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Texas Instruments SN74LVC3G34YEAR

Part No.:
SN74LVC3G34YEAR
Manufacturer:
Texas Instruments
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
8-XFBGA, DSBGA
Datasheet:
AetrixSN74LVC3G34YEAR.pdf
Description:
IC BUF NON-INVERT 5.5V 8DSBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,187

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Product details

Overview

SN74LVC3G34YEAR from Texas Instruments is a triple non-inverting buffer gate IC designed for 1.65-V to 5.5-V VCC operation, performing Y = A logic on three independent channels. It delivers ±24-mA output drive at 3.3 V, achieves 4.1 ns max propagation delay at 3.3 V, and supports 5.5-V-tolerant inputs - enabling voltage translation in portable audio and embedded PC signal routing.

For engineers reviewing the SN74LVC3G34YEAR datasheet, SN74LVC3G34YEAR pinout, SN74LVC3G34YEAR application, or SN74LVC3G34YEAR equivalent, key selection criteria include Ioff-enabled partial-power-down capability, NanoFree™ DSBGA-8 package compatibility, 3.3-V high-speed buffering with ground bounce <0.8 V, and down-translation from 5.5-V inputs to lower VCC rails.

Technical Context

The SN74LVC3G34YEAR implements three independent CMOS buffer stages with identical input/output characteristics and shared VCC/GND rails. Each channel features rail-to-rail output swing, 5.5-V-tolerant inputs regardless of VCC, and Ioff circuitry that disables outputs and blocks current backflow when VCC = 0 V.

It operates across –40°C to +85°C (DSBGA package), supports live insertion via Ioff, and meets JESD 78 Class II latch-up immunity (>100 mA) and JESD 22 ESD ratings (2500-V HBM, 1500-V CDM). No enable/disable control lines are present - all buffers are always active.

Key Specifications

ParameterValue and Actual Design Meaning
VCC Range1.65 V to 5.5 V - enables single-supply operation across LVC logic families and mixed-voltage interfacing
Max tpd4.1 ns at 3.3 V - supports >100 MHz signal routing in portable audio and SSD control paths
IOH/IOL±24 mA at 3.3 V - drives multiple CMOS loads or LEDs without external amplification
Ioff±10 µA max - prevents back-drive damage during hot-plug or partial power-down sequences
Input Voltage Tolerance0 V to 5.5 V - allows direct connection of 5-V microcontroller GPIOs to 1.8-V or 2.5-V system domains
ICC (max)10 µA - ensures ultra-low static power in battery-powered PDA and wireless headset standby modes
VOLP / VOHV<0.8 V / >2 V at 3.3 V - minimizes switching noise-induced false triggering in noise-sensitive analog-adjacent layouts

Pinout & Package

SN74LVC3G34YEAR is packaged in an 8-pin DSBGA (YZP) measuring 1.91 mm × 0.91 mm with bottom-side ball layout. The package uses NanoFree™ technology - the silicon die serves as the package - enabling ultra-thin, board-area-efficient mounting for space-constrained portable devices.

Pin/TerminalCircuit RoleDesign Meaning
1ABuffer Input 1CMOS-compatible input accepting 0–5.5 V; no external pull-up/down required for defined logic state
1YBuffer Output 1Push-pull output delivering rail-to-rail swing; capable of sourcing/sinking 24 mA at 3.3 V
2ABuffer Input 2Independent input identical to 1A; electrically isolated from other channels
2YBuffer Output 2Independent output identical to 1Y; no crosstalk or shared drive limitations between channels
3ABuffer Input 3Third input supporting same voltage tolerance and timing as 1A/2A
3YBuffer Output 3Third output with matched drive strength and propagation delay to 1Y/2Y
GNDGround ReferenceCommon return path for all three buffers; must be low-impedance to suppress ground bounce
VCCPower SupplySingle supply pin powering all three buffers; requires local 0.1-µF bypass capacitor per layout guidelines

