Texas Instruments SN74LVT16244BZRDR

Overview

SN74LVT16244BZRDR from Texas Instruments is a 3.3-V ABT 16-bit noninverting buffer/driver with 3-state outputs, designed for mixed-mode signal operation between 3.3-V logic and 5-V systems. It delivers ±64 mA output drive at VCC = 3.3 V, supports hot insertion via Ioff and power-up 3-state, and operates across –40°C to 85°C in a 54-ball ZRD VFBGA package. It is used in high-density memory interface and bus isolation applications.

For engineers reviewing the SN74LVT16244BZRDR datasheet, SN74LVT16244BZRDR pinout, SN74LVT16244BZRDR application, or SN74LVT16244BZRDR equivalent, key selection criteria include 3.3-V supply compatibility, 5-V tolerant inputs, symmetrical active-low OE control per 4-bit group, low ground bounce (<0.8 V), and Pb-free VFBGA packaging for space-constrained PCB layouts.

Technical Context

The SN74LVT16244BZRDR implements four independent 4-bit noninverting buffers, each with dedicated active-low output-enable (OE) inputs (1OE–4OE). Its Advanced BiCMOS Technology (ABT) enables TTL-level interfacing while operating from a 2.7–3.6-V supply, supporting unregulated battery input down to 2.7 V.

It features Ioff circuitry that disables outputs during power-down to prevent backflow current, and power-up 3-state logic that holds outputs in high-impedance until VCC stabilizes above 1.5 V-critical for hot-plug and live-insertion systems. Input clamp current exceeds –50 mA, and latch-up performance exceeds 100 mA per JESD 78 Class II.

Key Specifications

Pinout & Package

The SN74LVT16244BZRDR is housed in a 54-ball ZRD VFBGA package (2.5 mm × 3.5 mm, 0.4 mm pitch), Pb-free and RoHS-compliant, with JEDEC MO-153 footprint compatibility. Ball mapping follows standard ZRD top-side marking "VD244B".

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit buffer/driver applications.

Compared with SN74LVC16244ADGGR and SN74ALVC16244DGVR, the SN74LVT16244BZRDR provides superior drive strength (64 mA), lower thermal resistance (36 °C/W), and proven hot-insertion capability - making it the only option among the three qualified for high-reliability, high-density, and live-swap industrial applications.

Availability

SN74LVT16244BZRDR is available at Aetrix Electronics and suitable for memory interface buffering, industrial bus isolation, FPGA I/O expansion, and hot-swappable module interfacing requiring stable component supply, long-term lifecycle assurance, and Pb-free compliance.

Supply support for SN74LVT16244BZRDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of innovation in high-speed interface and power-efficient logic families.

The SN74LVT16244BZRDR belongs to TI's Widebus™ ABT logic family, engineered specifically for high-drive, mixed-voltage bus interfacing in industrial, telecom, and computing infrastructure where reliability under dynamic power conditions is essential.

FAQ

What is the maximum output current rating for SN74LVT16244BZRDR?

The SN74LVT16244BZRDR supports up to 64 mA sink current (IOL) and –32 mA source current (IOH) per output at VCC = 3.3 V, as specified in the Absolute Maximum Ratings and Electrical Characteristics tables. These values are validated across the full operating temperature range (–40°C to 85°C) and define the safe steady-state drive capability before thermal derating applies. Exceeding these limits risks permanent device degradation.

Does SN74LVT16244BZRDR support 5-V input signals while operating at 3.3-V VCC?

Yes, the SN74LVT16244BZRDR explicitly supports 5-V tolerant inputs - its VI rating extends to 5.5 V regardless of VCC, enabling direct connection to 5-V TTL or CMOS outputs without external level-shifting components. This capability is confirmed in the Recommended Operating Conditions table and is intrinsic to the ABT process architecture used in the SN74LVT16244BZRDR design.

How does the power-up 3-state feature work in SN74LVT16244BZRDR?

The SN74LVT16244BZRDR incorporates dedicated power-up 3-state circuitry that forces all outputs into high-impedance during VCC ramp-up and ramp-down, regardless of OE state. This behavior is guaranteed when VCC is below 1.5 V and prevents bus conflicts in systems where multiple drivers share a common line. The feature is implemented in silicon and requires no external components - it is an inherent property of the SN74LVT16244BZRDR ABT core.

Can SN74LVT16244BZRDR be used in hot-swap applications?

Yes, the SN74LVT16244BZRDR is explicitly qualified for hot-insertion applications. Its Ioff circuitry disables outputs when VCC = 0 V, blocking damaging backflow current from live backplanes into the unpowered device. Combined with power-up 3-state, this dual protection ensures safe insertion/removal in powered systems - a requirement verified per JESD 78 Class II latch-up testing and documented in the official SN74LVT16244BZRDR datasheet.

What is the thermal resistance (θJA) of the SN74LVT16244BZRDR package?

The SN74LVT16244BZRDR in the ZRD VFBGA package has a junction-to-ambient thermal resistance (θJA) of 36 °C/W, as published in the Absolute Maximum Ratings table. This value is measured under standard JEDEC JESD 51-7 conditions and reflects the package's superior heat dissipation versus larger alternatives like TSSOP (70 °C/W) or TVSOP (58 °C/W), making the SN74LVT16244BZRDR suitable for thermally dense applications without heatsinking.