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Texas Instruments SN74LVC541AQDWREP

Part No.:
SN74LVC541AQDWREP
Manufacturer:
Texas Instruments
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
20-SOIC (0.295", 7.50mm Width)
Datasheet:
AetrixSN74LVC541AQDWREP.pdf
Description:
IC BUF NON-INVERT 3.6V 20SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,352

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Product details

Overview

SN74LVC541AQDWREP from Texas Instruments is an octal noninverting buffer/driver with 3-state outputs, designed for 2.0 V to 3.6 V VCC operation and rated for –40°C to 125°C. It features dual active-low output-enable inputs (OE1, OE2), supports mixed-mode 3.3-V/5-V signal translation, delivers 24 mA sink/source drive at 3.0 V, and achieves 5.1 ns max propagation delay at 3.3 V - ideal for bus driving and memory address buffering in aerospace-grade embedded systems.

For engineers reviewing the SN74LVC541AQDWREP datasheet, SN74LVC541AQDWREP pinout, SN74LVC541AQDWREP application, or SN74LVC541AQDWREP equivalent, key selection considerations include Ioff-enabled partial-power-down capability, 5.5-V-tolerant inputs, SOIC-20 thermal performance (θJA = 58°C/W), and JEDEC-qualified extended-temperature reliability for mission-critical avionics and industrial control designs.

Technical Context

This device implements two independent 4-bit channels, each controlled by a 2-input AND gate with active-low enables (OE1/OE2), ensuring all eight Y outputs enter high-impedance state if either enable is high. Its Ioff circuitry actively disables outputs during power-down to prevent backflow current, satisfying MIL-STD-883-compliant partial-power-down requirements.

The SN74LVC541AQDWREP uses LVC logic family architecture with TTL-compatible thresholds, supports 5.5-V input overvoltage tolerance regardless of VCC, and maintains specified VOL/VOH across 2.0–3.6 V supply range - enabling robust level-shifting between legacy 5-V peripherals and modern 3.3-V microcontrollers without external biasing.

Key Specifications

Parameter Value and Actual Design Meaning
VCC Range 2.0 V to 3.6 V - ensures compatibility with low-voltage FPGA I/O banks and ARM Cortex-M3/M4 core supplies.
Input Voltage Tolerance Up to 5.5 V - allows direct connection to 5-V logic without level shifters in mixed-voltage systems.
tpd (Max) 5.1 ns at 3.3 V - supports >100 MHz bus toggle rates in memory address or data path applications.
IOL / IOH ±24 mA at 3.0 V - drives standard 50-Ω transmission lines or multiple CMOS loads without fanout limitation.
Ioff Support Enabled - prevents destructive current flow when VCC = 0 V, critical for hot-swap and power sequencing in modular systems.
Operating Temperature –40°C to 125°C - qualified per JESD22-A108 for extended-life operation in engine control units and downhole electronics.
Package Thermal Resistance θJA = 58°C/W (SOIC-20) - enables stable operation at full drive strength without heatsinking in sealed enclosures.

Pinout & Package

SN74LVC541AQDWREP is housed in a 20-pin SOIC (DW) package, 7.5 mm × 12.8 mm footprint, 2.65 mm max height, RoHS-compliant NIPDAU lead finish, MSL Level-1 unlimited reflow rating, and JEDEC MS-013 registered outline.

Pin/Terminal Circuit Role Design Meaning
1, 19 OE1, OE2 Active-low output-enable inputs - both must be low for any Y output to be active; OR logic enables channel-level control.
2–9 A1–A8 Noninverting data inputs - arranged on left side to simplify PCB routing from microcontroller GPIO banks.
11–18 Y1–Y8 3-state buffered outputs - positioned opposite inputs to minimize trace crosstalk and support straight-through bus layout.
10 GND Ground reference - dedicated pin adjacent to VCC for low-inductance decoupling capacitor placement.
20 VCC Power supply - accepts 2.0–3.6 V; internal regulation not required due to LVC family rail-to-rail design.

