Texas Instruments SN74LVC2G17YZPR
- Part No.:
- SN74LVC2G17YZPR
- Manufacturer:
- Texas Instruments
- Package:
- 6-XFBGA, DSBGA
- Datasheet:
-
SN74LVC2G17YZPR.pdf
- Description:
- IC BUF NON-INVERT 5.5V 6DSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74LVC2G17YZPR from Texas Instruments is a dual Schmitt-trigger buffer IC designed for 1.65 V to 5.5 V operation, delivering ±24 mA output drive at 3.3 V, 5.4 ns max propagation delay at 3.3 V, and 5.5 V-tolerant inputs - used in noise-prone signal conditioning paths of portable audio docks and SSD power sequencing circuits.
For engineers reviewing the SN74LVC2G17YZPR datasheet, SN74LVC2G17YZPR pinout, SN74LVC2G17YZPR application, or SN74LVC2G17YZPR equivalent, key selection criteria include Schmitt-trigger hysteresis (ΔVT = 0.4–1.4 V), Ioff-enabled live insertion support, NanoFree™ DSBGA-6 package footprint, and 1.65 V minimum VCC compatibility for low-voltage system interfacing.
Technical Context
This device implements two independent noninverting buffers with Schmitt-trigger inputs, enabling robust noise immunity via distinct VT+ (1.3–3.7 V) and VT– (0.8–2.5 V) thresholds across 1.65–5.5 V VCC. Each channel supports down-translation (e.g., 5 V input → 3.3 V output) without level shifters.
The Ioff circuitry actively disables outputs when VCC = 0 V, blocking back-drive current up to ±10 μA and supporting partial-power-down systems. Input tolerance to 5.5 V allows direct connection to legacy 5 V buses while operating from 1.8 V or 2.5 V rails.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 5.5 V - enables single-supply operation across 1.8 V, 2.5 V, 3.3 V, and 5 V logic domains |
| Max tpd | 5.4 ns at 3.3 V - ensures timing-critical signal buffering in high-speed digital interfaces |
| Output Drive | ±24 mA at 3.3 V - drives moderate capacitive loads (e.g., PCB traces, multiple gate inputs) without external buffers |
| Hysteresis ΔVT | 0.4 V to 1.4 V - rejects noise spikes up to 1.4 V peak-to-peak on slow-rising/falling signals |
| Ioff Current | ±10 μA max - prevents damaging back-current during hot-swap or power sequencing events |
| Input Voltage Tolerance | Up to 5.5 V - permits interfacing with 5 V sources while powered from lower VCC rails |
| ESD Rating | 2000 V HBM - meets industrial-grade electrostatic discharge immunity requirements |
Pinout & Package
SN74LVC2G17YZPR uses a 6-ball DSBGA (Die Size Ball Grid Array) package measuring 1.41 mm × 0.91 mm, with bottom-side ball layout optimized for minimal PCB area and thermal performance in space-constrained portable designs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A | Input 1 | Noninverting Schmitt-trigger input for first buffer channel; accepts 0–5.5 V regardless of VCC |
| GND | Ground | Reference node for all I/O and internal logic; must be low-impedance for stable hysteresis thresholds |
| 2A | Input 2 | Noninverting Schmitt-trigger input for second buffer channel; electrically isolated from 1A |
| 1Y | Output 1 | Buffered, noise-immunized replica of 1A; driven by CMOS output stage with rail-to-rail swing |
| VCC | Power Pin | Primary supply for logic core and output drivers; powers Ioff circuitry when active |
| 2Y | Output 2 | Buffered, noise-immunized replica of 2A; independent of 1Y timing and loading behavior |
Key Features
| Feature | Design Value |
|---|---|
| Schmitt-trigger inputs | Provides 0.4–1.4 V hysteresis to reject EMI and contact bounce in mechanical switch debouncing |
| NanoFree™ DSBGA-6 | 1.41 mm × 0.91 mm die-as-package footprint reduces board area by >50% vs. SOT-23 and improves thermal resistance (RθJA = 123°C/W) |
| Ioff partial-power-down | Enables safe insertion into live backplanes or hot-pluggable modules without disrupting upstream logic |
| 5.5 V-tolerant inputs | Eliminates need for external level translators when interfacing 5 V sensors or controllers to 1.8/2.5 V microcontrollers |
| Low ICC | 10 μA max quiescent current supports battery-powered applications requiring multi-year standby life |
Applications
| Audio Dock Signal Conditioning | SSD Power Sequencing Control |
|---|---|
|
Use Scenario: Clean switching of analog audio line-level signals in portable USB-C audio docks where ground bounce and EMI degrade fidelity. IC Role / Device Role / Timing Role: Dual Schmitt-trigger buffer isolates noisy MCU GPIOs from sensitive audio path; each channel conditions one stereo channel's mute or enable signal. Use Value: Hysteresis suppresses sub-1.4 V noise transients induced by shared PCB ground planes, preventing audible click/pop artifacts during playback transitions. |
Use Scenario: Reliable power-up sequencing of NAND flash and controller rails in client SSDs where voltage ramp rates vary across temperature. IC Role / Device Role / Timing Role: Buffers delayed reset or enable signals from PMICs to SSD controller, ensuring monotonic, glitch-free power-on timing. Use Value: 5.5 V-tolerant inputs accept PMIC open-drain outputs directly; Ioff prevents backfeed during staggered rail activation sequences. |
| Tablet Touch Controller Interface | Wireless Headset Button Debounce |
|
Use Scenario: Interfacing resistive touch panel interrupt lines to low-voltage tablet SoCs in high-noise RF environments near Wi-Fi/BT antennas. IC Role / Device Role / Timing Role: Converts slow-rising/falling touch-interrupt pulses into clean, fast CMOS-compatible edges for SoC GPIO sampling. Use Value: VT+ and VT– thresholds track VCC changes, maintaining consistent noise margin across 1.65–5.5 V supply range during dynamic DVFS operation. |
