Texas Instruments SN74LVC863ADW
- Part No.:
- SN74LVC863ADW
- Manufacturer:
- Texas Instruments
- Package:
- 24-SOIC (0.295", 7.50mm Width)
- Datasheet:
-
SN74LVC863ADW.pdf
- Description:
- IC TXRX NON-INVERT 3.6V 24SOIC
- Quantity:
- Payment:

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Product details
Overview
SN74LVC863ADW from Texas Instruments is a 9-bit bus transceiver with 3-state outputs, designed for asynchronous bidirectional data transfer between A and B buses in 1.65-V to 3.6-V systems. It features dual independent output-enable controls (OEAB1/OEAB2 and OEBA1/OEBA2), supports mixed-mode 3.3-V/5-V I/O operation, and delivers 6.1 ns max propagation delay at 3.3 V - enabling use in high-speed industrial backplane and FPGA-to-ASIC interconnect applications.
For engineers reviewing the SN74LVC863ADW datasheet, SN74LVC863ADW pinout, SN74LVC863ADW application, or SN74LVC863ADW equivalent, key selection criteria include its 24-pin SOIC (DW) package, Ioff partial-power-down support, ±24-mA drive strength at 3 V, and guaranteed 5.5-V-tolerant inputs - critical for level-shifting and hot-swap-capable system designs.
Technical Context
The SN74LVC863ADW implements a dual-directional 9-bit transceiver architecture with separate A→B and B→A enable logic via four dedicated OE terminals (OEAB1/OEAB2 and OEBA1/OEBA2), allowing independent control of each direction's 9-bit channel. Its LVC logic family ensures compatibility with both 1.8-V and 3.3-V signaling domains while maintaining 5.5-V input tolerance.
It integrates Ioff circuitry to disable outputs during power-down, preventing current backflow in partial-power-down systems, and meets JESD 17 latch-up immunity (>250 mA) and JESD 22 ESD ratings (2000-V HBM, 200-V MM, 1000-V CDM). The device remains in high-impedance state during power-up/down without external biasing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 3.6 V - enables direct integration into low-voltage FPGA I/O banks and battery-powered embedded controllers. |
| Input Voltage Tolerance | Up to 5.5 V - allows safe interfacing with legacy 5-V logic without external level shifters. |
| Max Propagation Delay | 6.1 ns at VCC = 3.3 V - supports >80-MHz data throughput in synchronous bus applications. |
| Output Drive Strength | ±24 mA at VCC = 3 V - drives 50-Ω transmission lines or multiple CMOS loads without buffering. |
| Ioff Current | ±10 µA at VI/VO = 5.5 V - prevents damaging back-current when VCC is off in multi-rail systems. |
| Operating Temperature | –40°C to +85°C - qualified for industrial-grade operation in motor control and PLC environments. |
| Package | 24-pin SOIC (DW), 7.5-mm width - compatible with standard wave-solder and reflow assembly processes. |
Pinout & Package
SN74LVC863ADW uses a 24-pin SOIC (DW) package with 0.65-mm lead pitch and 7.5-mm body width. Pin 1 is located at the top-left corner adjacent to the index notch, with pins numbered counter-clockwise.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | OEBA1 | Active-low enable for B→A data path on bits 1–4; controls 4-bit subset of reverse-direction outputs. |
| 2 | A1 | Input/output terminal for A-bus bit 1; bidirectional I/O with 3-state control. |
| 3 | A2 | Input/output terminal for A-bus bit 2; shares same 3-state control as A1–A9 group. |
| 4 | A3 | Input/output terminal for A-bus bit 3; electrically identical to A1–A9. |
| 5 | A4 | Input/output terminal for A-bus bit 4; supports 5.5-V-tolerant input regardless of VCC. |
| 6 | A5 | Input/output terminal for A-bus bit 5; driven by internal LVC output stage with rail-to-rail swing. |
| 7 | A6 | Input/output terminal for A-bus bit 6; exhibits typical VOLP < 0.8 V and VOHV > 2 V at 3.3 V. |
| 8 | A7 | Input/output terminal for A-bus bit 7; supports mixed-mode operation with 3.3-V VCC and 5-V inputs. |
| 9 | A8 | Input/output terminal for A-bus bit 8; high-impedance state maintained during power transitions. |
| 10 | A9 | Input/output terminal for A-bus bit 9; completes full 9-bit A-side port. |
| 11 | OEBA2 | Active-low enable for B→A data path on bits 5–9; enables remaining 5-bit subset of reverse path. |
| 12 | GND | Ground reference for all internal circuitry and I/O buffers; must be low-impedance connection. |
| 13 | VCC | Primary supply for core logic and output drivers; decoupling capacitor required per TI layout guidelines. |
| 14 | B1 | Input/output terminal for B-bus bit 1; functionally symmetric to A1 but isolated by direction control. |
| 15 | B2 | Input/output terminal for B-bus bit 2; supports same voltage tolerances and timing as B1–B9. |
| 16 | B3 | Input/output terminal for B-bus bit 3; shares common 3-state behavior with all B-side outputs. |
