My Inquiry
My Account
Texas Instruments SN74LVC541ARGYRG4
- Part No.:
- SN74LVC541ARGYRG4
- Manufacturer:
- Texas Instruments
- Package:
- 20-VFQFN Exposed Pad
- Datasheet:
-
SN74LVC541ARGYRG4.pdf
- Description:
- IC BUF NON-INVERT 3.6V 20VQFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,574
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SN74LVC541ARGYRG4 from Texas Instruments is an octal non-inverting buffer with 3-state outputs, designed for bus interface and signal redriving in 1.65V–3.6V systems. It features dual active-low output enables (OE1/OE2), 5.1ns max propagation delay at 3.3V, 5.5V-tolerant inputs, and Ioff support for live insertion. Used in high-speed digital backplanes and mixed-voltage I/O bridging.
For engineers reviewing the SN74LVC541ARGYRG4 datasheet, SN74LVC541ARGYRG4 pinout, SN74LVC541ARGYRG4 application, or SN74LVC541ARGYRG4 equivalent, key selection criteria include 3-state timing (ten/tdis ≤ 7ns), 24mA drive strength at 3V, thermal performance in RGY VQFN (θJA = 82.84°C/W), and compatibility with 5V-input/3.3V-VCC mixed-mode operation.
Technical Context
The SN74LVC541ARGYRG4 implements eight independent CMOS buffer channels sharing two synchronized active-low output enable inputs-both OE1 and OE2 must be low to activate outputs. Its balanced push-pull 3-state outputs deliver symmetrical sourcing/sinking capability up to ±24mA at 3V.
It supports partial power-down via Ioff circuitry that disables all outputs when VCC = 0V, limiting leakage to ±10μA. Input tolerance to 5.5V enables safe interfacing with legacy 5V logic while operating from a 3.3V or lower supply.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65V to 3.6V - Enables direct integration into modern low-voltage FPGA/CPU I/O domains without level shifters. |
| Input Voltage Tolerance | Up to 5.5V - Allows connection to 5V peripherals without external clamping or translation. |
| tpd (max) | 5.1ns at VCC = 3.3V - Supports >100MHz signal redriving on short PCB traces or controlled-impedance lines. |
| IOL / IOH (max) | ±24mA at VCC = 3V - Drives 50pF loads or multiple CMOS inputs with margin for signal integrity. |
| Ioff Leakage | ±10μA at VI/VO = 5.5V - Ensures safe hot-plug operation and prevents back-drive during partial power-down. |
| ESD Rating (HBM) | ±2000V - Meets industrial-grade robustness requirements for board-level handling and system integration. |
| Operating Temp | –40°C to 125°C - Qualified for automotive under-hood and industrial control environments. |
Pinout & Package
SN74LVC541ARGYRG4 is housed in a 4.5mm × 3.5mm RGY VQFN-20 package with exposed thermal pad. Pin 1 is OE1; pins 2–9 are inputs A1–A8; pin 10 is GND; pins 11–18 are outputs Y8–Y1; pin 19 is OE2; pin 20 is VCC; thermal pad is optional ground connection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| OE1, OE2 | Active-low 3-state enable | Both must be low to enable outputs; provides synchronous channel gating for bus arbitration. |
| A1–A8 | Buffer input | CMOS-compatible inputs accepting 0–5.5V; no external pull-ups required for driven signals. |
| Y1–Y8 | Non-inverting 3-state output | Push-pull drive in active state; high-impedance when disabled-enables wired-OR and shared-bus topologies. |
| VCC, GND | Power supply | Single-supply operation; requires local 0.1μF bypass capacitor per VCC pin for noise suppression. |
| Thermal Pad | Thermal and electrical reference | May be connected to GND plane to improve θJA by ~15°C/W; floating allowed but not recommended for thermal reliability. |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode I/O | 5V-tolerant inputs with 3.3V VCC enable seamless interoperation between legacy 5V logic and modern low-voltage SoCs/FPGAs. |
| Ioff Protection | Prevents current backflow during power sequencing or hot-swap events-critical for modular backplane and mezzanine card designs. |
| Low Ground Bounce | VOLP < 0.8V at VCC = 3.3V ensures clean switching margins and reduces simultaneous switching noise in dense layouts. |
