Texas Instruments SN74LVC3G17YEPR
- Part No.:
- SN74LVC3G17YEPR
- Manufacturer:
- Texas Instruments
- Package:
- 8-XFBGA, DSBGA
- Datasheet:
-
SN74LVC3G17YEPR.pdf
- Description:
- IC BUF NON-INVERT 5.5V 8DSBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74LVC3G17YEPR from Texas Instruments is a triple Schmitt-trigger buffer IC operating from 1.65 V to 5.5 V, performing Y = A logic with independent channels, featuring ±24-mA output drive at 3.3 V, 5.4 ns max propagation delay, and Ioff support for live insertion in partial-power-down systems. It is used in audio docks, SSDs, and portable tablets for noise-immune signal conditioning.
For engineers reviewing the SN74LVC3G17YEPR datasheet, SN74LVC3G17YEPR pinout, SN74LVC3G17YEPR application, or SN74LVC3G17YEPR equivalent, key selection factors include its hysteresis (0.56–1.11 V), overvoltage-tolerant inputs (up to 5.5 V), NanoFree™ DSBGA-8 package, and guaranteed operation from –40°C to 85°C.
Technical Context
The SN74LVC3G17YEPR implements three noninverting Schmitt-trigger buffers with distinct VT+ (1.5–3.33 V) and VT– (0.39–2.29 V) thresholds, enabling robust noise rejection on slow or noisy input signals. Its Ioff circuitry actively disables outputs during power-down, blocking back-current flow and supporting hot-plug capability.
Designed in NanoFree™ DSBGA-8 packaging, the device uses the silicon die as the package body (1.91 mm × 0.91 mm), eliminating bond wires and mold compound to minimize parasitic inductance and capacitance-critical for high-speed digital integrity in space-constrained portable designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 5.5 V - supports single-supply operation across legacy 3.3 V and modern low-voltage 1.8 V/2.5 V systems |
| Max Propagation Delay | 5.4 ns at 3.3 V, CL = 30/50 pF - enables timing-critical signal buffering in high-speed consumer interfaces |
| Hysteresis (ΔVT) | 0.56 V (min) to 1.11 V (max) - provides noise immunity against EMI and ground bounce in noisy PCB environments |
| Output Drive | ±24 mA at 3.3 V - sufficient to directly drive multiple LVC inputs or small capacitive loads without external buffers |
| Ioff Current | ±10 μA max - ensures safe isolation during partial power-down, preventing back-drive damage in mixed-rail systems |
| Input Voltage Tolerance | Up to 5.5 V regardless of VCC - allows interfacing with higher-voltage peripherals without level shifters |
| Operating Temperature | –40°C to +85°C - qualified for commercial and extended-temperature portable electronics applications |
Pinout & Package
NanoFree™ DSBGA-8 package (1.91 mm × 0.91 mm, 0.5-mm pitch), bottom-terminal configuration with solder bumps; ultra-compact footprint ideal for thin mobile devices and wearables.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1A | Input 1 | Noninverting Schmitt-trigger input for Channel 1; accepts up to 5.5 V independent of VCC |
| 1Y | Output 1 | Buffered noninverting output with ±24-mA drive capability at 3.3 V |
| 2A | Input 2 | Noninverting Schmitt-trigger input for Channel 2; electrically isolated from other channels |
| 2Y | Output 2 | Buffered noninverting output; supports independent loading and timing |
| 3A | Input 3 | Noninverting Schmitt-trigger input for Channel 3; requires tie-high or tie-low if unused |
| 3Y | Output 3 | Buffered noninverting output; shares VCC/GND rails but operates independently |
| GND | Ground | Reference return path for all I/O and internal circuitry; must be low-impedance for noise control |
| VCC | Power Supply | Single supply rail (1.65–5.5 V); requires local 0.1-μF bypass capacitor per TI layout guidelines |
Key Features
| Feature | Design Value |
|---|---|
| NanoFree™ DSBGA-8 packaging | Die-size footprint (1.91 mm × 0.91 mm) eliminates package parasitics, enabling optimal signal integrity in ultra-thin portable layouts |
| Triple independent Schmitt-trigger buffers | Three Y = A functions with separate VT+/VT– thresholds per channel, allowing concurrent noise filtering on distinct signal paths |