| 17 | B4 | Input/output terminal for B-bus bit 4; enabled only when corresponding OEAB signal is asserted. |
| 18 | B5 | Input/output terminal for B-bus bit 5; controlled independently from B1–B4 via OEAB2. |
| 19 | B6 | Input/output terminal for B-bus bit 6; supports simultaneous A→B and B→A transfers using split OE groups. |
| 20 | B7 | Input/output terminal for B-bus bit 7; maintains high-impedance state when OEAB1/OEAB2 are deasserted. |
| 21 | B8 | Input/output terminal for B-bus bit 8; no internal pull-up/pull-down; requires external termination if floating. |
| 22 | B9 | Input/output terminal for B-bus bit 9; completes full 9-bit B-side port. |
| 23 | OEAB2 | Active-low enable for A→B data path on bits 5–9; complements OEAB1 for full 9-bit control. |
| 24 | OEAB1 | Active-low enable for A→B data path on bits 1–4; provides granular direction control per sub-bus. |
Key Features
| Feature | Design Value |
|---|---|
| Dual independent direction control | Separate OEAB1/OEAB2 and OEBA1/OEBA2 pins allow concurrent A→B and B→A transfers on non-overlapping bit groups - ideal for split-data-path protocols. |
| Mixed-voltage interface | 5.5-V-tolerant inputs with 1.65–3.6-V VCC enable seamless bridging between 3.3-V microcontrollers and 5-V peripherals without external translators. |
| Ioff partial-power-down protection | Automatically disables outputs when VCC = 0 V, eliminating risk of back-driving powered subsystems in modular hot-plug architectures. |
| Low ground bounce and undershoot | Typical VOLP < 0.8 V and VOHV > 2 V at 3.3 V reduce signal integrity issues in dense PCB layouts with shared return paths. |
| High ESD robustness | 2000-V HBM rating exceeds JEDEC Class 2 requirements, supporting handling in non-ESD-controlled manufacturing environments. |
Applications
| Industrial Backplane Interconnect | FPGA-to-Microcontroller Bridging |
|---|---|
Use Scenario: Bidirectional data exchange between fieldbus controller (5-V) and FPGA-based motion sequencer (3.3-V) across a 20-cm PCB trace. IC Role / Device Role / Timing Role: Level-translating bus transceiver managing A→B and B→A flow with independent 4-bit/5-bit enable grouping. Use Value: Eliminates need for two discrete level shifters; 6.1-ns tpd ensures setup/hold margins for 100-MHz parallel bus clocking. |
Use Scenario: Configurable data path between Xilinx Artix-7 FPGA I/O bank and ARM Cortex-M7 MCU with mismatched I/O voltages. IC Role / Device Role / Timing Role: Asynchronous bidirectional buffer enabling dynamic direction switching under software control via GPIO-driven OE pins. Use Value: Supports runtime reconfiguration of data flow direction without FPGA recompilation or hardware change. |
| Hot-Swappable Module Interface | Legacy Peripheral Adapter |
Use Scenario: Communication link between powered-backplane slot and removable I/O module where VCC may be sequenced independently. IC Role / Device Role / Timing Role: Isolation element leveraging Ioff to prevent back-current during module insertion/removal. Use Value: Enables true hot-swap capability without auxiliary power sequencing circuitry or complex FET-based isolation. |
Use Scenario: Connecting modern 3.3-V SoC to legacy 5-V RS-485 transceiver or EEPROM in retrofit industrial equipment. IC Role / Device Role / Timing Role: Voltage-tolerant interface translator ensuring reliable read/write cycles despite supply domain mismatch. Use Value: Maintains full 9-bit data width and timing integrity without adding propagation delay from cascaded translators. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 9-bit bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC863APWR | TSSOP-24 package (4.4-mm width); identical electrical specs and pinout; 2000-piece reel packaging. | Better suited for space-constrained PCBs requiring fine-pitch surface-mount assembly. | Select when board area is limited and automated pick-and-place is used; same logic functionality and timing. |
| SN74LVC863ADBR | SSOP-24 package (5.3-mm width); same VCC range and I/O tolerance; different thermal impedance (θJA = 63°C/W vs. 46°C/W for DW). | Preferred for higher ambient temperature environments where SOIC thermal performance is marginal. | Choose for improved thermal dissipation in enclosed enclosures; verify land pattern compatibility before layout reuse. |
Compared with SN74LVC863ADW, the SN74LVC863APWR offers footprint reduction at the cost of slightly lower thermal margin, while SN74LVC863ADBR provides better heat spreading in thermally demanding industrial settings - neither is pin-compatible without PCB revision due to differing package outlines and solder pad geometries.
