Texas Instruments SN74LVCZ240ADGVRE4

Overview

SN74LVCZ240ADGVRE4 from Texas Instruments is an octal 3-state buffer/driver IC designed for memory address, clock, and bus interface applications in mixed-voltage systems. It operates from 2.7 V to 3.6 V, accepts 5.5-V-tolerant inputs, delivers 6.5-ns max propagation delay at 3.3 V, and supports hot insertion via Ioff and power-up 3-state logic. Used in industrial control backplanes and FPGA I/O expansion interfaces.

For engineers reviewing the SN74LVCZ240ADGVRE4 datasheet, SN74LVCZ240ADGVRE4 pinout, SN74LVCZ240ADGVRE4 application, or SN74LVCZ240ADGVRE4 equivalent, key selection criteria include 5-V input tolerance with 3.3-V VCC, guaranteed high-impedance state during power sequencing, latch-up immunity >100 mA, and TVSOP (DGV) package thermal performance (θJA = 92°C/W).

Technical Context

This device implements two independent 4-bit noninverting buffers, each with dedicated output-enable (OE) control. Inputs are 5-V tolerant regardless of VCC level, enabling bidirectional voltage translation between 3.3-V logic domains and legacy 5-V peripherals without external level shifters.

Its Ioff circuitry actively disables outputs when VCC = 0 V, preventing backflow current during hot insertion. Power-up 3-state ensures outputs remain high-impedance until VCC exceeds 1.5 V - critical for backplane hot-swap compliance and avoiding bus contention during system power ramp.

Key Specifications

Pinout & Package

SN74LVCZ240ADGVRE4 uses a 20-pin TVSOP (Thin Very Small Outline Package) with 0.5-mm pitch and 4.4-mm body width. The DGV package offers low thermal resistance (θJA = 92°C/W) and compact footprint for space-constrained PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal 3-state buffer applications.

Compared with SN74LVCZ240ADGVRE4, the PW and DB alternatives offer identical logic functionality but differ in thermal resistance, footprint size, and solder joint reliability - DGV provides optimal density for high-I/O-count compact boards, while PW and DB suit thermal- or legacy-layout–driven designs.

Availability

SN74LVCZ240ADGVRE4 is available at Aetrix Electronics and suitable for industrial backplanes, FPGA I/O expansion, hot-swappable module control, and memory address buffering requiring stable component supply and long-term lifecycle support.

Supply support for SN74LVCZ240ADGVRE4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.

The SN74LVCZ240A family targets high-density, mixed-voltage digital interface applications - specifically engineered to replace older 74-series buffers in 3.3-V systems while maintaining backward compatibility with 5-V signal sources.

FAQ

What is the maximum input voltage rating for SN74LVCZ240ADGVRE4?

The SN74LVCZ240ADGVRE4 supports input voltages from –0.5 V to 5.5 V regardless of VCC level. This 5-V tolerance allows direct connection to legacy TTL or CMOS outputs without level-shifting circuitry, making it ideal for upgrading 3.3-V systems interfacing with 5-V peripherals. The absolute maximum rating remains 6.5 V, but sustained operation above 5.5 V violates recommended conditions.

Does SN74LVCZ240ADGVRE4 support hot insertion?

Yes, SN74LVCZ240ADGVRE4 is explicitly designed for hot-insertion applications. Its Ioff circuitry disables outputs when VCC = 0 V to prevent backflow current, and its power-up 3-state feature holds outputs in high-impedance mode until VCC exceeds 1.5 V. These features meet JESD22-A114/A115/C101 ESD requirements and eliminate bus contention during live card replacement in backplane systems.

What is the propagation delay of SN74LVCZ240ADGVRE4 at 3.3 V?

The maximum propagation delay (tpd) of SN74LVCZ240ADGVRE4 is 6.5 ns at VCC = 3.3 V, TA = 25°C, with CL = 30 pF. This value applies to both rising and falling edges under standard load conditions. At VCC = 2.7 V, the max tpd increases to 7.5 ns - a key parameter for timing closure in high-speed parallel bus designs such as memory address or data strobe paths.

How does SN74LVCZ240ADGVRE4 handle power sequencing in multi-rail systems?

SN74LVCZ240ADGVRE4 ensures safe operation during asymmetric power sequencing: when VCC ramps from 0 V to 1.5 V, outputs remain in high-impedance state due to built-in power-up 3-state logic. Once VCC exceeds 1.5 V, normal operation resumes only if OE is asserted. This prevents unintended output states that could cause bus conflicts or latch-up in systems where VCC, I/O supply, and control signals power up at different rates.

What package type and dimensions does SN74LVCZ240ADGVRE4 use?

SN74LVCZ240ADGVRE4 uses a 20-pin TVSOP (DGV) package measuring 4.4 mm × 6.5 mm with 0.5-mm lead pitch and maximum height of 1.2 mm. Its thermal resistance is θJA = 92°C/W, optimized for compact, thermally constrained layouts. The DGV package requires IPC-7351-compliant land patterns and stencil apertures sized for fine-pitch reflow - distinct from SOIC (DW), SSOP (DB), or TSSOP (PW) variants.