| High-Speed Timing | tdis/ten ≤ 7ns guarantees deterministic bus release and acquisition windows for real-time control and memory-mapped peripherals. |
| Latch-up Immunity | Exceeds 100mA per JESD78 - eliminates risk of destructive latch-up under transient overvoltage or ESD stress. |
Applications
| Industrial Bus Redriver | Automotive Sensor Interface |
|---|---|
Use Scenario: Reconditioning degraded SPI or parallel sensor data lines across long PCB traces (>12 cm) in programmable logic controllers. IC Role / Device Role / Timing Role: Non-inverting 3-state buffer providing gain, impedance matching, and timing-controlled bus release via dual OE pins. Use Value: Restores signal edge rate and voltage swing to meet setup/hold timing of downstream ADCs or microcontrollers without adding latency. |
Use Scenario: Level-shifting and buffering LIN or CAN transceiver status signals between 5V sensor modules and 3.3V MCU I/O banks. IC Role / Device Role / Timing Role: Voltage-tolerant input buffer isolating MCU GPIOs from higher-voltage subsystems while maintaining fast response. Use Value: Eliminates need for discrete level translators; Ioff prevents back-drive damage during MCU reset or sleep states. |
| Embedded Memory Expansion | FPGA I/O Expansion |
Use Scenario: Driving address/data buses for parallel NOR flash or SRAM in space-constrained embedded systems with tight thermal budgets. IC Role / Device Role / Timing Role: Octal 3-state driver enabling bidirectional bus control and memory chip select coordination. Use Value: Delivers 24mA drive at 3V to meet load capacitance and fan-out requirements of multi-chip memory stacks. |
Use Scenario: Expanding I/O count on Xilinx Artix-7 or Intel Cyclone V FPGAs where native bank voltage differs from peripheral logic. IC Role / Device Role / Timing Role: Signal conditioner and voltage-domain bridge for GPIO expansion headers or daughterboard interfaces. Use Value: RGY VQFN footprint (4.5 × 3.5 mm) saves board area versus SOIC alternatives while supporting 100+ MHz toggle rates. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar octal 3-state buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC244ARGYR | Two independent 4-bit groups with separate OE controls; no shared dual-OE logic; identical VCC range and drive strength. | Better suited for asymmetric bus partitioning (e.g., separate address/data enables); less ideal for synchronized 8-channel gating. | Select SN74LVC244ARGYR when independent enable control per 4-bit segment is required; SN74LVC541ARGYRG4 remains optimal for unified 8-bit bus control. |
| 74LVC541APWRE4 | TSSOP-20 package (6.5 × 6.4 mm); same electrical specs but higher θJA (120.3°C/W); no thermal pad. | Preferred for manual assembly or legacy footprints; unsuitable for thermally constrained high-density layouts. | Choose 74LVC541APWRE4 only if board layout prohibits VQFN or thermal management is handled externally; RGY offers superior power density. |
Compared with SN74LVC244ARGYR and 74LVC541APWRE4, SN74LVC541ARGYRG4 uniquely combines synchronized dual-OE control, compact RGY thermal performance, and 5.5V input tolerance-making it the most integrated solution for space- and timing-critical 8-bit bus interfaces.
Availability
SN74LVC541ARGYRG4 is available at Aetrix Electronics and suitable for industrial bus redriving, automotive sensor interfacing, embedded memory expansion, FPGA I/O expansion, and high-density logic consolidation requiring stable component supply and long-term lifecycle assurance.
Supply support for SN74LVC541ARGYRG4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions with over 50 years of innovation in high-reliability interface ICs.
SN74LVC541ARGYRG4 belongs to the LVC logic family-designed specifically for low-voltage, high-speed, mixed-signal interfacing in industrial, automotive, and communications equipment where power efficiency and signal integrity are critical.
FAQ
What is the maximum capacitive load SN74LVC541ARGYRG4 can drive while meeting datasheet timing specs?