Key Features

Feature Design Value
Mixed-mode voltage translation 5.5-V-tolerant inputs operating from 2.0–3.6-V VCC - eliminates external level shifters when interfacing 5-V sensors to 3.3-V MCUs.
Partial-power-down protection Ioff circuitry limits off-state current to ±15 µA - prevents backfeeding into unpowered subsystems during phased startup/shutdown.
High-speed bus driving 5.1 ns tpd and 24 mA drive strength - sustains clean signal integrity on 10-cm PCB traces at 100 MHz clock rates.
Extended temperature reliability JEDEC-qualified –40°C to 125°C with HAST, temperature cycling, and bond intermetallic life testing - meets DO-160 Section 22 Category D for avionics.
Low ground bounce Typical VOLP < 0.8 V at VCC = 3.3 V - reduces noise coupling into analog sections and improves ADC reference stability.

Applications

Aerospace Data Bus Interface Industrial PLC Backplane Driver

Use Scenario: Interfacing radiation-tolerant FPGA configuration memory to a 5-V legacy sensor bus in satellite payload telemetry modules.

IC Role / Device Role / Timing Role: Octal noninverting buffer translating 3.3-V FPGA address/data to 5-V bus while maintaining timing margins under thermal vacuum conditions.

Use Value: 5.5-V input tolerance and –40°C to 125°C qualification eliminate external level shifters and enable single-component solution across orbital temperature extremes.

Use Scenario: Driving isolated CAN transceiver address lines and diagnostic LEDs from a 3.3-V ARM-based controller in DIN-rail mounted programmable logic controllers.

IC Role / Device Role / Timing Role: High-drive buffer isolating MCU GPIO from noisy industrial bus segments and providing deterministic 5.1 ns propagation for synchronized LED status updates.

Use Value: ±24 mA output current ensures reliable LED turn-on across 100% duty cycle, while Ioff prevents latch-up during hot-swap module insertion.

Avionics Display Controller Buffer Ruggedized Medical Imaging Memory Interface

Use Scenario: Buffering pixel address registers between a 3.3-V display processor and 5-V parallel LCD driver IC in cockpit multifunction displays.

IC Role / Device Role / Timing Role: Low-skew octal driver delivering sub-6 ns propagation delay to maintain pixel clock alignment across 8-bit address bus.

Use Value: Dual OE inputs allow synchronous blanking of entire display row addressing during vertical sync intervals without software overhead.

Use Scenario: Isolating DDR2 memory address lines from a 2.5-V medical imaging SoC in portable ultrasound systems requiring EMI-hardened board layout.

IC Role / Device Role / Timing Role: 3-state buffer enabling shared memory bus access between imaging processor and diagnostic co-processor with zero hold-time violation.

Use Value: SOIC-20 package with opposite-side pin arrangement minimizes layer count and reduces crosstalk-induced artifacts in high-resolution image buffers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal buffer/driver applications.

Alternative Part Technical Difference Application Difference Selection Advice
SN74LVC541AQPWREP TSSOP-20 package (16.4 mm × 5.3 mm), θJA = 83°C/W, identical electrical specs and pinout. Better suited for space-constrained PCBs where SOIC footprint is prohibitive; lower thermal mass requires tighter thermal management. Select when board area is constrained and thermal derating can be accommodated via copper pour or airflow.
SN74LVC541A-Q1 Automotive AEC-Q100 Grade 1 (–40°C to 125°C), same SOIC-20 package and electrical behavior, additional automotive qualification testing. Required for ISO 26262 ASIL-B systems; includes enhanced traceability and failure mode analysis not present in EP version. Select for road vehicle ECUs where functional safety certification is mandatory, not for general-purpose industrial use.

Compared with SN74LVC541AQPWREP, SN74LVC541AQDWREP offers superior thermal dissipation for sustained high-current operation; compared with SN74LVC541A-Q1, it provides identical performance at lower cost and documentation burden where automotive qualification is unnecessary.