| Ioff partial-power-down protection | Active output disable during VCC = 0 V prevents back-current flow, enabling safe live insertion into powered-backplane systems |
| Overvoltage-tolerant inputs | Inputs rated to 5.5 V regardless of VCC level - eliminates need for external level translators when interfacing with 5-V legacy components |
| ESD robustness | 2000-V HBM, 1000-V CDM - exceeds JEDEC standards for handling safety in automated assembly and field service |
Applications
| Audio Dock Signal Conditioning | SSD Power-Button Debounce |
|---|---|
Use Scenario: Clean switching of analog/digital audio routing signals in portable docking stations exposed to cable-induced noise and ESD. IC Role / Device Role / Timing Role: Triple Schmitt-trigger buffer providing hysteresis-based noise rejection on three independent audio enable/control lines. Use Value: Eliminates false triggering from contact bounce and RF coupling, ensuring reliable mute/unmute and source-select behavior without software polling. |
Use Scenario: Debouncing mechanical power-button inputs in client SSD modules where space and BOM count are constrained. IC Role / Device Role / Timing Role: Single-channel Schmitt-trigger buffer converting noisy button transitions into clean CMOS-level reset or enable pulses. Use Value: Reduces firmware complexity by offloading hardware debouncing, while the remaining two channels remain available for status LED or activity-sense signaling. |
| Tablet Touch-Controller Interface | Wireless Headset GPIO Expansion |
Use Scenario: Level-shifting and noise filtering of I²C or interrupt signals between touch controller and application processor in enterprise tablets. IC Role / Device Role / Timing Role: Noninverting buffer with overvoltage-tolerant inputs isolating 1.8-V processor GPIOs from 3.3-V touch IC signals. Use Value: Prevents latch-up and signal corruption during hot-plug events while maintaining sub-6-ns timing margin for responsive touch latency. |
Use Scenario: Expanding GPIO count and adding noise immunity to Bluetooth headset MCU I/O for button, sensor, and LED control. IC Role / Device Role / Timing Role: Triple buffer providing isolated, hysteresis-enhanced drive for pushbutton inputs, accelerometer wake signals, and RGB LED current sinks. Use Value: Enables compact dual-function button design (press/hold) and reduces false wake-ups from ESD transients on headset flex cables. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Schmitt-trigger buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC1G17YZPR | Single-channel version in same DSBGA-5 package; lacks two additional buffers and shared VCC/GND efficiency | Suitable only when exactly one Schmitt buffer is needed; no channel-to-channel timing correlation | Select when board area is critical and multi-channel synchronization is unnecessary |
| SN74LV3G17DCUR | VSSOP-8 package (2.30 mm × 2.00 mm); higher thermal resistance (227°C/W vs. 102°C/W); identical electrical specs | Better suited for prototyping or manual assembly due to larger pitch; less optimal for ultra-thin production designs | Prefer for development boards or cost-sensitive non-portable applications where DSBGA rework is impractical |
Compared with SN74LVC3G17YEPR, SN74LVC1G17YZPR saves area but sacrifices channel count and integration density, while SN74LV3G17DCUR offers easier assembly at the expense of thermal performance and footprint size-making SN74LVC3G17YEPR optimal for volume-manufactured portable electronics requiring miniaturization and noise resilience.
Availability
SN74LVC3G17YEPR is available at Aetrix Electronics and suitable for audio docks, solid-state drives, and wireless headsets requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.
Supply support for SN74LVC3G17YEPR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company specializing in analog and embedded processing technologies, with leadership in low-power logic, precision analog, and high-reliability interface solutions.