Key Features

FeatureDesign Value
Triple independent buffersThree fully isolated Y = A logic paths sharing only VCC/GND - eliminates inter-channel timing skew in parallel data paths
Ioff partial-power-downActive at VCC = 0 V; blocks >99% of back-current flow - essential for hot-swap SSD modules and modular docking stations
5.5-V tolerant inputsAccepts 5-V signals while operating at 1.8 V - enables seamless interface between legacy peripherals and modern low-voltage SoCs
NanoFree™ DSBGA-81.91 mm × 0.91 mm footprint with 0.4-mm pitch balls - reduces PCB area by >60% vs. VSSOP-8, critical for thin tablets and wireless earbuds
Low ground bounceVOLP < 0.8 V at 3.3 V - maintains signal integrity in multi-buffered clock/data fanout without added termination

Applications

Portable Audio Signal RoutingEmbedded PC I/O Expansion

Use Scenario: Routing audio control signals (play/pause, volume up/down) from a 5-V microcontroller to 1.8-V codec in MP3 players and Bluetooth headsets.

IC Role / Device Role / Timing Role: Level-shifting buffer translating 5-V GPIO outputs down to 1.8-V logic thresholds while preserving edge rate and noise margin.

Use Value: Eliminates discrete level-shifters and saves 2.5 mm² PCB area using NanoFree™ DSBGA-8, directly supporting sub-10-mm-thick form factors.

Use Scenario: Driving multiple status LEDs and reset lines from a 3.3-V embedded CPU in industrial HMIs and thin-client PCs.

IC Role / Device Role / Timing Role: High-current buffer providing 24-mA sink/source per channel to illuminate LEDs or assert active-low reset without loading CPU GPIOs.

Use Value: Reduces BOM count by replacing three discrete transistors or a larger 8-pin SOIC buffer, lowering assembly cost and thermal load.

Solid-State Drive (SSD) Power SequencingWireless Peripheral Interface

Use Scenario: Controlling power-enable signals for NAND flash and controller ICs during cold-start sequencing in client SSD modules.

IC Role / Device Role / Timing Role: Glue logic buffer ensuring clean, simultaneous assertion of multiple 3.3-V enable lines with matched propagation delay (≤4.1 ns).

Use Value: Prevents race conditions during power-up by guaranteeing ≤100 ps inter-channel skew, improving SSD reliability and qualification pass rate.

Use Scenario: Isolating and strengthening USB HID report signals (keyboard scan matrix, mouse motion data) before transmission to host in wireless keyboards/mice.

IC Role / Device Role / Timing Role: Noise-immune buffer driving long flex-cable traces with fast edges and low VOLP, reducing bit errors in 2.4-GHz coexistence environments.

Use Value: Enables 15-cm cable runs without signal degradation, verified by <0.8 V ground bounce at 3.3 V - critical for ergonomic peripheral design.

Equivalent & Alternatives

The following parts are listed as comparable options for similar buffer applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SN74LVC3G34DCURVSSOP-8 package (2.3 mm × 2.0 mm); higher RθJA (227°C/W); same electrical specs and pinoutBetter suited for prototyping or manual soldering due to larger pitch (0.5 mm) and exposed leadsSelect when hand assembly, rework, or thermal testing on standard test fixtures is required
SN74LVC3G34DCTRSM8 (SSOP-8) package (2.95 mm × 2.80 mm); highest RθJA (220°C/W); identical logic and drive capabilityPreferred for legacy board designs with existing SSOP footprints and automated optical inspection compatibilityChoose when maintaining backward compatibility with prior-generation layouts or JEDEC-compliant tape-and-reel handling is mandatory

Compared with SN74LVC3G34DCUR and SN74LVC3G34DCTR, the SN74LVC3G34YEAR offers the smallest footprint and lowest thermal resistance (140°C/W), making it optimal for thermally constrained, high-density portable applications where board area is premium and airflow is limited.

Availability

SN74LVC3G34YEAR is available at Aetrix Electronics and suitable for portable audio, embedded PC I/O expansion, and SSD power sequencing requiring stable component supply across extended product lifecycles.

