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Texas Instruments SN74LVCZ16244ADGGR

Part No.:
SN74LVCZ16244ADGGR
Manufacturer:
Texas Instruments
Category:
Buffers, Drivers, Receivers, Transceivers
Package:
48-TFSOP (0.240", 6.10mm Width)
Datasheet:
AetrixSN74LVCZ16244ADGGR.pdf
Description:
IC BUF NON-INVERT 3.6V 48TSSOP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,816

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Product details

Overview

SN74LVCZ16244ADGGR from Texas Instruments is a 16-bit non-inverting buffer/driver with 3-state outputs, designed for 2.7-V to 3.6-V VCC operation. It supports mixed-mode signaling (5-V inputs with 3.3-V VCC), delivers 4.1 ns max propagation delay at 3.3 V, and features Ioff and power-up 3-state for hot-insertion in memory address, clock, and bus driver applications.

For engineers reviewing the SN74LVCZ16244ADGGR datasheet, SN74LVCZ16244ADGGR pinout, SN74LVCZ16244ADGGR application, or SN74LVCZ16244ADGGR equivalent, key selection criteria include 3.3-V supply compatibility, 5-V tolerant inputs, 16-bit 3-state drive capability, thermal performance (θJA = 70°C/W), and TSSOP-48 packaging for high-density PCB layouts.

Technical Context

This device implements four independent 4-bit buffered channels, each with dedicated output-enable (OE) control. Its logic architecture ensures true (non-inverted) output behavior and supports configurable partitioning as one 16-bit, two 8-bit, or four 4-bit buffers. The Ioff circuitry actively disables outputs when VCC = 0 V, preventing backflow current during hot insertion.

Power-up 3-state functionality forces outputs into high-impedance when VCC is below 1.5 V, and OE must be pulled up above that threshold to guarantee full 3-state control. Input clamp diodes and JESD 78 Class II latch-up immunity (>100 mA) enable robust operation in noisy or mixed-voltage system environments.

Key Specifications

ParameterValue and Actual Design Meaning
VCC Range2.7 V to 3.6 V - Ensures stable operation in modern 3.3-V digital systems with ±0.3-V margin.
Input Voltage Tolerance0 V to 5.5 V - Enables direct interfacing with legacy 5-V logic without level shifters.
Max tpd4.1 ns at 3.3 V - Supports high-speed data transfer in memory and clock distribution paths.
Ioff SupportActive at VCC = 0 V - Prevents damaging back-current during live board insertion or removal.
Output Drive±24 mA at 3 V - Sufficient for driving multiple CMOS loads or moderate-capacitance buses.
Thermal ResistanceθJA = 70°C/W (TSSOP-DGG) - Defines maximum power dissipation under natural convection cooling.
ESD Protection2000-V HBM, 1000-V CDM - Meets industrial-grade reliability requirements per JESD 22.

Pinout & Package

TSSOP-48 (DGG) package: 48-pin thin shrink small-outline package, 12.6 mm × 6.1 mm body, 0.5-mm pitch, 1.2-mm max height, JEDEC MO-153 compliant.

Pin/TerminalCircuit RoleDesign Meaning
1OE–4OEOutput Enable InputsActive-low enables for each 4-bit channel; independent control allows selective bus segmentation.
1A1–4A4Buffer Inputs16 total input pins accepting 5-V-tolerant signals; grouped in four 4-bit sets.
1Y1–4Y4True Output Terminals16 non-inverting 3-state outputs; high-impedance when corresponding OE is high.
VCC (Pins 7, 14, 28, 41)Supply RailFour distributed VCC connections reduce switching noise and improve power integrity across wide bus.
GND (Pins 4, 10, 17, 25, 32, 39)Ground ReferenceSix GND pins provide low-inductance return paths for all 16 drivers and minimize ground bounce.

Key Features

FeatureDesign Value
Mixed-mode signal operation5-V input compatibility with 3.3-V VCC eliminates external level translators in hybrid voltage systems.
Hot-insertion supportIoff and power-up 3-state prevent bus contention and backfeed damage during live card replacement.
Configurable bufferingFour independent 4-bit sections allow flexible use as 16-bit, dual 8-bit, or quad 4-bit drivers.
Low dynamic power32 pF typical power-dissipation capacitance per enabled buffer reduces switching current at 10 MHz.
Robust ESD/latch-upJESD 22-compliant ESD (2000-V HBM) and JESD 78 Class II latch-up (>100 mA) ensure field reliability.

Applications

Memory Address BufferingClock Distribution

Use Scenario: Driving address lines from a 3.3-V microcontroller to multiple 5-V SRAM or Flash devices on a shared bus.

IC Role / Device Role / Timing Role: Level-translating 16-bit non-inverting buffer with 3-state control for bidirectional address isolation.

Use Value: Eliminates discrete level shifters while maintaining timing integrity (4.1 ns tpd) and preventing bus conflicts via independent OE control.

Use Scenario: Distributing a single system clock to multiple 3.3-V peripherals with matched trace lengths and minimal skew.

IC Role / Device Role / Timing Role: Low-skew, high-drive clock fanout buffer with 3-state disable for dynamic clock gating.

Use Value: Delivers ±24 mA drive strength and 4.1 ns propagation delay consistency across all 16 outputs for synchronous timing.

PCI/ISA Bus InterfaceIndustrial I/O Expansion

Use Scenario: Isolating and buffering control/data lines between a 3.3-V host processor and legacy 5-V PCI or ISA peripheral cards.

IC Role / Device Role / Timing Role: Hot-pluggable 3-state bus transceiver enabling safe insertion/removal of expansion cards without system reset.

