Texas Instruments SN74LVCH16244AGRDR
- Part No.:
- SN74LVCH16244AGRDR
- Manufacturer:
- Texas Instruments
- Package:
- 54-TFBGA
- Datasheet:
-
SN74LVCH16244AGRDR.pdf
- Description:
- IC BUFFER NON-INVERT 3.6V 54BGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,195
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Product details
Overview
SN74LVCH16244AGRDR from Texas Instruments is a 16-bit noninverting 3-state buffer/driver with four independent active-low output-enable inputs, operating from 1.65 V to 3.6 V, supporting 5.5-V-tolerant inputs and delivering 4.1 ns max propagation delay at 3.3 V - used in memory address buffering, bus isolation, and mixed-voltage I/O interfacing on server backplanes and telecom infrastructure boards.
For engineers reviewing the SN74LVCH16244AGRDR datasheet, SN74LVCH16244AGRDR pinout, SN74LVCH16244AGRDR application, or SN74LVCH16244AGRDR equivalent, key selection criteria include its Ioff-enabled live insertion support, bus-hold inputs eliminating external resistors, 3.6-V max supply rating, and compatibility with both 3.3-V and 5-V logic domains in high-density PCB layouts.
Technical Context
The SN74LVCH16244AGRDR implements four independent 4-bit buffer sections, each with true (noninverting) output logic and dedicated active-low OE control. Its CMOS design features symmetrical drive strength, with ±24 mA output current capability at 3.0 V VCC and rail-to-rail input voltage tolerance up to 5.5 V regardless of supply level.
It integrates Ioff circuitry for partial-power-down protection and bus-hold on all 16 data inputs, eliminating need for external biasing. Thermal performance is characterized across TSSOP-48 (DGG) package variants with RθJA = 64.3°C/W and junction-to-board resistance of 31.5°C/W.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 3.6 V - enables direct integration into 1.8-V, 2.5-V, and 3.3-V system rails without level shifters |
| Input Voltage Tolerance | Up to 5.5 V - allows safe interfacing with legacy 5-V peripherals in mixed-voltage systems |
| Max tpd | 4.1 ns at VCC = 3.3 V - supports high-speed address/data buffering in DDR memory subsystems |
| Ioff Support | Active at VCC = 0 V - prevents back-drive current during hot-plug or power sequencing events |
| Bus-Hold Inputs | Integrated on all 16 A-inputs - eliminates external pullup/pulldown resistors and associated board space |
| Output Drive | ±24 mA at VCC = 3.0 V - drives standard 50-Ω transmission lines or multiple CMOS loads without buffers |
| ESD Rating | 2000-V HBM - meets industrial-grade robustness requirements for automated assembly and field operation |
Pinout & Package
TSSOP-48 (DGG) package, 12.50 mm × 6.10 mm body size, 0.5-mm pitch, lead-free NiPdAu finish, MSL Level-1 (260°C peak reflow), compatible with standard SMT assembly processes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1OE, 2OE, 3OE, 4OE | Active-low output enable | Independently disables 4-bit output groups (Y1–Y4 per section); tied high via pullup for default high-Z during power-up |
| 1A1–1A4, 2A1–2A4, 3A1–3A4, 4A1–4A4 | Data inputs | 16 total CMOS inputs with bus-hold; accept 0–5.5 V regardless of VCC; no external bias required |
| 1Y1–1Y4, 2Y1–2Y4, 3Y1–3Y4, 4Y1–4Y4 | True buffered outputs | 16 noninverting 3-state outputs; drive ±24 mA; tolerate 0–5.5 V when disabled |
| VCC (Pins 7, 18, 31, 42) | Power supply | Four distributed VCC pins reduce IR drop and improve noise immunity; require local 0.1-µF bypass per pin |
| GND (Pins 4, 10, 15, 21, 28, 34, 39, 45) | Ground reference | Eight GND pins provide low-inductance return paths; essential for maintaining signal integrity at >100 MHz edge rates |
Key Features
| Feature | Design Value |
|---|---|
| Widebus™ architecture | Optimized for high-density memory and bus applications with minimal propagation skew across 16-bit channels |
| Mixed-mode signal operation | 5-V input/3.3-V VCC compatibility enables seamless bridging between legacy and modern logic families |
| Live insertion support | Ioff limits current flow when VCC = 0 V, enabling safe replacement in powered-backplane systems |
| Output ground bounce (VOLP) | <0.8 V at VCC = 3.3 V - reduces switching noise coupling into sensitive analog or RF sections |
| Latch-up immunity | >250 mA per JESD17 - ensures robust operation under transient overvoltage or ESD stress conditions |
Applications
| Server Memory Subsystem | Industrial PLC Backplane |
|---|---|
Use Scenario: Buffering CPU address lines to multiple DDR3 DIMM slots with simultaneous access control. IC Role / Device Role / Timing Role: 16-bit noninverting buffer with per-group OE control isolates memory banks and manages timing-critical address propagation. Use Value: 4.1 ns max tpd ensures setup/hold compliance across 800-MHz DDR3 interfaces; bus-hold prevents floating states during slot hot-swap. |
Use Scenario: Interfacing 5-V sensor I/O modules to 3.3-V FPGA-based controller over modular backplane. IC Role / Device Role / Timing Role: Level-translating buffer with 5.5-V-tolerant inputs and 3.3-V outputs maintains signal integrity across mixed-voltage zones. Use Value: Eliminates discrete level shifters; Ioff protects FPGA I/O during module insertion/removal under power. |
| Network Switch ASIC Interface | Automotive Infotainment Gateway |
