Texas Instruments SN74LVC2G17YEAR

Overview

SN74LVC2G17YEAR from Texas Instruments is a dual Schmitt-trigger buffer IC designed for 1.65-V to 5.5-V operation in space-constrained applications. It provides two independent noninverting buffers with hysteresis (ΔVT = 0.4–1.4 V), 5.4-ns max propagation delay at 3.3 V, ±24-mA output drive, and Ioff support for partial-power-down mode. It is used in signal conditioning for noisy digital interfaces such as push-button debouncing and sensor signal cleanup.

For engineers reviewing the SN74LVC2G17YEAR datasheet, SN74LVC2G17YEAR pinout, SN74LVC2G17YEAR application, or SN74LVC2G17YEAR equivalent, key selection criteria include input hysteresis thresholds (VT+ = 1.3–3.1 V, VT– = 0.6–2.5 V at 3–5.5 V), WCSP YEA package dimensions (1.0 × 1.0 mm, 0.17-mm bump), and Ioff-enabled backflow protection during power sequencing.

Technical Context

This device implements two independent noninverting Schmitt-trigger buffers with asymmetric input thresholds-VT+ exceeds VT– by 0.4–1.4 V-to reject noise on slow-rising or oscillatory signals. Each channel operates across 1.65–5.5 V VCC and accepts inputs up to 5.5 V regardless of supply level.

The SN74LVC2G17YEAR uses NanoStar™ WCSP packaging: the silicon die serves as the package, with solder bumps forming terminals. Its Ioff circuitry actively disables outputs when VCC = 0 V, blocking current flow from live inputs into a powered-down system-a critical feature for hot-swap and multi-rail power domains.

Key Specifications

Pinout & Package

SN74LVC2G17YEAR uses a 6-bump NanoStar™ WCSP (YEA) package measuring 1.0 mm × 1.0 mm with 0.17-mm solder bumps. Pin 1 is identified by a SnPb bump (marked "1"); Pb-free variants use "•". The bottom-view layout places functional terminals directly under the die.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual Schmitt-trigger buffer applications.

Compared with SN74LVC2G17YEAR, SN74LVC2G17YZAR offers identical performance in a RoHS-compliant package, while SN74LVC2G17DBVR trades miniaturization for mechanical robustness and ease of handling-enabling faster validation cycles before committing to WCSP placement.

Availability

SN74LVC2G17YEAR is available at Aetrix Electronics and suitable for industrial HMI interfaces, battery-powered sensor nodes, multi-rail power sequencers, and FPGA I/O conditioning requiring stable component supply and verified WCSP handling capability.

Supply support for SN74LVC2G17YEAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and logic solutions, with over 90 years of innovation in industrial, automotive, and consumer electronics.

The SN74LVC2G17YEAR belongs to TI's LVC logic family-designed for low-voltage, high-noise-immunity digital interfacing in space- and power-constrained systems where reliability across voltage domains is essential.

FAQ

What is the function of SN74LVC2G17YEAR?

The SN74LVC2G17YEAR is a dual noninverting Schmitt-trigger buffer. Each channel performs Y = A with hysteresis, meaning it has different input thresholds for rising (VT+) and falling (VT–) edges. This function enables noise rejection on slow or noisy signals-such as mechanical switch inputs or analog sensor outputs-while delivering clean CMOS-compatible outputs. Its design ensures reliable logic-level translation without oscillation near threshold voltages.

Does SN74LVC2G17YEAR support partial-power-down operation?

Yes, SN74LVC2G17YEAR supports partial-power-down operation via its Ioff feature. When VCC = 0 V, the Ioff circuitry disables both outputs, limiting input/output leakage to ±10 µA maximum. This prevents current backflow from live inputs into a powered-down system-critical for hot-swap applications, multi-rail power sequencing, and systems with standby modes. The feature is inherent to the silicon design and requires no external control.

What are the input hysteresis values for SN74LVC2G17YEAR?

SN74LVC2G17YEAR provides programmable hysteresis through VCC scaling: at VCC = 3.0 V, VT+ = 1.3–2.2 V and VT– = 0.6–1.3 V, yielding ΔVT = 0.4–1.1 V; at VCC = 5.5 V, VT+ = 2.2–3.7 V and VT– = 1.4–2.5 V, giving ΔVT = 0.7–1.4 V. These values are measured across –40°C to 85°C and ensure consistent noise margin regardless of supply voltage within the 1.65–5.5 V operating range.

Can SN74LVC2G17YEAR accept 5-V inputs while operating at 1.8-V VCC?

Yes, SN74LVC2G17YEAR accepts input voltages up to 5.5 V independent of VCC level-including when VCC = 1.65 V or 1.8 V. This 5-V-tolerant input capability allows direct interfacing with legacy 5-V logic, microcontroller GPIOs, or sensor outputs without level-shifting resistors. The internal protection clamps ensure no damage occurs, and the Schmitt action remains fully functional across the full input range.

What is the package type and size of SN74LVC2G17YEAR?

SN74LVC2G17YEAR uses a NanoStar™ WCSP (Wafer Chip Scale Package) with YEA designation: a 1.0 mm × 1.0 mm footprint, 6 solder bumps, and 0.17-mm bump height. Pin 1 is marked with an SnPb bump ("1"). This ultra-compact package eliminates leads and wire bonds-reducing parasitic inductance and enabling placement directly beneath fine-pitch BGAs or in ultra-thin wearable assemblies where board area is at a premium.