Use Scenario: Debouncing mechanical volume/mute buttons in Bluetooth headsets where battery voltage drops from 4.2 V to 3.0 V over discharge cycle. IC Role / Device Role / Timing Role: Schmitt-trigger input cleans button bounce; buffered output drives headset MCU GPIO with rail-aligned logic levels. Use Value: 1.65 V minimum VCC allows operation down to depleted battery voltages without signal degradation or false triggers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual Schmitt-trigger buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC2G17DBVR | SOT-23-6 package (2.90 mm × 1.60 mm); higher RθJA (165°C/W); same electrical specs and pinout | Preferred for prototyping or manual assembly due to larger footprint and solderability; less suitable for ultra-thin tablets | Select when board real estate is not constrained and hand-soldering or test fixture access is required. |
| SN74LVC1G17YZPR | Single-channel version in identical DSBGA-6 package; half the channel count; same VCC range and hysteresis | Used where only one buffered Schmitt input is needed - e.g., single-button interface or single enable line | Choose when system requires only one buffer to reduce BOM count and simplify routing on dense layouts. |
Compared with SN74LVC2G17DBVR and SN74LVC1G17YZPR, the SN74LVC2G17YZPR uniquely delivers dual-channel Schmitt buffering in the smallest possible footprint (1.41 mm × 0.91 mm), making it optimal for space-limited portable devices requiring two independent noise-immune signal paths.
Availability
SN74LVC2G17YZPR is available at Aetrix Electronics and suitable for audio docks, SSDs, tablets, and wireless headsets requiring stable component supply, long-term lifecycle support, and RoHS-compliant packaging.
Supply support for SN74LVC2G17YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in precision analog, power management, and logic solutions.
The SN74LVC2G17YZPR belongs to TI's LVC low-voltage CMOS logic family, engineered for interoperability across mixed-voltage systems and robust operation in portable, battery-powered, and noise-sensitive applications.
FAQ
What is the operating temperature range for SN74LVC2G17YZPR?
The SN74LVC2G17YZPR is specified for operation from –40°C to +85°C ambient temperature, as confirmed in the TI orderable addendum. This range is narrower than the –40°C to +125°C rating of other SN74LVC2G17 variants (e.g., DBVR, DCKR), reflecting its DSBGA package's thermal limitations and target use in consumer portable devices.
Does SN74LVC2G17YZPR support 5 V input signals while powered from 1.8 V?
Yes, SN74LVC2G17YZPR supports 5 V-tolerant inputs - its inputs accept voltages up to 5.5 V regardless of VCC level. When powered from 1.8 V, it correctly buffers 5 V signals to 1.8 V logic levels, enabling seamless level translation without external components.
What is the significance of the "YZP" in SN74LVC2G17YZPR?
"YZP" denotes the DSBGA (Die Size Ball Grid Array) package type per TI's package coding. SN74LVC2G17YZPR uses a 6-ball, 1.41 mm × 0.91 mm NanoFree™ package where the silicon die itself forms the package substrate - eliminating wire bonds and leadframe for minimal size and improved thermal performance.
How does the Ioff feature function in SN74LVC2G17YZPR?
The Ioff feature in SN74LVC2G17YZPR disables output drivers when VCC = 0 V, limiting Ioff current to ±10 μA maximum. This prevents back-driving of powered-down sections in modular systems - critical for hot-plug SSD modules or field-replaceable audio dock components where SN74LVC2G17YZPR maintains signal integrity during partial power cycles.
Can SN74LVC2G17YZPR replace SN74LVC2G17DBVR in an existing design?
SN74LVC2G17YZPR is functionally identical to SN74LVC2G17DBVR but uses a different package (DSBGA vs. SOT-23). Pin assignments match (1A/GND/2A/2Y/VCC/1Y), so electrical replacement is valid. However, rework is required due to incompatible footprints, solder paste profiles, and thermal pad requirements - redesign verification is mandatory before substitution.
SN74LVC2G17YZPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 6-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 1
- Input Type:
- Schmitt Trigger
- Output Type:
- Push-Pull
- Current - Output High, Low:
- 32mA, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-DSBGA
SN74LVC2G17YZPR FAQ
1.How can I place an order for SN74LVC2G17YZPR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC2G17YZPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC2G17YZPR reliable?
The price and inventory of SN74LVC2G17YZPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC2G17YZPR is usually 5 days.
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SN74LVC2G17YZPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74LVC2G17YZPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC2G17YZPR?
For technical support, including SN74LVC2G17YZPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC2G17YZPR requirements.
6.How does Aetrix verify that SN74LVC2G17YZPR is sourced from the original manufacturer or authorized distributors?
All SN74LVC2G17YZPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC2G17YZPR meets industry standards.
7.What is the process for return or replacement of SN74LVC2G17YZPR?
All SN74LVC2G17YZPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC2G17YZPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC2G17YZPR part is unused and in its original packaging.
Return procedure for SN74LVC2G17YZPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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