Texas Instruments SN74LVC2G157YEPR

Overview

SN74LVC2G157YEPR from Texas Instruments is a single 2-line to 1-line data selector multiplexer with true and complementary outputs (Y and Y), designed for 1.65-V to 5.5-V V_CC operation. It features a common strobe (G) input, ±24-mA output drive at 3.3 V, 6 ns max propagation delay at 3.3 V, and I_off support for live insertion and partial-power-down mode. It is used in sensor interface multiplexing on embedded PC and field transmitter PCBs.

For engineers reviewing the SN74LVC2G157YEPR datasheet, SN74LVC2G157YEPR pinout, SN74LVC2G157YEPR application, or SN74LVC2G157YEPR equivalent, key selection considerations include its dual-output configuration, 5.5-V tolerant inputs enabling level translation, low ICC (10 µA max), NanoFree™ DSBGA-8 package footprint, and guaranteed operation across –40°C to +85°C.

Technical Context

The SN74LVC2G157YEPR implements a positive-logic 2:1 multiplexer with active-low strobe control: when G = HIGH, both outputs are forced (Y = LOW, Y = HIGH); when G = LOW, the A/B select line routes either A or B to Y (true) and Y (complementary). Its Standard CMOS inputs accept up to 5.5 V regardless of V_CC, enabling down-translation from higher-voltage domains.

It integrates I_off circuitry that disables outputs during power-down, blocking back-drive current and supporting hot-plug capability. The device uses balanced high-drive CMOS push-pull outputs capable of sourcing/sinking ≥24 mA at 3.3 V while maintaining VOL ≤ 0.55 V and VOH ≥ 2.3 V under load - critical for driving multiple CMOS inputs in space-constrained industrial interfaces.

Key Specifications

Pinout & Package

SN74LVC2G157YEPR is packaged in an 8-pin DSBGA (Die Size Ball Grid Array) with 0.4-mm pitch and nominal body size 1.91 mm × 0.91 mm. The package uses the die as the package (NanoFree™), eliminating leadframe and mold compound for ultra-thin, low-inductance interconnects ideal for portable and space-constrained applications.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 2:1 multiplexer applications.

Compared with SN74LVC2G157DCURG4, SN74LVC2G157YEPR saves >70% board area and improves thermal resistance (R_θJB = 27.8°C/W vs. 208.5°C/W), while 74LVC1G157GW,125 sacrifices functional completeness (no Y) to achieve smaller outline - making SN74LVC2G157YEPR optimal for miniaturized dual-output sensor interfaces.

Availability

SN74LVC2G157YEPR is available at Aetrix Electronics and suitable for embedded PC, field transmitter, and cable solution designs requiring stable component supply, long-term industrial lifecycle support, and RoHS-compliant DSBGA packaging.

Supply support for SN74LVC2G157YEPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in precision analog, power management, and high-reliability logic solutions.

The SN74LVC2G157YEPR belongs to TI's LVC low-voltage CMOS logic family, engineered for robust mixed-signal interfacing in industrial, computing, and communications equipment where voltage translation, low power, and small size are critical.

FAQ

What is the function of the G (strobe) pin on the SN74LVC2G157YEPR?

The G pin is an active-HIGH strobe input that globally controls output state. When G = HIGH, Y is forced LOW and Y is forced HIGH regardless of A/B or data inputs - effectively disabling multiplexing and asserting known logic levels. When G = LOW, the device performs normal 2:1 selection based on A/B. This enables synchronous blanking in time-critical sensor readouts and prevents glitches during mode transitions in the SN74LVC2G157YEPR.

Can the SN74LVC2G157YEPR operate with a 1.8-V supply while interfacing with 5-V sensors?

Yes. The SN74LVC2G157YEPR supports V_CC as low as 1.65 V and accepts input voltages up to 5.5 V on all pins (A, B, A/B, G). When V_CC = 1.8 V, the 5-V sensor signals are safely translated down to 1.8-V logic levels at Y/Y outputs - confirmed by TI's "down translator" specification and 5.5-V absolute maximum input rating. This behavior is intrinsic to the SN74LVC2G157YEPR and requires no external components.

Does the SN74LVC2G157YEPR provide both true and inverted outputs simultaneously?

Yes. The SN74LVC2G157YEPR has two dedicated outputs: Y (true) and Y (inverted/complementary). When G = LOW and A/B selects a source, Y reflects the selected input while Y presents its logical inverse - both updated within the same 6 ns max propagation delay. This dual-output architecture eliminates the need for external inverters in applications requiring redundancy, differential signaling, or glitch-free state detection in the SN74LVC2G157YEPR.

What is the significance of I_off in the SN74LVC2G157YEPR, and how does it benefit system design?

I_off is a power-down protection feature that disables all outputs when V_CC = 0 V, limiting leakage current to ±10 µA. This prevents damaging back-current flow from live system buses into a powered-off SN74LVC2G157YEPR - essential for hot-swap capable modules (e.g., server PSU add-on cards) and battery-backed subsystems where partial power cycling occurs. It also eliminates need for external isolation switches in the SN74LVC2G157YEPR signal path.

Is the SN74LVC2G157YEPR compatible with automated optical inspection (AOI) and X-ray inspection in DSBGA assembly?

Yes. The SN74LVC2G157YEPR's DSBGA-8 package uses solder balls visible from the bottom side, enabling reliable AOI verification of ball placement and coplanarity. Its 0.4-mm pitch and 1.91 mm × 0.91 mm footprint meet IPC-A-610 Class 2/3 standards for micro-BGA inspection. X-ray imaging confirms void-free solder joints beneath the die - validated in TI's NanoFree™ package reliability reports for the SN74LVC2G157YEPR.