Texas Instruments SN74LVCH16245AZRDR
- Part No.:
- SN74LVCH16245AZRDR
- Manufacturer:
- Texas Instruments
- Package:
- 54-TFBGA
- Datasheet:
-
SN74LVCH16245AZRDR.pdf
- Description:
- IC TXRX NON-INVERT 3.6V 54BGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74LVCH16245AZRDR from Texas Instruments is a 16-bit dual-octal noninverting bus transceiver with 3-state outputs, designed for asynchronous bidirectional data transfer between 1.65-V to 3.6-V buses. It supports mixed-mode signal operation (5.5-V-tolerant inputs at 3.3-V VCC), delivers 4-ns max propagation delay at 3.3 V, and features Ioff for live insertion and partial-power-down protection. It is used in tablet memory expansion interfaces requiring level translation and bus isolation.
For engineers reviewing the SN74LVCH16245AZRDR datasheet, SN74LVCH16245AZRDR pinout, SN74LVCH16245AZRDR application, or SN74LVCH16245AZRDR equivalent, key selection criteria include its 48-pin TSSOP package, dual-direction control per octet (1DIR/2DIR), independent output enables (1OE/2OE), bus-hold circuitry eliminating external resistors, and verified 5.5-V input tolerance across full VCC range.
Technical Context
The SN74LVCH16245AZRDR implements two independent 8-bit transceiver sections-each with dedicated DIR and OE controls-enabling simultaneous or segregated A↔B data flow. Its CMOS input structure accepts 0–5.5 V regardless of VCC (1.65–3.6 V), enabling robust down-translation from 5-V logic to 3.3-V systems without external level shifters.
Active bus-hold circuitry maintains valid logic states on undriven A- or B-port inputs, eliminating need for pullup/pulldown resistors. The Ioff feature disables outputs and blocks current backflow when VCC = 0 V, supporting hot-plug and power sequencing in multi-rail embedded systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 1.65 V to 3.6 V - Enables operation across low-voltage portable and industrial supply rails. |
| Input Voltage Tolerance | 0 V to 5.5 V - Supports direct interfacing with legacy 5-V peripherals without external translators. |
| Max Propagation Delay | 4 ns at 3.3 V - Ensures timing compliance in high-speed 16-bit parallel bus applications up to ~100 MHz. |
| Ioff Current | ±10 µA at VCC = 0 V - Prevents damaging back-drive current during partial power-down or hot-swap events. |
| Bus-Hold Current | ±45 µA at 3 V - Actively holds floating inputs at valid logic levels, removing external biasing components. |
| Output Drive | ±24 mA at 3 V - Sustains signal integrity across moderate capacitive loads (e.g., 30-pF traces + multiple IC inputs). |
| ESD Rating | 2000-V HBM - Meets industrial-grade handling requirements without special ESD precautions beyond standard protocols. |
Pinout & Package
TSSOP-48 (DGG) package: 12.50 mm × 6.10 mm body, 0.5-mm pitch, surface-mount, lead-free (NiPdAu), MSL Level-1.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1DIR, 2DIR | Direction control input | Configures data flow direction per octet: DIR = L enables B→A; DIR = H enables A→B. |
| 1OE, 2OE | Output enable input | Active-low control: OE = L enables transceiver outputs; OE = H places both A and B ports in high-Z. |
| 1A1–1A8, 2A1–2A8 | A-port I/O | First and second octet of A-side bidirectional data lines; internally bus-held when floating. |
| 1B1–1B8, 2B1–2B8 | B-port I/O | First and second octet of B-side bidirectional data lines; 5.5-V tolerant, active at all VCC levels. |
| VCC (Pins 7, 18, 31, 42) | Power supply | Four distributed VCC pins reduce IR drop and improve noise immunity across wide 48-pin layout. |
| GND (Pins 4, 10, 15, 21, 28, 34, 39, 45) | Ground reference | Eight GND pins provide low-inductance return paths for high-speed switching currents. |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode signal operation | 5.5-V-tolerant inputs allow seamless integration into heterogeneous 3.3-V/5-V systems without level-shifting circuitry. |
| Bus-hold circuitry | Eliminates need for external pullup/pulldown resistors on A/B ports, reducing BOM count and PCB area. |
| Ioff partial-power-down support | Prevents current backflow when VCC is off, enabling safe live insertion in modular backplane or docking applications. |
| Low ground bounce (VOLP) | Typical <0.8 V at 3.3 V - Minimizes noise coupling into sensitive analog or RF sections sharing same ground plane. |
| High noise immunity (VOHV) | Typical >2 V undershoot at 3.3 V - Maintains logic margin during fast edge transitions under heavy capacitive loading. |
Applications
| Tablet Memory Expansion Interface | Industrial PLC Backplane Data Link |
|---|---|
Use Scenario: Bidirectional data transfer between 3.3-V SoC and legacy 5-V SRAM modules in ultra-thin tablets. IC Role / Device Role / Timing Role: Level-translating bus transceiver managing 16-bit parallel address/data bus with direction and isolation control. Use Value: Eliminates discrete level shifters and pull resistors while meeting 4-ns timing budget for 100-MHz burst reads. | Use Scenario: Isolating CPU bus from field I/O module bus in modular programmable logic controllers. IC Role / Device Role / Timing Role: Dual-octal transceiver providing galvanically isolated data path with independent enable per segment. Use Value: Enables hot-swap capability via Ioff and prevents bus contention during module insertion/removal. |
| Wearable Health Sensor Hub | Test Equipment Digital Pattern Generator |
