Texas Instruments SN74LVT162245AZRDR

Overview

SN74LVT162245AZRDR from Texas Instruments is a 3.3-V ABT 16-bit dual-octal noninverting bus transceiver with 3-state outputs, designed for asynchronous bidirectional data transfer between two 8-bit buses. It supports mixed-mode signaling (5-V inputs/outputs with 3.3-V V_CC), operates down to 2.7 V, and features integrated 22-Ω series resistors on A-port outputs to suppress overshoot/undershoot - used in high-speed backplane and motherboard interconnects.

For engineers reviewing the SN74LVT162245AZRDR datasheet, SN74LVT162245AZRDR pinout, SN74LVT162245AZRDR application, or SN74LVT162245AZRDR equivalent, key selection criteria include its 54-ball ZRD VFBGA package, I_OFF/power-up 3-state support for hot insertion, distributed V_CC/GND pins for noise reduction, flow-through pin architecture, and TTL-level compatibility in 3.3-V systems.

Technical Context

The SN74LVT162245AZRDR implements dual independent 8-bit transceiver channels, each controlled by dedicated DIR and OE signals. Its A-port outputs are internally series-terminated at 22 Ω, eliminating external termination resistors, while both A and B ports accept 5-V logic levels with 3.3-V supply - enabling seamless interfacing between legacy 5-V peripherals and modern low-voltage processors.

It incorporates I_OFF circuitry that disables outputs during power-down to prevent current backflow, and power-up 3-state logic ensures outputs remain high-impedance until V_CC stabilizes above 1.5 V. Latch-up performance exceeds 100 mA per JESD 78 Class II, and ESD protection meets 2000-V HBM, 200-V MM, and 1000-V CDM standards.

Key Specifications

Pinout & Package

SN74LVT162245AZRDR uses a 54-ball ZRD VFBGA package (10 mm × 10 mm, 0.8-mm pitch), optimized for space-constrained applications requiring high I/O density and low inductance. Ball assignments follow JEDEC MO-205 standard with distributed V_CC/GND balls to minimize switching noise.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bus transceiver applications.

Compared with SN74LVC162245ADLR, SN74LVT162245AZRDR delivers 2.7× higher B-port drive and native 5-V tolerance; versus SN74ALVC162245GRDR, it trades 0.4 ns speed for integrated termination and robust hot-swap reliability - making it optimal for mixed-voltage embedded interconnects where layout simplicity and system-level robustness are prioritized.

Availability

SN74LVT162245AZRDR is available at Aetrix Electronics and suitable for server backplanes, industrial PLC I/O modules, automotive ADAS domain controllers, and test equipment data acquisition boards requiring stable component supply across extended temperature and long production lifecycles.

Supply support for SN74LVT162245AZRDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of expertise in high-reliability interface solutions.

The SN74LVT162245AZRDR belongs to TI's Widebus™ family of ABT transceivers, engineered specifically for low-voltage, high-speed bidirectional bus interfacing in mixed-signal systems where voltage translation, noise immunity, and hot-plug resilience are critical.

FAQ

What is the operating temperature range for SN74LVT162245AZRDR?

The SN74LVT162245AZRDR is rated for operation from –40°C to +85°C ambient temperature. This industrial-grade specification ensures reliable performance in server backplanes, factory automation equipment, and automotive under-hood control units where thermal cycling and sustained elevated temperatures occur. The device maintains full electrical compliance across this range, including specified I_OL, t_PLH, and V_OH/V_OL parameters.

Does SN74LVT162245AZRDR support hot insertion, and how is it implemented?

Yes, SN74LVT162245AZRDR supports hot insertion via two complementary features: I_OFF circuitry disables outputs when V_CC = 0 V, preventing damaging current backflow during card insertion; and power-up 3-state logic holds all outputs in high-impedance until V_CC exceeds 1.5 V. These functions are intrinsic to the silicon design and require no external components - verified per JESD78 latch-up and JESD22 ESD standards.

What package type and ball count does SN74LVT162245AZRDR use?

SN74LVT162245AZRDR uses a 54-ball ZRD VFBGA package (10 mm × 10 mm, 0.8-mm pitch), Pb-free and RoHS-compliant. This fine-pitch ball grid array provides superior thermal dissipation (θ_JA = 36 °C/W) and low-inductance interconnects compared to TSSOP or SSOP alternatives. Pin-compatible with SN74LVT162245AGRDR (GQL variant), it shares identical ball mapping except for NC locations.

Can SN74LVT162245AZRDR interface between 3.3-V and 5-V logic without external level shifters?

Yes, SN74LVT162245AZRDR natively supports mixed-mode operation: its inputs tolerate up to 5.5 V regardless of V_CC, and its B-port outputs drive 5-V TTL loads at full strength (64 mA sink). The A-port outputs are 3.3-V compatible with integrated 22-Ω series resistors. No external level-shifting components are needed - confirmed by TI's recommended operating conditions and absolute maximum ratings tables.

What is the maximum data rate supported by SN74LVT162245AZRDR in practical PCB layouts?

Based on its typical propagation delay of 2.2–3.3 ns (A→B) and 2.5–3.6 ns (B→A) at V_CC = 3.3 V, SN74LVT162245AZRDR supports reliable data rates up to 200 Mbps in well-designed FR-4 PCBs with controlled impedance (50 Ω) and 50 pF load. Real-world performance depends on trace length, termination, and noise margin - TI's flow-through architecture and distributed power pins help maintain signal integrity at these speeds without added complexity.