Texas Instruments SN74LVC3G07YZPR

Overview

SN74LVC3G07YZPR from Texas Instruments is a triple non-inverting buffer/driver with open-drain outputs, designed for 1.65-V to 5.5-V VCC operation. It delivers 3.7 ns max propagation delay at 3.3 V, ±24-mA output sink drive, and supports Ioff partial-power-down protection. It enables wired-OR logic in level-shifting I²C bus interfaces and voltage translation circuits.

For engineers reviewing the SN74LVC3G07YZPR datasheet, SN74LVC3G07YZPR pinout, SN74LVC3G07YZPR application, or SN74LVC3G07YZPR equivalent, key selection criteria include open-drain output compatibility, Ioff-enabled live insertion, 8-pin DSBGA (YZP) package footprint, and 32-mA max sink current capability at 4.5 V.

Technical Context

This device implements three independent non-inverting buffers, each with an open-drain output stage capable of sinking up to 32 mA at 4.5 V. Its Ioff circuitry actively disables outputs during power-down, preventing back-drive current and enabling hot-plug operation.

The SN74LVC3G07YZPR accepts input voltages up to 5.5 V regardless of VCC level-enabling true 5-V tolerant inputs-and maintains specified VOL ≤ 0.75 V at IOL = 24 mA and VCC = 3 V. It complies with JESD 78 Class II latch-up immunity (>100 mA) and exceeds JESD 22 ESD ratings (2000-V HBM, 200-V MM, 1000-V CDM).

Key Specifications

Pinout & Package

SN74LVC3G07YZPR uses an 8-ball DSBGA (YZP) package with bottom-side ball layout. Pin 1 is located at corner A1 per JEDEC MO-191 standard; ball pitch is 0.4 mm, and overall package size is 1.5 mm × 1.5 mm × 0.5 mm max height.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar triple open-drain buffer applications.

Compared with SN74LVC3G07DCTR and SN74LVC3G07DCUR, the SN74LVC3G07YZPR offers the smallest PCB area (1.5 mm² vs. 5.3 mm²), lowest profile (0.5 mm), and highest board density-making it optimal for wearables, hearing aids, and ultra-thin IoT edge nodes where space is constrained.

Availability

SN74LVC3G07YZPR is available at Aetrix Electronics and suitable for I²C bus extension, LED driver interface, hot-swappable module reset, and voltage-level translation requiring stable component supply across high-volume production and rapid prototyping cycles.

Supply support for SN74LVC3G07YZPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in logic, interface, and power management ICs.

The SN74LVC3G07YZPR belongs to TI's LVC logic family-designed for low-voltage, high-speed, and power-efficient digital interfacing in portable, industrial, and communications equipment.

FAQ

What is the maximum sink current supported by each output of the SN74LVC3G07YZPR?

Each open-drain output of the SN74LVC3G07YZPR supports up to 32 mA sink current at VCC = 4.5 V, as specified in the Recommended Operating Conditions table. At VCC = 3 V, the rated sink current is 24 mA. This capability allows direct driving of LEDs, pull-down networks, or multiple CMOS inputs without external amplification. The SN74LVC3G07YZPR maintains VOL ≤ 0.75 V under these conditions.

Does the SN74LVC3G07YZPR support partial power-down operation?

Yes, the SN74LVC3G07YZPR includes Ioff circuitry that disables all outputs when VCC = 0 V, limiting Ioff current to ±10 μA max. This feature prevents damaging current backflow during live insertion or partial-power-down scenarios. The SN74LVC3G07YZPR is explicitly characterized for this mode in its Electrical Characteristics table and supports hot-swap applications in modular systems.

Can the SN74LVC3G07YZPR be used for level translation between 1.8-V and 5-V logic domains?

Yes, the SN74LVC3G07YZPR accepts input voltages up to 5.5 V independent of VCC, making it suitable for translating 5-V signals to lower-voltage domains. When VCC = 1.8 V, inputs remain fully compatible with 5-V logic levels. Its open-drain outputs require an external pull-up to the target domain voltage (e.g., 5 V), enabling robust unidirectional level shifting. The SN74LVC3G07YZPR achieves this without additional components or power rails.

What is the package type and dimensions of the SN74LVC3G07YZPR?

The SN74LVC3G07YZPR uses a DSBGA-8 (YZP) package measuring 1.5 mm × 1.5 mm with a maximum height of 0.5 mm. It features an 8-ball array with 0.4-mm pitch and pin 1 located at corner A1. This ultra-compact NanoFree™ package eliminates traditional leadframes and wirebonds, delivering minimal parasitics and optimal thermal performance for space-constrained designs.

Is the SN74LVC3G07YZPR pin-compatible with other variants in the SN74LVC3G07 family?

No-the SN74LVC3G07YZPR (DSBGA-8) is not pin-compatible with SSOP (DCT) or VSSOP (DCU) variants due to fundamental package differences: YZP uses bottom-side solder balls, while DCT/DCU use gull-wing surface-mount leads. Although functional and electrical specifications are identical across the family, PCB layout, stencil design, and assembly processes differ significantly. Migration requires full package redesign-not just footprint adaptation. The SN74LVC3G07YZPR demands specific DSBGA reflow profiles and inspection methods.