The SN74LVC3G17YEPR belongs to TI's LVC logic family, designed specifically for space-constrained, battery-powered consumer electronics requiring ultra-small footprints, wide voltage operation, and robust noise immunity.
FAQ
What is the maximum operating temperature range for the SN74LVC3G17YEPR?
The SN74LVC3G17YEPR is specified for operation from –40°C to +85°C. This range is validated per JEDEC JESD78 latch-up testing and supported by thermal characterization data showing RθJA = 102°C/W in its DSBGA-8 package. The device maintains full electrical performance-including hysteresis and propagation delay-across this entire range, making it suitable for consumer portable applications exposed to ambient thermal cycling.
Does the SN74LVC3G17YEPR support 5-V input signals when powered from 1.8 V?
Yes, the SN74LVC3G17YEPR supports input voltages up to 5.5 V regardless of VCC level, including when VCC = 1.8 V. This overvoltage tolerance is explicitly guaranteed in the datasheet's Recommended Operating Conditions table and enables direct interfacing with 5-V peripherals without external level shifters-reducing BOM count and signal path complexity in mixed-voltage systems.
How does the Ioff feature function in the SN74LVC3G17YEPR during power-down?
The Ioff feature in the SN74LVC3G17YEPR actively disables all three outputs when VCC = 0 V, limiting leakage current to ±10 μA maximum. This prevents damaging back-current flow from live system buses into the unpowered IC, enabling safe live insertion and partial-power-down modes. The function is intrinsic to the device's design and requires no external control signals or configuration.
What is the typical hysteresis voltage (ΔVT) of the SN74LVC3G17YEPR at 3.3 V supply?
At VCC = 3.3 V, the SN74LVC3G17YEPR exhibits a typical hysteresis voltage (ΔVT = VT+ – VT–) of 0.87 V, with a minimum of 0.56 V across temperature. This value is derived from the datasheet's Electrical Characteristics table (VT+ = 1.87 V typ, VT– = 1.14 V typ), and provides robust noise margin against ground bounce and EMI in high-density portable PCB layouts.
Can unused inputs on the SN74LVC3G17YEPR be left floating?
No, unused inputs on the SN74LVC3G17YEPR must be tied to either VCC or GND. Floating inputs can cause undefined output states, increased ICC, and potential oscillation due to the Schmitt-trigger's sensitivity to intermediate voltages. TI's application note SCBA004 explicitly mandates biasing all unused CMOS inputs-this applies to all three A-inputs (1A, 2A, 3A) on the SN74LVC3G17YEPR.
SN74LVC3G17YEPR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 8-XFBGA, DSBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 3
- Number of Bits per Element:
- 1
- Input Type:
- Schmitt Trigger
- Output Type:
- Push-Pull
- Current - Output High, Low:
- 32mA, 32mA
- Voltage - Supply:
- 1.65V ~ 5.5V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-DSBGA (1.9x0.9)
SN74LVC3G17YEPR FAQ
1.How can I place an order for SN74LVC3G17YEPR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC3G17YEPR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC3G17YEPR reliable?
The price and inventory of SN74LVC3G17YEPR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC3G17YEPR is usually 5 days.
3.What payment methods are accepted for SN74LVC3G17YEPR?
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4.How is shipping managed for SN74LVC3G17YEPR?
SN74LVC3G17YEPR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74LVC3G17YEPR order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC3G17YEPR?
For technical support, including SN74LVC3G17YEPR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC3G17YEPR requirements.
6.How does Aetrix verify that SN74LVC3G17YEPR is sourced from the original manufacturer or authorized distributors?
All SN74LVC3G17YEPR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC3G17YEPR meets industry standards.
7.What is the process for return or replacement of SN74LVC3G17YEPR?
All SN74LVC3G17YEPR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC3G17YEPR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC3G17YEPR part is unused and in its original packaging.
Return procedure for SN74LVC3G17YEPR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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