Use Scenario: Interfacing low-power 1.8-V sensor fusion MCU with 3.3-V display controller and flash memory in fitness trackers. IC Role / Device Role / Timing Role: Voltage-scalable bidirectional buffer enabling mixed-supply communication with sub-2-V operation. Use Value: Reduces standby current via bus-hold (no leakage paths) and supports 1.65-V minimum VCC for extended battery life. | Use Scenario: Driving 16-bit stimulus patterns from FPGA-based pattern generator to DUT under test with precise timing control. IC Role / Device Role / Timing Role: High-speed 3-state driver ensuring clean signal edges and minimal skew across all 16 lines. Use Value: Achieves <1-ns inter-channel skew and 4-ns max tpd, critical for setup/hold compliance in 100+ MHz digital test vectors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVC16245ADGGR | Lacks bus-hold circuitry; requires external pull resistors on unused inputs. | Suitable only where all inputs are actively driven; not recommended for floating-bus scenarios. | Select when cost sensitivity outweighs design simplicity and floating-input risk is mitigated elsewhere. |
| SN74AVC16245DGGR | Lower VCC range (1.2–3.6 V); higher speed (2.5 ns max tpd); no 5.5-V input tolerance. | Better for ultra-low-voltage SoC interconnects but incompatible with 5-V peripherals. | Choose for next-gen 1.2-V/1.8-V systems where 5-V compatibility is unnecessary and speed is critical. |
Compared with SN74LVCH16245AZRDR, SN74LVC16245ADGGR trades bus-hold convenience for lower cost and reduced static current, while SN74AVC16245DGGR offers faster timing at the expense of 5-V interface capability-making SN74LVCH16245AZRDR optimal for mixed-voltage, floating-input, and industrial hot-swap use cases.
Availability
SN74LVCH16245AZRDR is available at Aetrix Electronics and suitable for tablet memory expansion interfaces, industrial PLC backplane links, wearable health sensor hubs, and test equipment digital pattern generators requiring stable component supply and long-term lifecycle assurance.
Supply support for SN74LVCH16245AZRDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor company delivering analog and embedded processing solutions for industrial, automotive, and personal electronics markets.
The SN74LVCH16245AZRDR belongs to TI's Widebus™ family of advanced bus-interface ICs, engineered specifically for robust, low-voltage, mixed-signal bidirectional data transfer in space-constrained and thermally demanding embedded systems.
FAQ
What voltage levels can the SN74LVCH16245AZRDR inputs tolerate?
The SN74LVCH16245AZRDR inputs accept voltages from 0 V to 5.5 V regardless of VCC setting (1.65–3.6 V). This allows direct connection to 5-V logic sources while operating from a 3.3-V or lower supply, enabling down-translation without external components. The specification is validated across temperature (–40°C to 125°C) and process corners per TI's SCES495C datasheet.
Does the SN74LVCH16245AZRDR require external pullup or pulldown resistors?
No, the SN74LVCH16245AZRDR integrates active bus-hold circuitry on all A- and B-port inputs, which maintains valid logic states on undriven or floating lines. External resistors are unnecessary and discouraged, as they conflict with the internal hold current (±45 µA typical at 3 V). This feature reduces BOM count and improves reliability in systems with intermittent bus connections.
How does the Ioff feature function in the SN74LVCH16245AZRDR?
The Ioff feature in the SN74LVCH16245AZRDR disables output drivers and blocks current flow when VCC = 0 V, limiting Ioff to ±10 µA. This prevents back-driving powered sections of the system during hot insertion, partial power-down, or board removal-critical for modular industrial and docking applications. Ioff operates independently of DIR and OE states and is specified across full temperature range.
What is the maximum propagation delay of the SN74LVCH16245AZRDR at 3.3 V?
The maximum propagation delay (tpd) of the SN74LVCH16245AZRDR is 4 ns at VCC = 3.3 V, TA = 25°C, with ±0.3-V output swing. This value is guaranteed across –40°C to 125°C and applies to both A→B and B→A directions. The 4-ns spec enables reliable operation in 100-MHz parallel bus systems with adequate setup/hold margin.
Which package type is used by the SN74LVCH16245AZRDR?
The SN74LVCH16245AZRDR uses a 48-pin TSSOP package (DGG), measuring 12.50 mm × 6.10 mm with 0.5-mm pitch. It is RoHS-compliant, lead-free (NiPdAu finish), and rated MSL Level-1 (unlimited floor life at ≤30°C/60% RH). This package supports fine-pitch automated assembly and provides thermal performance (RθJA = 67.1°C/W) suitable for convection-cooled industrial PCBs.
SN74LVCH16245AZRDR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVCH
- Package/Case:
- 54-TFBGA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Logic Type:
- Transceiver, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 24mA, 24mA
- Voltage - Supply:
- 1.65V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 54-BGA Microstar Junior (8x5.5)
SN74LVCH16245AZRDR FAQ
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7.What is the process for return or replacement of SN74LVCH16245AZRDR?
All SN74LVCH16245AZRDR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVCH16245AZRDR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVCH16245AZRDR part is unused and in its original packaging.
Return procedure for SN74LVCH16245AZRDR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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