Texas Instruments SN74LVC2G241YZAR

Overview

SN74LVC2G241 from Texas Instruments is a dual 1-bit noninverting buffer/driver with independent 3-state outputs, designed for 1.65-V to 5.5-V V_CC operation. It delivers ±24-mA output drive at 3.3 V, achieves 4.1-ns max propagation delay, supports 5.5-V tolerant inputs, and features I_off for live insertion and partial-power-down protection - used in bus interface redriving and memory-address buffering in compact consumer electronics.

For engineers reviewing the SN74LVC2G241 datasheet, SN74LVC2G241 pinout, SN74LVC2G241 application, or SN74LVC2G241 equivalent, key selection criteria include its dual-channel 3-state control (1OE active-low, 2OE active-high), NanoFree™ DSBGA-8 package footprint (1.91 mm × 0.91 mm), 10-µA max ICC, and compatibility with mixed-voltage systems up to 5.5 V input level.

Technical Context

The SN74LVC2G241 implements two independent CMOS buffer channels, each with separate output-enable control: Gate 1 enables on low at 1OE, Gate 2 enables on high at 2OE. Its I_off circuitry actively disables outputs during power-down, blocking back-current flow when V_CC = 0 V while inputs remain biased up to 5.5 V.

It operates across –40°C to 125°C, supports down-translation (5.5-V inputs to V_CC-level outputs), and meets JESD 78 Class II latch-up (>100 mA) and JESD 22 ESD ratings (±2000-V HBM, ±1000-V CDM). Propagation delay scales with V_CC: 4.3 ns typical at 3.3 V, 4.0 ns at 5 V.

Key Specifications

Pinout & Package

SN74LVC2G241YZAR uses the Texas Instruments NanoFree™ DSBGA-8 (YZP) package: 1.91 mm × 0.91 mm, bottom-terminal, 0.4-mm pitch, no leadframe - die-as-package construction optimized for ultra-compact PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual 3-state buffer applications.

Compared with SN74LVC2G241YZAR, SN74LVC2G125YZPR offers simpler enable control but loses flexible bus arbitration capability, while 74LVC2G240YZPR provides identical drive and timing but inverts signal polarity - making SN74LVC2G241YZAR uniquely suited for noninverting, asymmetric 3-state applications in ultra-compact designs.

Availability

SN74LVC2G241YZAR is available at Aetrix Electronics and suitable for AV receivers, portable media players, digital video cameras, and GPS navigation devices requiring stable component supply, long-term lifecycle support, and ultra-small-footprint logic solutions.

Supply support for SN74LVC2G241YZAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic ICs, with decades of innovation in low-power, high-density logic solutions.

The SN74LVC2G241 belongs to TI's LVC (Low-Voltage CMOS) logic family, engineered for mixed-voltage interfacing, space-constrained consumer and portable electronics, and robust operation across extended temperature ranges.

FAQ

What is the function of the 1OE and 2OE pins on the SN74LVC2G241YZAR?

The SN74LVC2G241YZAR uses asymmetric output-enable logic: 1OE is active-low (output enabled when low), and 2OE is active-high (output enabled when high). This allows independent, complementary control of the two buffer channels - essential for bidirectional bus applications where one channel drives while the other remains in high-impedance state. Both OE pins must be externally biased during power-up to avoid undefined output states.

Can SN74LVC2G241YZAR interface a 5-V signal with a 1.8-V microcontroller?

Yes. The SN74LVC2G241YZAR accepts input voltages up to 5.5 V regardless of V_CC level, making it ideal for down-translation. When powered at 1.8 V, it safely buffers 5-V inputs and outputs logic-level signals compatible with 1.8-V I/O - no external level shifters or clamping required. This capability is explicitly verified in TI's recommended operating conditions table.

What package type does SN74LVC2G241YZAR use, and why is it significant?

SN74LVC2G241YZAR uses the NanoFree™ DSBGA-8 (YZP) package: 1.91 mm × 0.91 mm, 0.4-mm pitch, bottom-terminal die-as-package construction. Its significance lies in ultra-minimal PCB footprint, reduced parasitic inductance/capacitance, and elimination of leadframe-related signal degradation - critical for high-frequency signal integrity in portable and wearable electronics where board space is at a premium.

Does SN74LVC2G241YZAR support partial power-down operation?

Yes. The SN74LVC2G241YZAR incorporates I_off circuitry that disables outputs and limits leakage to ±10 µA when V_CC = 0 V, even with inputs biased up to 5.5 V. This feature enables safe live insertion, hot-swap capability, and partial-power-down modes in modular systems - a requirement validated per JESD 78 Class II latch-up and JESD 22 ESD standards.

What is the maximum output current drive capability of SN74LVC2G241YZAR at 3.3 V?

At V_CC = 3.3 V, the SN74LVC2G241YZAR delivers ±24 mA per output (I_OH/I_OL) - verified under switching characteristics testing. This drive strength supports driving 50-pF loads with controlled edge rates and minimal ground bounce (<0.8 V typical VOLP), enabling reliable redriving of weak signals across long PCB traces in consumer audio/video equipment.