPR is sourced from the original manufacturer or authorized distributors?
All SN74LVC2G126YZPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC2G126YZPR meets industry standards.
7.What is the process for return or replacement of SN74LVC2G126YZPR?
All SN74LVC2G126YZPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC2G126YZPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC2G126YZPR part is unused and in its original packaging.
Return procedure for SN74LVC2G126YZPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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