Texas Instruments SN74LVC2G240YZPR

Overview

SN74LVC2G240YZPR from Texas Instruments is a dual noninverting buffer/driver with 3-state outputs, designed for 1.65-V to 5.5-V VCC operation. It features ±24-mA output drive at 3.3 V, 4.6-ns max propagation delay (tpd) at 3.3 V, and Ioff support for live insertion and partial-power-down. It serves as a level-translating bus driver in compact portable electronics and low-voltage microcontroller I/O expansion.

For engineers reviewing the SN74LVC2G240YZPR datasheet, SN74LVC2G240YZPR pinout, SN74LVC2G240YZPR application, or SN74LVC2G240YZPR equivalent, key selection criteria include its DSBGA (YZP) 8-ball package, 3-state control per channel via independent OE inputs, 5.5-V tolerant inputs, and NanoFree™ die-as-package construction enabling ultra-small footprint and thermal performance.

Technical Context

This device implements two independent noninverting buffers, each with dedicated output-enable (OE) logic controlling high-impedance state entry/exit. The Ioff circuitry actively disables outputs during power-down, preventing back-drive current and supporting hot-plug capability.

Input voltage tolerance up to 5.5 V enables down-translation from higher-voltage domains (e.g., 5-V logic) to lower VCC rails (e.g., 1.8 V or 3.3 V), while VOLP < 0.8 V and VOHV > 2 V at 3.3 V ensure robust noise margin in high-speed digital interfaces.

Key Specifications

Pinout & Package

SN74LVC2G240YZPR uses an 8-ball DSBGA (YZP) package measuring 1.5 mm × 1.5 mm × 0.5 mm max height, with bottom-side ball layout optimized for minimal PCB area and thermal resistance (θJA = 102°C/W).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 3-state buffer applications.

Compared with SN74LVC2G240DCUR and SN74LVC2G240DCTR, the SN74LVC2G240YZPR delivers the smallest footprint and best thermal performance, making it optimal for ultra-compact, thermally demanding designs where BGA assembly is available - though it requires tighter process control for solder joint reliability.

Availability

SN74LVC2G240YZPR is available at Aetrix Electronics and suitable for portable electronics, automotive camera modules, and medical wearables requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.

Supply support for SN74LVC2G240YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in precision logic and low-power interface solutions.

The SN74LVC2G240YZPR belongs to TI's LVC logic family, engineered for high-speed, low-voltage operation in space-constrained applications - emphasizing signal integrity, voltage translation, and power-aware design for portable and industrial systems.

FAQ

What is the recommended power-up sequence for SN74LVC2G240YZPR to avoid output contention?

TI specifies that OE inputs must be held high (disabled) until VCC reaches valid operating range. For SN74LVC2G240YZPR, tie both 1OE and 2OE to VCC through a 10-kΩ pullup resistor. This ensures outputs remain in high-impedance state during power ramp-up, preventing bus conflicts or latch-up in multi-driver systems.

Can SN74LVC2G240YZPR safely interface a 5-V microcontroller GPIO with a 1.8-V FPGA I/O bank?

Yes. SN74LVC2G240YZPR accepts input voltages up to 5.5 V independent of VCC, so its A inputs can directly connect to 5-V MCU outputs. With VCC = 1.8 V, it outputs 0–1.8 V logic levels compatible with 1.8-V FPGA inputs - confirmed by VIH/VIL thresholds and VOH/VOL specs in the datasheet.

Does SN74LVC2G240YZPR support hot-swap or live-insertion in backplane applications?

Yes. SN74LVC2G240YZPR incorporates Ioff circuitry that disables outputs when VCC = 0 V, limiting off-state leakage to ±10 µA. This prevents damaging current flow from live backplane traces into unpowered boards - a requirement verified per JESD78 Class II latch-up testing.

What is the maximum capacitive load SN74LVC2G240YZPR can drive while maintaining 4.6-ns propagation delay?

At VCC = 3.3 V, SN74LVC2G240YZPR maintains its 4.6-ns max tpd specification driving a 50-pF load, as defined in the Switching Characteristics table. For heavier loads (>50 pF), propagation delay increases linearly - e.g., ~6.8 ns at 100 pF - requiring timing margin analysis in high-speed bus designs.

How does the NanoFree™ DSBGA package of SN74LVC2G240YZPR improve thermal performance over SSOP or VSSOP variants?

SN74LVC2G240YZPR's NanoFree™ DSBGA achieves θJA = 102°C/W - significantly lower than 220°C/W (DCT) or 227°C/W (DCU) - due to direct silicon-to-PCB thermal path via solder balls. This enables sustained 24-mA output drive at 125°C ambient without derating, unlike leaded packages limited by plastic body thermal resistance.