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Texas Instruments SN74LVC3G07YEPR
- Part No.:
- SN74LVC3G07YEPR
- Manufacturer:
- Texas Instruments
- Package:
- 8-XFBGA, DSBGA
- Datasheet:
-
SN74LVC3G07YEPR.pdf
- Description:
- IC BUF NON-INVERT 5.5V 8DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,434
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Product details
Overview
SN74LVC3G07YEPR from Texas Instruments is a triple non-inverting buffer/driver with open-drain outputs, designed for 1.65-V to 5.5-V VCC operation. It delivers 3.7 ns max propagation delay at 3.3 V, ±24-mA output sink drive, and supports Ioff partial-power-down protection. It enables wired-OR logic in level-shifting I²C, SMBus, and GPIO expansion applications.
For engineers reviewing the SN74LVC3G07YEPR datasheet, SN74LVC3G07YEPR pinout, SN74LVC3G07YEPR application, or SN74LVC3G07YEPR equivalent, key selection criteria include open-drain compatibility with 5.5-V tolerant inputs, Ioff-enabled live insertion, thermal performance in DSBGA (YZP) package, and verified 32-mA max sink capability per channel.
Technical Context
This device implements three independent non-inverting buffers, each with an open-drain output stage capable of sinking up to 32 mA at VCC = 4.5 V. Its Ioff circuitry actively disables outputs during power-down, blocking back-current flow when VCC = 0 V.
The input structure accepts voltages up to 5.5 V regardless of VCC level-enabling robust level translation between 1.8-V, 2.5-V, 3.3-V, and 5-V domains. Output VOL remains ≤0.55 V at IOL = 24 mA and VCC = 3 V, ensuring reliable low-state signaling into standard pull-up networks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 5.5 V - Enables interoperability across mixed-voltage systems without external level shifters. |
| Max tpd | 3.7 ns at VCC = 3.3 V - Supports >100-MHz digital control timing in fast GPIO or clock-enable paths. |
| IOL Max | 32 mA at VCC = 4.5 V - Drives standard 10-kΩ pull-ups to 3.3 V or 5 V with <0.55-V residual drop. |
| Ioff Current | ±10 μA max - Prevents damaging backflow during hot-swap or partial-power-down sequences. |
| Input Voltage Tolerance | Up to 5.5 V - Allows direct connection to 5-V buses while powered from 1.8-V or 2.5-V rails. |
| ESD Rating | 2000-V HBM - Meets industrial-grade robustness requirements for board-level handling and field operation. |
| Operating Temp | –40°C to +85°C - Qualified for commercial and extended-temperature embedded control environments. |
Pinout & Package
SN74LVC3G07YEPR is packaged in an 8-ball DSBGA (YZP) measuring 1.5 mm × 1.5 mm × 0.5 mm max height, optimized for space-constrained portable and wearables designs. The package uses solder-bump interconnects and exposes no thermal pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A, 2A, 3A | Buffer Input | Three independent CMOS-compatible inputs accepting 0–5.5 V; internally pulled down when floating but must be externally tied to VCC or GND per TI SCBA004. |
| 1Y, 2Y, 3Y | Open-Drain Output | Three independent N-channel open-drain outputs; require external pull-up to define high state; support wired-AND/OR logic and bus arbitration. |
| VCC | Supply Rail | Single positive supply input (1.65–5.5 V); powers internal logic and enables Ioff control; not connected to output FET source. |
| GND | Ground Reference | Logic and output-stage return path; must be low-impedance to minimize ground bounce (VOLP < 0.8 V typical). |
Key Features
| Feature | Design Value |
|---|---|
| NanoFree™ DSBGA packaging | Diesize-only footprint (1.5 mm × 1.5 mm) eliminates leadframe, reducing parasitic inductance and PCB area by >50% vs. SSOP/DCT. |
| Ioff partial-power-down | Enables safe insertion into live backplanes or hot-pluggable modules without disrupting adjacent powered circuitry. |
| 5.5-V tolerant inputs | Eliminates need for discrete level translators when interfacing 5-V sensors or legacy peripherals to low-voltage MCUs. |
| Open-drain output architecture | Supports bidirectional bus protocols (I²C, SMBus), active-low interrupt aggregation, and voltage-independent logic combining. |
| Low ICC (10 μA max) | Reduces quiescent power in always-on subsystems such as battery-backed real-time clocks or sensor hubs. |
Applications
| I²C Bus Level Translation | GPIO Expansion Interface |
|---|---|
Use Scenario: Translating signals between a 1.8-V microcontroller and 3.3-V I²C peripherals (e.g., EEPROM, temperature sensor). IC Role / Device Role / Timing Role: Acts as unidirectional open-drain buffer on SDA/SCL lines, enabling voltage-domain isolation while preserving bus timing integrity. Use Value: Eliminates discrete MOSFET translators; maintains <3.7 ns propagation delay to avoid violating I²C setup/hold margins at 400 kHz. |
Use Scenario: Expanding MCU GPIO count to drive LEDs, relays, or status indicators in compact IoT edge nodes. IC Role / Device Role / Timing Role: Provides three independently controllable open-drain outputs, each sinking up to 32 mA to directly drive common-anode LEDs or optocouplers. Use Value: Reduces BOM count versus discrete transistor arrays; leverages Ioff to prevent leakage when host MCU enters deep sleep mode. |
| Hot-Swappable Module Control | Wired-OR Interrupt Aggregation |
Use Scenario: Enabling safe insertion/removal of daughterboards in industrial PLC backplanes operating at 3.3 V or 5 V. IC Role / Device Role / Timing Role: Buffers enable/disable signals and status lines with Ioff protection, preventing backfeed into powered main controller during insertion. Use Value: Meets IEC 61000-4-2 ESD immunity requirements (2000-V HBM) and avoids system reset due to transient coupling during hot-swap events. |