Availability

SN74LVC541AQDWREP is available at Aetrix Electronics and suitable for aerospace data bus interfaces, industrial PLC backplane drivers, avionics display controllers, ruggedized medical imaging systems, and extended-temperature test equipment requiring stable component supply across long production lifecycles.

Supply support for SN74LVC541AQDWREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in high-reliability electronics.

The SN74LVC541AQDWREP belongs to TI's enhanced plastic (EP) logic portfolio, engineered specifically for extended-temperature, high-integrity applications in defense, aerospace, and industrial automation where standard commercial parts cannot meet environmental or longevity requirements.

FAQ

What is the maximum input voltage rating for SN74LVC541AQDWREP?

The SN74LVC541AQDWREP supports input voltages up to 5.5 V regardless of VCC level, enabling direct interfacing with 5-V logic families without external clamping or level-shifting circuitry. This specification is guaranteed across the full –40°C to 125°C operating range and is validated per absolute maximum ratings in the official TI datasheet SCAS748A.

Does SN74LVC541AQDWREP support partial-power-down operation?

Yes, SN74LVC541AQDWREP incorporates Ioff circuitry that disables all outputs when VCC = 0 V, limiting off-state current to ±15 µA. This feature prevents damaging current backflow in systems with staggered power sequencing, such as modular avionics racks or hot-pluggable industrial I/O cards, and is verified per JEDEC JESD78 testing protocols.

What is the propagation delay of SN74LVC541AQDWREP at 3.3 V?

The maximum propagation delay (tpd) of SN74LVC541AQDWREP is 5.1 ns at VCC = 3.3 V, TA = 25°C, measured from A to Y under standard load conditions (CL = 50 pF). This value is guaranteed across the full operating temperature range and forms the basis for timing budgeting in high-speed address/data bus designs.

Is SN74LVC541AQDWREP pin-compatible with standard SN74LVC541A devices?

Yes, SN74LVC541AQDWREP shares identical pinout, electrical characteristics, and functional behavior with the commercial SN74LVC541A in SOIC-20 package, differing only in extended-temperature qualification, enhanced manufacturing controls, and EP-specific traceability. No PCB layout changes are required when upgrading from catalog to EP version.

What package type and dimensions does SN74LVC541AQDWREP use?

SN74LVC541AQDWREP uses a 20-pin SOIC (DW) package measuring 7.5 mm × 12.8 mm with 1.27 mm lead pitch and 2.65 mm maximum height. It conforms to JEDEC MS-013 outline, features NIPDAU lead finish, and carries MSL Level-1 unlimited reflow rating - fully compatible with standard surface-mount assembly processes.

SN74LVC541AQDWREP Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74LVC
Package/Case:
20-SOIC (0.295", 7.50mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Logic Type:
Buffer, Non-Inverting
Number of Elements:
1
Number of Bits per Element:
8
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
24mA, 24mA
Voltage - Supply:
2V ~ 3.6V
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
20-SOIC

SN74LVC541AQDWREP FAQ

1.How can I place an order for SN74LVC541AQDWREP through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74LVC541AQDWREP on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74LVC541AQDWREP reliable?

The price and inventory of SN74LVC541AQDWREP are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC541AQDWREP is usually 5 days.

3.What payment methods are accepted for SN74LVC541AQDWREP?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LVC541AQDWREP transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SN74LVC541AQDWREP?

SN74LVC541AQDWREP orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74LVC541AQDWREP order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74LVC541AQDWREP?

For technical support, including SN74LVC541AQDWREP datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC541AQDWREP requirements.

6.How does Aetrix verify that SN74LVC541AQDWREP is sourced from the original manufacturer or authorized distributors?

All SN74LVC541AQDWREP products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC541AQDWREP meets industry standards.

7.What is the process for return or replacement of SN74LVC541AQDWREP?

All SN74LVC541AQDWREP units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC541AQDWREP, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74LVC541AQDWREP part is unused and in its original packaging.

Return procedure for SN74LVC541AQDWREP:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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