Supply support for SN74LVC3G34YEAR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and logic solutions, with leadership in low-power, high-integration ICs for consumer and industrial markets.

The SN74LVC3G34YEAR belongs to TI's LVC logic family, engineered for robust voltage translation, ultra-low quiescent current, and NanoFree™ packaging - targeting space- and power-constrained portable electronics.

FAQ

What is the maximum operating temperature range for SN74LVC3G34YEAR?

The SN74LVC3G34YEAR is rated for operation from –40°C to +85°C, consistent with its DSBGA (YZP) package specification. This range supports deployment in consumer portable devices such as tablets, wireless headsets, and SSD modules where ambient temperatures remain within commercial limits. The datasheet confirms this rating under Recommended Operating Conditions and Thermal Information sections.

Does SN74LVC3G34YEAR support partial power-down functionality?

Yes, SN74LVC3G34YEAR incorporates Ioff circuitry that actively disables all three buffer outputs when VCC = 0 V, limiting Ioff to ±10 µA maximum. This feature prevents damaging current backflow during hot-insertion or partial-system power-down - a requirement validated in applications like modular docking stations and field-upgradeable SSDs.

Can SN74LVC3G34YEAR translate 5-V input signals to a 1.8-V supply domain?

Yes, SN74LVC3G34YEAR accepts input voltages up to 5.5 V regardless of VCC level, enabling reliable down-translation from 5-V sources to 1.8-V logic domains. Its VIH/VIL thresholds scale with VCC, and the device maintains full output drive and timing performance - confirmed by Electrical Characteristics tables at VCC = 1.8 V ± 0.15 V.

What is the typical propagation delay of SN74LVC3G34YEAR at 3.3 V?

The typical propagation delay (tpd) of SN74LVC3G34YEAR is 1.4 ns, with a maximum of 4.1 ns at VCC = 3.3 V ± 0.3 V and TA = –40°C to +85°C. This value is measured under standard load conditions (CL = 30 pF, RL = 500 Ω) and supports high-speed signal routing in applications such as audio dock control and SSD command interfaces.

Is SN74LVC3G34YEAR pin-compatible with other packages in the same family?

Yes, SN74LVC3G34YEAR shares identical pin functions and logic behavior with SN74LVC3G34DCUR (VSSOP-8) and SN74LVC3G34DCTR (SM8), though physical pin spacing and package dimensions differ. All variants use the same 1A/1Y/2A/2Y/3A/3Y/GND/VCC assignment - enabling direct substitution in firmware and schematic design when mechanical constraints permit.

SN74LVC3G34YEAR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74LVC
Package/Case:
8-XFBGA, DSBGA
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Logic Type:
Buffer, Non-Inverting
Number of Elements:
3
Number of Bits per Element:
1
Input Type:
-
Output Type:
Push-Pull
Current - Output High, Low:
32mA, 32mA
Voltage - Supply:
1.65V ~ 5.5V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-XFBGA, DSBGA

SN74LVC3G34YEAR FAQ

1.How can I place an order for SN74LVC3G34YEAR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74LVC3G34YEAR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74LVC3G34YEAR reliable?

The price and inventory of SN74LVC3G34YEAR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC3G34YEAR is usually 5 days.

3.What payment methods are accepted for SN74LVC3G34YEAR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LVC3G34YEAR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SN74LVC3G34YEAR?

SN74LVC3G34YEAR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74LVC3G34YEAR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74LVC3G34YEAR?

For technical support, including SN74LVC3G34YEAR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC3G34YEAR requirements.

6.How does Aetrix verify that SN74LVC3G34YEAR is sourced from the original manufacturer or authorized distributors?

All SN74LVC3G34YEAR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC3G34YEAR meets industry standards.

7.What is the process for return or replacement of SN74LVC3G34YEAR?

All SN74LVC3G34YEAR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC3G34YEAR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74LVC3G34YEAR part is unused and in its original packaging.

Return procedure for SN74LVC3G34YEAR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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