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Texas Instruments SN74LVC3G07YZAR
- Part No.:
- SN74LVC3G07YZAR
- Manufacturer:
- Texas Instruments
- Package:
- 8-XFBGA, DSBGA
- Datasheet:
-
SN74LVC3G07YZAR.pdf
- Description:
- IC BUF NON-INVERT 5.5V 8DSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,640
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Product details
Overview
SN74LVC3G07YZAR from Texas Instruments is a triple non-inverting buffer/driver with open-drain outputs, designed for 1.65-V to 5.5-V VCC operation. It delivers 3.7 ns max propagation delay at 3.3 V, ±24-mA output sink drive, 10-μA max ICC, and supports Ioff partial-power-down protection. It enables wired-OR logic in level-shifting I²C, SMBus, and GPIO expansion applications.
For engineers reviewing the SN74LVC3G07YZAR datasheet, SN74LVC3G07YZAR pinout, SN74LVC3G07YZAR application, or SN74LVC3G07YZAR equivalent, key selection criteria include open-drain compatibility with 5.5-V tolerant inputs, NanoFree™ DSBGA package footprint, Ioff-enabled live insertion, and 32-mA absolute max sink capability under 5-V VCC.
Technical Context
This device implements three independent non-inverting buffers, each with an open-drain output stage capable of sinking up to 32 mA. Its Ioff circuitry actively disables outputs during power-down, blocking current backflow when VCC = 0 V.
Input voltage tolerance extends to 5.5 V regardless of VCC level, enabling seamless level translation between 1.8-V, 2.5-V, 3.3-V, and 5-V domains. The NanoFree™ YZP package uses the silicon die as the package substrate, eliminating wirebonds and leadframe for ultra-small footprint and improved thermal performance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 5.5 V - Enables single-supply operation across 1.8-V, 2.5-V, 3.3-V, and 5-V systems without level shifters. |
| tpd (Max) | 3.7 ns at 3.3 V - Ensures timing-critical signal buffering in high-speed digital interfaces like I²C clock stretching. |
| IOL (Max) | 24 mA at 3.3 V - Supports driving multiple standard TTL loads or pull-up resistors down to 1.5 kΩ on 3.3-V buses. |
| VI (Max) | 5.5 V - Allows direct connection to 5-V logic inputs while powered from lower VCC, simplifying mixed-voltage designs. |
| Ioff (Max) | ±10 μA - Prevents damaging back-current during hot-swap or partial power-down, critical for modular systems. |
| ICC (Max) | 10 μA - Minimizes quiescent power in battery-backed or always-on monitoring circuits. |
| Package | DSBGA-8 (YZP), 1.5 mm × 1.5 mm - Ultra-compact footprint ideal for space-constrained portable and wearable electronics. |
Pinout & Package
SN74LVC3G07YZAR uses an 8-ball DSBGA (YZP) package with bottom-side ball layout. Pin 1 is located at corner A1 (top-left in orientation with marking dot). The package height is ≤0.5 mm, compatible with fine-pitch PCB assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A, 2A, 3A | Buffer input | Three independent CMOS-compatible inputs accepting 0–5.5 V; no internal pull-up/down. |
| 1Y, 2Y, 3Y | Open-drain output | Active-low outputs requiring external pull-up; sink-only operation up to 32 mA per channel. |
| VCC | Power supply | Single supply rail (1.65–5.5 V); powers internal logic and enables Ioff control. |
| GND | Ground reference | Common return path for all inputs, outputs, and internal circuitry. |
Key Features
| Feature | Design Value |
|---|---|
| Triple open-drain buffer | Enables three independent wired-OR functions-e.g., interrupt aggregation, bus arbitration, or multi-source enable control. |
| NanoFree™ packaging | Eliminates leadframe and wirebonds; die-as-package reduces parasitic inductance and improves thermal resistance (θJA = 102°C/W). |
| Ioff partial-power-down | Guarantees high-impedance outputs and <±10 μA leakage when VCC = 0 V, enabling safe live insertion into powered backplanes. |
| 5.5-V tolerant inputs | Permits interfacing with legacy 5-V peripherals while operating from modern low-voltage rails-no external translators needed. |
| ESD robustness | Exceeds JESD22-A114 (2000-V HBM), A115 (200-V MM), and C101 (1000-V CDM), reducing board-level ESD protection overhead. |
Applications
| I²C Bus Level Translation | GPIO Expander Interface |
|---|---|
Use Scenario: Translating SDA/SCL signals between 3.3-V microcontroller and 5-V sensor node on shared I²C bus. IC Role / Device Role / Timing Role: Open-drain buffer providing bidirectional voltage translation without direction control pins. Use Value: Eliminates discrete MOSFET translators; leverages native 5.5-V input tolerance and 3.3-V VCC to reduce BOM count and layout area. |
Use Scenario: Adding three programmable open-drain outputs to a microcontroller with limited GPIO resources. IC Role / Device Role / Timing Role: Non-inverting driver extending MCU's ability to sink current for LED indicators, relay drivers, or reset signaling. Use Value: Delivers 24-mA sink per channel at 3.3 V-sufficient to drive LEDs directly or interface with optocouplers without external transistors. |
| Hot-Swappable Module Control | Interrupt Aggregation |
Use Scenario: Enabling/disabling power to a field-replaceable module via a system controller that remains active during module insertion/removal. IC Role / Device Role / Timing Role: Ioff-enabled buffer isolating module-side signals from backplane during insertion. Use Value: Prevents back-current damage to powered host logic; meets live-insertion requirements without complex sequencing circuitry. |
Use Scenario: Combining interrupt signals from three peripheral ICs onto a single MCU interrupt line. IC Role / Device Role / Timing Role: Wired-OR gate formed by connecting all three 1Y/2Y/3Y outputs to one pull-up resistor. Use Value: Reduces MCU pin count and simplifies firmware-any asserted low-level interrupt pulls the shared line low without contention. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar open-drain buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC3G07DCUR | VSSOP-8 package (2.3 mm × 2.0 mm), higher θJA (227°C/W), same electrical specs. | Better suited for prototyping or manual soldering due to larger pitch (0.5 mm vs. YZP's 0.4 mm). | Select when board reworkability or test probe access is prioritized over minimal footprint. |
| SN74LVC1G07DBVR | Single-channel version in SOT-23-5; identical VCC range, tpd, and IOL but only one buffer. | Used where only one open-drain output is required-reduces cost and area versus using one channel of a triple device. | Choose for point-of-load buffering or when design requires independent placement of each buffer. |
Compared with SN74LVC3G07DCUR, SN74LVC3G07YZAR saves >60% board area and improves thermal performance; compared with SN74LVC1G07DBVR, it integrates three channels in one die, reducing component count and interconnect complexity for multi-signal applications.
