Texas Instruments SN74LVCZ16245ADGGR

Overview

SN74LVCZ16245ADGGR from Texas Instruments is a 16-bit noninverting bus transceiver with 3-state outputs, designed for asynchronous bidirectional data transfer between 2.7-V to 3.6-V buses. It supports mixed-mode signaling (5-V inputs with 3.3-V V_CC), delivers 3.7-ns max propagation delay at 3.3 V, and features I_off and power-up 3-state for hot-insertion safety in backplane and modular systems.

For engineers reviewing the SN74LVCZ16245ADGGR datasheet, SN74LVCZ16245ADGGR pinout, SN74LVCZ16245ADGGR application, or SN74LVCZ16245ADGGR equivalent, key selection criteria include 48-pin TSSOP package compatibility, dual-octal directional control (DIR/OE), 5.5-V tolerant inputs, and guaranteed high-impedance state during power transitions - critical for FPGA-to-ASIC interconnects and legacy bus bridging.

Technical Context

This device implements two independent 8-bit transceiver sections, each with dedicated direction (DIR) and output-enable (OE) controls, enabling flexible A↔B or B↔A data flow without external logic. Its I_off circuitry actively disables outputs when V_CC < 1.5 V, preventing backdrive current during hot-swap events.

The SN74LVCZ16245ADGGR operates across –40°C to 85°C with 2.7–3.6-V supply, accepts input voltages up to 5.5 V on all ports, and maintains rail-to-rail output swing (0 to V_CC) while supporting 50-pF load switching at ≤4 ns typical t_pd. Latch-up immunity exceeds 100 mA per JESD 78 Class II.

Key Specifications

Pinout & Package

TSSOP-48 (DGG) package: 48-pin thin shrink small-outline package, 12.6 mm × 6.2 mm × 1.2 mm max height, JEDEC MO-153 compliant, lead-free (NiPdAu), MSL Level-1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus transceiver applications.

Compared with SN74LVCZ16245ADGGR, SN74LVC16245ADGGR sacrifices hot-swap safety and voltage translation for lower unit cost, while SN74ALVC16245DGGR trades mixed-mode capability for broader low-voltage operation - making SN74LVCZ16245ADGGR the sole choice for industrial backplanes requiring both 5-V tolerance and live insertion.

Availability

SN74LVCZ16245ADGGR is available at Aetrix Electronics and suitable for industrial backplane interfaces, FPGA-to-ASIC bridging, hot-swappable module adapters, and memory expansion subsystems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for SN74LVCZ16245ADGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 50 years of innovation in high-reliability interface solutions.

The SN74LVCZ16245ADGGR belongs to TI's Widebus™ family of advanced bus interface devices, engineered specifically for robust, low-latency bidirectional data transfer in mixed-voltage, hot-pluggable industrial and telecom infrastructure.

FAQ

What is the maximum input voltage rating for SN74LVCZ16245ADGGR?

The SN74LVCZ16245ADGGR supports input voltages from –0.5 V to 5.5 V across all I/O pins, independent of V_CC. This 5.5-V tolerance enables direct connection to legacy 5-V logic without external level shifters, and is explicitly verified in the absolute maximum ratings and recommended operating conditions tables of the SCES278D datasheet.

Does SN74LVCZ16245ADGGR support hot insertion, and how is it implemented?

Yes, SN74LVCZ16245ADGGR supports hot insertion via two integrated features: I_off circuitry that disables outputs when V_CC is unpowered (≤0 V), and power-up 3-state logic that forces outputs into high-impedance during V_CC ramp-up (0–1.5 V). Both mechanisms prevent backdrive current and bus contention, meeting JESD 78 Class II latch-up immunity requirements.

What package type and dimensions does SN74LVCZ16245ADGGR use?

SN74LVCZ16245ADGGR uses a 48-pin TSSOP package (TI package code DGG), measuring 12.6 mm × 6.2 mm × 1.2 mm max height, with 0.5-mm pitch and JEDEC MO-153 compliance. The device is lead-free, RoHS-compliant, and rated MSL Level-1 (unlimited floor life at ≤30°C/60% RH), as confirmed in TI's Package Option Addendum dated November 2025.

How many independent transceiver sections does SN74LVCZ16245ADGGR contain?

SN74LVCZ16245ADGGR contains two independent 8-bit transceiver sections (labeled Section 1 and Section 2), each with dedicated DIR and OE controls. This architecture allows simultaneous or asymmetric data flow - e.g., Section 1 operating A→B while Section 2 operates B→A - enabling flexible bus partitioning in complex interconnect topologies.

What is the typical propagation delay of SN74LVCZ16245ADGGR at 3.3 V?

The typical propagation delay (t_pd) of SN74LVCZ16245ADGGR is 3.7 ns at V_CC = 3.3 V with CL = 50 pF, as specified in the switching characteristics table of the SCES278D datasheet. This value is measured from input transition (50% point) to output transition (50% point) under loaded conditions representative of real-world PCB trace and receiver capacitance.