Use Value: Ioff protection prevents back-current damage; 5-V tolerant inputs accept legacy bus signaling directly.

Use Scenario: Expanding GPIO count on an industrial PLC controller by interfacing 3.3-V FPGA/CPU to 5-V sensor/actuator modules.

IC Role / Device Role / Timing Role: Configurable 16-bit I/O port buffer with per-channel OE for modular subsystem enable/disable.

Use Value: Four independent OE pins allow selective activation of sensor banks or actuator groups, reducing system-level power consumption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit 3-state buffer applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
SN74LVC16244ADGGRLacks Z-series Ioff and enhanced hot-insertion features; identical pinout and DC specs.Not suitable for live-insertion systems requiring back-current prevention.Select SN74LVCZ16244ADGGR where hot-swap capability is mandatory.
74ALVC16244DGGRWider VCC range (1.65 V–3.6 V); lower drive (±24 mA at 3 V, but only ±12 mA at 1.8 V).Better suited for ultra-low-voltage mixed-supply designs, not 3.3-V-only systems.Choose SN74LVCZ16244ADGGR for guaranteed 3.3-V performance and superior hot-insertion robustness.

Compared with SN74LVC16244ADGGR and 74ALVC16244DGGR, the SN74LVCZ16244ADGGR uniquely combines 5-V input tolerance, Ioff-enabled hot insertion, and consistent 4.1 ns tpd at 3.3 V-making it the optimal choice for industrial backplane and memory interface applications demanding reliability and timing precision.

Availability

SN74LVCZ16244ADGGR is available at Aetrix Electronics and suitable for memory address buffering, clock distribution, and industrial I/O expansion requiring stable component supply, long-term lifecycle support, and RoHS-compliant TSSOP packaging.

Supply support for SN74LVCZ16244ADGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.

The SN74LVCZ16244ADGGR belongs to TI's Widebus™ family of high-speed, low-voltage logic devices engineered specifically for dense, high-reliability bus interface and memory addressing applications in mixed-voltage systems.

FAQ

What is the operating voltage range for the SN74LVCZ16244ADGGR?

The SN74LVCZ16244ADGGR operates from 2.7 V to 3.6 V on VCC. Its inputs tolerate voltages up to 5.5 V, enabling interoperability with 5-V logic families while powered from a 3.3-V rail. This specification is validated across –40°C to +85°C ambient temperature and confirmed in TI's SCES277D datasheet Section 5 (Recommended Operating Conditions).

Does the SN74LVCZ16244ADGGR support hot insertion?

Yes, the SN74LVCZ16244ADGGR supports hot insertion via two integrated features: Ioff circuitry disables outputs when VCC = 0 V to block reverse current, and power-up 3-state forces outputs into high-impedance during VCC ramp-up (0–1.5 V). These functions are explicitly documented in the device description and functional table of the SCES277D datasheet.

What package type and dimensions does the SN74LVCZ16244ADGGR use?

The SN74LVCZ16244ADGGR uses a TSSOP-48 (DGG) package: 12.6 mm × 6.1 mm body size, 0.5-mm lead pitch, 1.2-mm maximum height, and JEDEC MO-153 compliance. Pin 1 orientation follows quadrant Q1 tape-and-reel configuration, and thermal resistance is θJA = 70°C/W, per TI's mechanical drawing DGG0048A and Package Option Addendum.

How many independent 3-state control inputs does the SN74LVCZ16244ADGGR have?

The SN74LVCZ16244ADGGR has four independent active-low output-enable inputs: 1OE, 2OE, 3OE, and 4OE - one per 4-bit buffer section. This allows granular control over bus segments, such as enabling only address bits [15:8] while holding [7:0] in high-impedance. The pinout and function table are verified in the top-view diagram and logic diagram of SCES277D.

What is the maximum propagation delay of the SN74LVCZ16244ADGGR at 3.3 V?

The maximum propagation delay (tpd) of the SN74LVCZ16244ADGGR is 4.1 ns at VCC = 3.3 V ± 0.3 V, CL = 50 pF, and TA = 25°C. This value is specified in the "Switching Characteristics" table (Page 4) of the SCES277D datasheet and applies to the A→Y path under worst-case conditions.

SN74LVCZ16244ADGGR Specifications

Product attributes
Attribute value
Manufacturer:
Texas Instruments
Series:
74LVCZ
Package/Case:
48-TFSOP (0.240", 6.10mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Logic Type:
Buffer, Non-Inverting
Number of Elements:
4
Number of Bits per Element:
4
Input Type:
-
Output Type:
3-State
Current - Output High, Low:
24mA, 24mA
Voltage - Supply:
2.7V ~ 3.6V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
48-TSSOP

SN74LVCZ16244ADGGR FAQ

1.How can I place an order for SN74LVCZ16244ADGGR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74LVCZ16244ADGGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

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The price and inventory of SN74LVCZ16244ADGGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVCZ16244ADGGR is usually 5 days.

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5.How can I obtain technical support or documentation for SN74LVCZ16244ADGGR?

For technical support, including SN74LVCZ16244ADGGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVCZ16244ADGGR requirements.

6.How does Aetrix verify that SN74LVCZ16244ADGGR is sourced from the original manufacturer or authorized distributors?

All SN74LVCZ16244ADGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVCZ16244ADGGR meets industry standards.

7.What is the process for return or replacement of SN74LVCZ16244ADGGR?

All SN74LVCZ16244ADGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVCZ16244ADGGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74LVCZ16244ADGGR part is unused and in its original packaging.

Return procedure for SN74LVCZ16244ADGGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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