Availability
SN74LVC863ADW is available at Aetrix Electronics and suitable for industrial backplane interconnect, FPGA-to-microcontroller bridging, and hot-swappable module interface applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for SN74LVC863ADW includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in industrial, automotive, and communications markets.
The SN74LVC863ADW belongs to TI's LVC logic family, engineered for low-voltage, high-speed bidirectional bus interfacing in mixed-signal systems where voltage translation, power sequencing resilience, and ESD robustness are critical.
FAQ
What is the maximum operating frequency supported by SN74LVC863ADW?
The SN74LVC863ADW does not specify a maximum clock frequency directly, but its 6.1 ns maximum propagation delay at 3.3 V implies reliable operation up to approximately 80 MHz for single-cycle data transfers. System-level timing depends on board trace length, load capacitance, and driver strength - actual usable frequency must be validated with worst-case setup/hold analysis using the device's published tpd, ten, and tdis values.
Can SN74LVC863ADW safely interface a 5-V microcontroller with a 3.3-V FPGA?
Yes. The SN74LVC863ADW accepts input voltages up to 5.5 V while operating from a 3.3-V VCC, making it ideal for translating signals from 5-V peripherals to 3.3-V logic. Its outputs swing rail-to-rail within the 3.3-V domain, ensuring valid logic levels for the FPGA inputs. No external resistors or clamping diodes are needed - this capability is explicitly guaranteed in the datasheet's Recommended Operating Conditions table.
Does SN74LVC863ADW require external pull-up resistors on its OE pins?
No external pull-ups are required for functional operation, but TI recommends tying OEAB1, OEAB2, OEBA1, and OEBA2 to VCC through pull-up resistors during power-up to ensure outputs remain in high-impedance state until firmware initializes control. The minimum resistor value depends on the driving source's sink capability - typical values range from 4.7 kΩ to 10 kΩ for standard GPIO drivers.
Is SN74LVC863ADW suitable for hot-swap applications?
Yes. The SN74LVC863ADW incorporates Ioff circuitry that disables outputs when VCC = 0 V, preventing damaging current backflow from live backplanes into unpowered modules. This feature is tested per JESD 78 and enables safe insertion/removal in powered systems - a key requirement for modular industrial controllers and telecom line cards.
What is the thermal resistance (θJA) of the SN74LVC863ADW SOIC package?
The SN74LVC863ADW in the DW (SOIC-24) package has a junction-to-ambient thermal resistance (θJA) of 46°C/W, measured under standard JEDEC conditions (1-layer board, 1-in² copper pad). This value assumes proper PCB layout with recommended copper pour and thermal vias; actual thermal performance improves significantly with enhanced heatsinking, such as 2-oz copper and multiple thermal vias under the package body.
SN74LVC863ADW Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVC
- Package/Case:
- 24-SOIC (0.295", 7.50mm Width)
- Packaging:
- Bulk
- Product Status:
- Active
- Logic Type:
- Transceiver, Non-Inverting
- Number of Elements:
- 1
- Number of Bits per Element:
- 9
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-SOIC
SN74LVC863ADW FAQ
1.How can I place an order for SN74LVC863ADW through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVC863ADW on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVC863ADW reliable?
The price and inventory of SN74LVC863ADW are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVC863ADW is usually 5 days.
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Once your SN74LVC863ADW order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SN74LVC863ADW?
For technical support, including SN74LVC863ADW datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVC863ADW requirements.
6.How does Aetrix verify that SN74LVC863ADW is sourced from the original manufacturer or authorized distributors?
All SN74LVC863ADW products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVC863ADW meets industry standards.
7.What is the process for return or replacement of SN74LVC863ADW?
All SN74LVC863ADW units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVC863ADW, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVC863ADW part is unused and in its original packaging.
Return procedure for SN74LVC863ADW:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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