SN74LVC541ARGYRG4 is characterized to drive loads ≤50pF while maintaining guaranteed tpd ≤5.1ns and ten/tdis ≤7ns at 3.3V. Exceeding 50pF increases propagation delay and may cause signal integrity issues like ringing or undershoot-especially on longer traces. For heavier loads, add series damping resistors or use lower-capacitance routing.
Can SN74LVC541ARGYRG4 safely interface a 5V microcontroller GPIO to a 3.3V FPGA bank?
Yes. SN74LVC541ARGYRG4 accepts input voltages up to 5.5V while operating from a 3.3V VCC, making it ideal for unidirectional 5V-to-3.3V level translation. Its 5.5V-tolerant inputs eliminate external clamping diodes or resistive dividers-ensuring reliable logic-level conversion without signal degradation or timing penalty.
How should the thermal pad on the RGY package of SN74LVC541ARGYRG4 be connected?
The exposed thermal pad on SN74LVC541ARGYRG4 should be soldered to a solid GND plane using ≥4 thermal vias (0.3mm diameter) to maximize heat dissipation. TI specifies θJA = 82.84°C/W with this configuration. Leaving the pad floating increases junction temperature by ~10–15°C under full load and risks thermal derating in sustained operation.
Does SN74LVC541ARGYRG4 support hot-swap or live-insertion in backplane applications?
Yes. SN74LVC541ARGYRG4 incorporates Ioff circuitry that disables all outputs when VCC = 0V, limiting Ioff leakage to ±10μA. This prevents back-driving powered circuitry during insertion/removal and protects both the SN74LVC541ARGYRG4 and host system-meeting key requirements for modular industrial and telecom backplane designs.
What is the functional difference between OE1 and OE2 on SN74LVC541ARGYRG4?
OE1 and OE2 are logically ANDed internally: both must be low for any output (Y1–Y8) to be active. Neither pin alone enables outputs-this dual-enable architecture prevents accidental bus contention during power-up or reset sequences. OE1 and OE2 are electrically identical, allowing flexible routing to match system control logic.
SN74LVC541ARGYRG4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 20-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 20-VQFN (3.5x4.5)
SN74LVC541ARGYRG4 FAQ
1.How can I place an order for SN74LVC541ARGYRG4 through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC541ARGYRG4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC541ARGYRG4 reliable?
The price and inventory of SN74LVC541ARGYRG4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC541ARGYRG4 is usually 5 days.
3.What payment methods are accepted for SN74LVC541ARGYRG4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SN74LVC541ARGYRG4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SN74LVC541ARGYRG4?
SN74LVC541ARGYRG4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SN74LVC541ARGYRG4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC541ARGYRG4?
For technical support, including SN74LVC541ARGYRG4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC541ARGYRG4 requirements.
6.How does Aetrix verify that SN74LVC541ARGYRG4 is sourced from the original manufacturer or authorized distributors?
All SN74LVC541ARGYRG4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC541ARGYRG4 meets industry standards.
7.What is the process for return or replacement of SN74LVC541ARGYRG4?
All SN74LVC541ARGYRG4 units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC541ARGYRG4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC541ARGYRG4 part is unused and in its original packaging.
Return procedure for SN74LVC541ARGYRG4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SN74LVC541ARGYRG4 Tags
-
SN74LVC1G17DBVR
Texas Instruments
-
SN74LVC1G07DCKR
Texas Instruments
-
SN74LVC1G17DCKR
Texas Instruments
-
SN74LVC1G07DBVR
Texas Instruments
-
SN74LVC1G125DCKR
Texas Instruments
-
SN74AHCT1G126DBVR
Texas Instruments
-
SN74LVC1G125DBVR
Texas Instruments
-
SN74AHCT1G125DBVR
Texas Instruments
-
SN74LVC2G17DBVR
Texas Instruments
-
SN74LVC2G07DCKR
Texas Instruments
-
SN74LVC1G34DCKR
Texas Instruments
-
SN74LVC2G17DCKR
Texas Instruments
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
