Texas Instruments SN74LVC2G80YZPR

Overview

SN74LVC2G80YZPR from Texas Instruments is a dual positive-edge-triggered D-type flip-flop in an 8-ball DSBGA (YZP) package, supporting 1.65-V to 5.5-V V_CC operation, with 4.2 ns max propagation delay at 3.3 V and I_off support for live insertion. It serves as a compact, low-power storage element in high-speed digital interfaces and clock-domain crossing circuits.

For engineers reviewing the SN74LVC2G80YZPR datasheet, SN74LVC2G80YZPR pinout, SN74LVC2G80YZPR application, or SN74LVC2G80YZPR equivalent, key selection criteria include voltage range compatibility (1.65–5.5 V), edge-triggered dual-DFF functionality, NanoFree™ package constraints, and I_off-enabled partial power-down behavior in mixed-voltage systems.

Technical Context

This device implements two independent, non-inverting D-type flip-flops, each triggered on the rising edge of its dedicated clock input (1CLK, 2CLK). Data setup (t_su) and hold (t_h) times are specified down to 0.9 ns and 0.6 ns respectively at 5.5 V, enabling reliable operation up to 160 MHz clock frequency across the full temperature range.

It features I_off circuitry that disables outputs and blocks current backflow when V_CC = 0 V, supporting hot-plug and partial-power-down use cases. Input tolerance extends to 5.5 V regardless of V_CC, allowing level translation between 1.8-V, 2.5-V, 3.3-V, and 5-V logic domains.

Key Specifications

Pinout & Package

SN74LVC2G80YZPR uses an 8-ball DSBGA (YZP) package measuring 1.5 mm × 1.5 mm × 0.5 mm max height, with bottom-side ball layout optimized for space-constrained PCBs. The NanoFree™ construction places the silicon die directly into the package, eliminating wirebonds and reducing parasitic inductance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual D-type flip-flop applications.

Compared with SN74LVC2G74YZPR and SN74LVC1G80YZPR, SN74LVC2G80YZPR delivers two independent, non-inverting DFFs in one ultra-small package-reducing BOM count and PCB area by 50% versus dual-single solutions while maintaining identical electrical performance and thermal characteristics.

Availability

SN74LVC2G80YZPR is available at Aetrix Electronics and suitable for industrial PLC I/O expansion, USB-C power delivery controller interface, automotive body control modules, and wearable sensor hub data pipelines requiring stable component supply and long-term lifecycle assurance.

Supply support for SN74LVC2G80YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic devices, with over 90 years of innovation in high-reliability electronic components.

The SN74LVC2G80YZPR belongs to TI's LVC logic family designed for low-voltage, high-speed, mixed-signal interfacing in space- and power-constrained applications-from portable electronics to automotive control units.

FAQ

What is the maximum operating temperature for SN74LVC2G80YZPR?

The SN74LVC2G80YZPR is rated for operation from –40°C to +85°C. This specification is defined in the PACKAGE OPTION ADDENDUM and confirmed in the Recommended Operating Conditions table of the SCES309F datasheet. The YZP package variant has a narrower thermal range than DCT/DCU versions (which extend to +125°C), making SN74LVC2G80YZPR suitable for industrial and consumer applications but not extended-temperature automotive under-hood use. Always verify ambient and junction temperature margins in final layout.

Does SN74LVC2G80YZPR support 5-V logic inputs when powered from 1.8 V?

Yes, SN74LVC2G80YZPR supports 5-V tolerant inputs across its full V_CC range (1.65 V to 5.5 V). Per the Absolute Maximum Ratings and Recommended Operating Conditions tables, VI can reach 5.5 V regardless of applied V_CC. This allows direct connection of 5-V signals-such as from legacy microcontrollers or sensors-to SN74LVC2G80YZPR's 1D, 2D, 1CLK, and 2CLK pins without external level shifters, simplifying mixed-voltage system design.

What is the purpose of the I_off feature in SN74LVC2G80YZPR?

The I_off feature in SN74LVC2G80YZPR disables all outputs and blocks current backflow when V_CC = 0 V, preventing damaging reverse current through the device during live insertion, partial power-down, or hot-swap events. As documented in the FEATURES section and Electrical Characteristics table, I_off remains below ±10 μA under these conditions. This eliminates the need for external isolation circuitry in modular systems where boards may be inserted or removed while other sections remain powered.

How does the NanoFree™ packaging of SN74LVC2G80YZPR benefit PCB layout?

The NanoFree™ DSBGA (YZP) package of SN74LVC2G80YZPR replaces traditional leadframes and wirebonds with a die-as-package structure, resulting in a 1.5 mm × 1.5 mm footprint and 0.5 mm max height. As shown in the PACKAGE OUTLINE drawing, this reduces pad area by >60% versus SSOP alternatives and lowers parasitic inductance-improving signal integrity in high-speed clock paths. Its bottom-terminal layout also simplifies routing and supports fine-pitch PCB assembly with standard 0.1 mm stencil apertures.

Can SN74LVC2G80YZPR replace SN74LVC2G74YZPR in a design?

No, SN74LVC2G80YZPR cannot directly replace SN74LVC2G74YZPR because they differ fundamentally in function: SN74LVC2G80YZPR is a dual non-inverting D-type flip-flop, while SN74LVC2G74YZPR is a single D-type flip-flop with complementary Q and Q̅ outputs. Although both share the same YZP package, pinout, and voltage specs, SN74LVC2G80YZPR lacks Q̅ outputs and provides two independent clock/data/output pairs instead of one. Substitution would require redesigning signal routing and logic partitioning.