Use Scenario: Driving high-capacitance control buses between switch fabric ASIC and PHY management ICs. IC Role / Device Role / Timing Role: High-drive 3-state buffer provides clean, slew-controlled signals to 100+ pF loads across 15-cm traces. Use Value: ±24 mA drive strength sustains signal rise/fall times below 2 ns; VOLP <0.8 V minimizes crosstalk in dense routing. |
Use Scenario: Isolating infotainment SoC GPIOs from 5-V CAN transceiver control lines and display backlight drivers. IC Role / Device Role / Timing Role: Quad-section buffer enables independent enable/disable of functional blocks (CAN, display, audio) without software overhead. Use Value: Four OE pins allow hardware-gated power domain partitioning; 125°C operational rating supports under-dash mounting. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit buffer applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC16244ADGGR | No bus-hold; lower Ioff leakage (±1 µA vs ±10 µA); identical pinout and VCC range | Requires external pullups for unused inputs; less suitable for uncontrolled I/O environments | Select when cost sensitivity outweighs bus-hold convenience and layout simplicity |
| 74ALVC16244PW,118 | NXP variant; same function but higher ICC (20 µA vs 5 µA typical); RoHS-compliant, SSOP-48 only | Higher static power draw; limited to SSOP package - impacts thermal performance in high-density designs | Prefer when sourcing from NXP-aligned supply chains or requiring alternate qualification history |
Compared with SN74LVCH16244AGRDR, SN74LVC16244ADGGR lacks bus-hold and requires external biasing, while 74ALVC16244PW,118 trades lower leakage for higher quiescent current and package inflexibility - making SN74LVCH16244AGRDR optimal for mixed-voltage, high-reliability, and space-constrained applications.
Availability
SN74LVCH16244AGRDR is available at Aetrix Electronics and suitable for server memory subsystems, industrial PLC backplanes, and network switch ASIC interfaces requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for SN74LVCH16244AGRDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in industrial, automotive, and communications markets.
The SN74LVCH16244AGRDR belongs to TI's Widebus™ family - designed specifically to enhance density and timing performance of 3-state memory address drivers, clock distribution networks, and bus-oriented receivers/transmitters in high-speed digital systems.
FAQ
What is the maximum input voltage rating for SN74LVCH16244AGRDR?
The SN74LVCH16244AGRDR supports input voltages up to 5.5 V across its entire valid VCC range (1.65 V to 3.6 V). This overvoltage tolerance enables reliable interfacing with 5-V logic sources without external level-shifting components, and is explicitly guaranteed in the Absolute Maximum Ratings table of the SCES494B datasheet.
Does SN74LVCH16244AGRDR require external pullup resistors on its inputs?
No - SN74LVCH16244AGRDR includes integrated bus-hold circuitry on all 16 A-inputs, actively maintaining valid logic states when inputs are floating or undriven. TI explicitly advises against using external pullup or pulldown resistors with this feature, as they may interfere with bus-hold functionality and increase power consumption.
Can SN74LVCH16244AGRDR be used in hot-swap applications?
Yes - SN74LVCH16244AGRDR incorporates Ioff circuitry that disables outputs and blocks current flow when VCC = 0 V, satisfying JEDEC JESD78 latch-up and JESD17 Ioff requirements. This enables safe insertion and removal in powered-backplane systems such as modular servers and telecom line cards.
What is the thermal resistance (RθJA) of SN74LVCH16244AGRDR in its TSSOP-48 package?
The SN74LVCH16244AGRDR in TSSOP-48 (DGG) package has a junction-to-ambient thermal resistance (RθJA) of 64.3°C/W, as specified in the Thermal Information table of SCES494B. This value assumes standard JEDEC 2S2P test board conditions and informs thermal design for continuous operation up to 125°C ambient.
How many independent output-enable controls does SN74LVCH16244AGRDR provide?
SN74LVCH16244AGRDR provides four independent active-low output-enable inputs: 1OE, 2OE, 3OE, and 4OE - each controlling a dedicated 4-bit output group (Y1–Y4). This architecture enables granular bus isolation, power domain gating, and flexible memory bank selection without software intervention.
SN74LVCH16244AGRDR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVCH
- Package/Case:
- 54-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Buffer, Non-Inverting
- Number of Elements:
- 4
- Number of Bits per Element:
- 4
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-BGA Microstar Junior (8x5.5)
SN74LVCH16244AGRDR FAQ
1.How can I place an order for SN74LVCH16244AGRDR through Aetrix?
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The price and inventory of SN74LVCH16244AGRDR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVCH16244AGRDR is usually 5 days.
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6.How does Aetrix verify that SN74LVCH16244AGRDR is sourced from the original manufacturer or authorized distributors?
All SN74LVCH16244AGRDR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVCH16244AGRDR meets industry standards.
7.What is the process for return or replacement of SN74LVCH16244AGRDR?
All SN74LVCH16244AGRDR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVCH16244AGRDR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVCH16244AGRDR part is unused and in its original packaging.
Return procedure for SN74LVCH16244AGRDR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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