Availability
SN74LVC3G07YZAR is available at Aetrix Electronics and suitable for industrial automation interfaces, portable medical sensors, and automotive body-control modules requiring stable component supply and long-term manufacturability.
Supply support for SN74LVC3G07YZAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in logic, interface, and power management ICs.
The SN74LVC3G07YZAR belongs to TI's LVC low-voltage CMOS logic family, engineered for interoperability across voltage domains and reliability in space-constrained, mixed-signal embedded systems.
FAQ
What is the maximum sink current per output of the SN74LVC3G07YZAR?
The SN74LVC3G07YZAR supports up to 32 mA sink current per output (IOL) when VCC = 4.5 V, as specified in the Absolute Maximum Ratings table. At 3.3 V, the recommended maximum is 24 mA per output to maintain VOL ≤ 0.55 V under typical conditions. Exceeding these values risks exceeding SOA limits and degrading long-term reliability.
Does the SN74LVC3G07YZAR require external pull-up resistors on its outputs?
Yes, the SN74LVC3G07YZAR has open-drain outputs and requires external pull-up resistors to establish a defined high logic level. The value depends on bus capacitance and speed requirements-for I²C at 100 kHz, 2.2 kΩ to 4.7 kΩ pull-ups to VCC or higher voltage rail are typical. No internal pull-ups are present.
Can the SN74LVC3G07YZAR operate with VCC disconnected while inputs remain active?
Yes-the SN74LVC3G07YZAR features Ioff circuitry that disables outputs and limits input/output leakage to ±10 μA when VCC = 0 V. This allows safe operation with live inputs during partial power-down or hot-swap scenarios, preventing back-current damage to upstream devices.
Is the SN74LVC3G07YZAR pin-compatible with other packages of the same part number?
No-SN74LVC3G07YZAR (DSBGA-8) is not pin-compatible with SN74LVC3G07DCT3 (SSOP-8) or SN74LVC3G07DCUR (VSSOP-8). While functionally identical, the YZP package uses a bottom-ball grid layout (A1–D2), whereas DCT and DCU use gull-wing leads with different pin numbering and spacing. PCB redesign is required for package substitution.
What is the operating temperature range for the SN74LVC3G07YZAR?
The SN74LVC3G07YZAR is rated for –40°C to +85°C ambient operating temperature, as confirmed in TI's PACKAGE OPTION ADDENDUM. This range applies to the YZPR variant (which includes YZAR), supporting commercial and industrial applications but excluding extended-temperature automotive (-40°C to +125°C) variants like SN74LVC3G07-Q1.
SN74LVC3G07YZAR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 8-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 3
- Number of Bits per Element:
- 1
- Input Type:
- -
- Output Type:
- Open Drain
- Current - Output High, Low:
- -, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DSBGA (1.9x0.9)
SN74LVC3G07YZAR FAQ
1.How can I place an order for SN74LVC3G07YZAR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC3G07YZAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC3G07YZAR reliable?
The price and inventory of SN74LVC3G07YZAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC3G07YZAR is usually 5 days.
3.What payment methods are accepted for SN74LVC3G07YZAR?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LVC3G07YZAR transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74LVC3G07YZAR?
SN74LVC3G07YZAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74LVC3G07YZAR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC3G07YZAR?
For technical support, including SN74LVC3G07YZAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC3G07YZAR requirements.
6.How does Aetrix verify that SN74LVC3G07YZAR is sourced from the original manufacturer or authorized distributors?
All SN74LVC3G07YZAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC3G07YZAR meets industry standards.
7.What is the process for return or replacement of SN74LVC3G07YZAR?
All SN74LVC3G07YZAR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC3G07YZAR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC3G07YZAR part is unused and in its original packaging.
Return procedure for SN74LVC3G07YZAR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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