Use Scenario: Combining multiple interrupt sources (e.g., sensor faults, watchdog timeouts, power alerts) onto a single MCU IRQ line. IC Role / Device Role / Timing Role: Each buffer input monitors a separate fault signal; outputs tied together form active-low wired-OR node pulled up to MCU VDD. Use Value: Ensures sub-4 ns response time from any asserted interrupt; tolerates mixed-voltage sources (1.8 V to 5 V) without clamping diodes or additional components. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar open-drain buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC3G07DCUR | VSSOP-8 (DCU) package; 2.4 mm × 2.2 mm body; 0.5-mm pitch; higher θJA (227°C/W) than YZP. | Better suited for prototyping or manual assembly; less optimal for ultra-dense layouts than YZP. | Select DCUR when board rework or test probing is required; YZP preferred for production miniaturization. |
| SN74LVC1G07DBVR | Single-channel version in SOT-23-5; identical electrical specs per channel; no multi-buffer integration. | Requires three units to match SN74LVC3G07YEPR's triple functionality; increases layout area and solder joints. | Choose DBVR only if design requires channel-by-channel replacement or incremental scalability. |
Compared with SN74LVC3G07DCUR and SN74LVC1G07DBVR, SN74LVC3G07YEPR offers the smallest footprint (1.5 mm²), lowest thermal resistance (θJA = 102°C/W), and highest integration density-making it optimal for space- and thermal-constrained applications where all three buffers are used concurrently.
Availability
SN74LVC3G07YEPR is available at Aetrix Electronics and suitable for I²C level translation, GPIO expansion, hot-swap control, and wired-OR interrupt aggregation requiring stable component supply across industrial, automotive, and consumer electronics programs.
Supply support for SN74LVC3G07YEPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability silicon solutions.
The SN74LVC3G07YEPR belongs to TI's LVC logic family-designed specifically for low-voltage, high-speed, mixed-signal interface applications demanding robust voltage translation, low power, and small-form-factor packaging.
FAQ
What is the maximum sink current per output of the SN74LVC3G07YEPR?
The SN74LVC3G07YEPR supports up to 32 mA sink current per output (IOL) when VCC = 4.5 V, as specified in the Recommended Operating Conditions table. At VCC = 3 V, the rated sink current is 24 mA. These values ensure reliable driving of standard pull-up resistors in I²C and SMBus applications without exceeding VOL limits.
Does the SN74LVC3G07YEPR support level shifting between different supply voltages?
Yes, the SN74LVC3G07YEPR supports true bidirectional level shifting via its 5.5-V tolerant inputs and open-drain outputs. Inputs accept voltages up to 5.5 V independent of VCC, allowing connection to higher-voltage buses while powered from 1.8 V or 2.5 V. Outputs rely on external pull-ups to define the high-level voltage, enabling seamless translation across 1.8-V, 3.3-V, and 5-V domains.
Is the SN74LVC3G07YEPR pin-compatible with other packages in the same family?
No, the SN74LVC3G07YEPR uses an 8-ball DSBGA (YZP) package with bottom-side ball layout, which is not mechanically or electrically pin-compatible with the SSOP (DCT) or VSSOP (DCU) variants. Pin numbering and physical terminal locations differ significantly-PCB redesign is required when switching to or from YZP.
How does the Ioff feature function in the SN74LVC3G07YEPR?
The Ioff feature in the SN74LVC3G07YEPR disables all outputs when VCC = 0 V, limiting off-state current to ±10 μA maximum. This prevents current backflow from live system traces into the unpowered IC, protecting both the device and upstream circuitry during partial-power-down or hot-insertion scenarios-critical for modular and field-upgradable systems.
What is the thermal performance of the SN74LVC3G07YEPR in its YZP package?
The SN74LVC3G07YEPR in the DSBGA (YZP) package has a thermal impedance (θJA) of 102°C/W, significantly lower than the 220–227°C/W of DCT and DCU variants. This enables higher sustained output current in thermally constrained environments and improves reliability in sealed enclosures or stacked PCB assemblies where airflow is limited.
SN74LVC3G07YEPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 8-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 3
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- Open Drain
- Current - Output High, Low:
- -, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DSBGA (1.9x0.9)
SN74LVC3G07YEPR FAQ
1.How can I place an order for SN74LVC3G07YEPR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC3G07YEPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC3G07YEPR reliable?
The price and inventory of SN74LVC3G07YEPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC3G07YEPR is usually 5 days.
3.What payment methods are accepted for SN74LVC3G07YEPR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LVC3G07YEPR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74LVC3G07YEPR?
SN74LVC3G07YEPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74LVC3G07YEPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC3G07YEPR?
For technical support, including SN74LVC3G07YEPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC3G07YEPR requirements.
6.How does Aetrix verify that SN74LVC3G07YEPR is sourced from the original manufacturer or authorized distributors?
All SN74LVC3G07YEPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC3G07YEPR meets industry standards.
7.What is the process for return or replacement of SN74LVC3G07YEPR?
All SN74LVC3G07YEPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC3G07YEPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC3G07YEPR part is unused and in its original packaging.
Return procedure for SN74LVC3G07YEPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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