Texas Instruments SN74LVT16245BDGVR
- Part No.:
- SN74LVT16245BDGVR
- Manufacturer:
- Texas Instruments
- Package:
- 48-TFSOP (0.173", 4.40mm Width)
- Datasheet:
-
SN74LVT16245BDGVR.pdf
- Description:
- IC TXRX NON-INVERT 3.6V 48TVSOP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SN74LVT16245BDGVR from Texas Instruments is a 3.3-V ABT 16-bit dual-octal noninverting bus transceiver with 3-state outputs, designed for asynchronous bidirectional data transfer between 3.3-V and 5-V systems. It features 48-pin TVSOP (DGV) packaging, ±64 mA output drive, 2.7–3.6 V supply range, and supports hot insertion via Ioff and power-up 3-state logic. It is used in mixed-voltage backplane interfaces and FPGA-to-ASIC interconnects.
For engineers reviewing the SN74LVT16245BDGVR datasheet, SN74LVT16245BDGVR pinout, SN74LVT16245BDGVR application, or SN74LVT16245BDGVR equivalent, key selection criteria include its 3.3-V ABT process enabling TTL-level compatibility, distributed VCC/GND pins for noise suppression, flow-through pin architecture for PCB layout optimization, and guaranteed operation down to 2.7 V for battery-backed systems.
Technical Context
The SN74LVT16245BDGVR implements two independent 8-bit transceiver sections, each controlled by dedicated DIR (direction) and OE (output enable) inputs. Its ABT BiCMOS process delivers low static power dissipation while maintaining TTL-compatible input thresholds (VIH = 2.0 V, VIL = 0.8 V) and 5-V-tolerant I/Os at 3.3-V VCC.
It supports true hot-insertion through Ioff circuitry that disables outputs when VCC = 0 V, preventing current backflow, and power-up 3-state logic that holds outputs high-impedance during power ramping. The device's flow-through pinout-A-port inputs on one side, B-port outputs on the opposite-minimizes trace crossovers in dense routing environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCC Range | 2.7 V to 3.6 V - supports unregulated battery operation and ensures stable interface across industrial voltage tolerances. |
| IOL / IOH | 64 mA / –32 mA - drives standard TTL loads directly without external buffers, enabling fanout of ≥10 LVTTL gates. |
| tPLH / tPHL | 2.3 ns / 2.1 ns (typ, VCC = 3.3 V) - enables reliable 200+ MHz data transfer in synchronous bus applications. |
| VIH / VIL | 2.0 V / 0.8 V - guarantees robust recognition of 5-V logic levels while operating at 3.3-V supply. |
| VOL / VOH | 0.5 V / 2.0 V (IOL = 64 mA, IOH = –32 mA) - meets LVTTL output voltage specifications under full load. |
| IOFF | ±100 µA (VCC = 0 V) - prevents damaging back-current during live insertion into powered backplanes. |
| θJA | 58 °C/W - compatible with standard PCB thermal design rules for TVSOP packages without forced airflow. |
Pinout & Package
SN74LVT16245BDGVR uses a 48-pin Thin Very Small Outline Package (TVSOP, DGV), 3.6 mm × 9.7 mm body, 0.4 mm pitch, 1.2 mm max height, JEDEC MO-153 compliant. Pin 1 located at top-left corner (Q1 quadrant), marked by beveled corner or dot.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1DIR, 2DIR | Direction control input (active-HIGH) | Selects data flow direction per section: HIGH = A→B, LOW = B→A; enables asymmetric bus arbitration. |
| 1OE, 2OE | Output enable input (active-LOW) | Disables both A- and B-port outputs simultaneously into high-impedance state; critical for bus sharing. |
| 1A1–1A8, 2A1–2A8 | A-port data inputs/outputs | Connect to local-side bus (e.g., FPGA or microcontroller); always active - must be terminated to avoid excess ICCZ. |
| 1B1–1B8, 2B1–2B8 | B-port data inputs/outputs | Interface to remote-side bus (e.g., memory or peripheral); 5-V tolerant with 3.3-V VCC for mixed-mode operation. |
| VCC (Pins 7, 22, 29, 44) | Power supply | Distributed VCC pins reduce simultaneous switching noise and improve signal integrity on high-speed buses. |
| GND (Pins 4, 11, 18, 35, 41, 47) | Ground reference | Six GND pins minimize ground bounce (VOLP < 0.8 V) and support clean return paths for all 16 channels. |
Key Features
| Feature | Design Value |
|---|---|
| Mixed-mode signal operation | 5-V-tolerant I/Os with 3.3-V VCC allow direct interfacing between legacy 5-V logic and modern low-voltage FPGAs or processors. |
| Flow-through architecture | A-port signals enter left side, B-port signals exit right side - eliminates layer jumps and reduces PCB routing complexity. |
| Distributed VCC/GND pins | Four VCC and six GND pins placed across package width suppress high-frequency switching noise and improve EMI performance. |
| Hot-insertion support | Ioff and power-up 3-state ensure safe insertion into live backplanes without disrupting system operation or damaging components. |
| Latch-up immunity | Exceeds 100 mA per JESD 78 Class II - prevents destructive latch-up events in noisy industrial environments. |
Applications
| Industrial Backplane Interface | FPGA-to-Peripheral Bridge |
|---|---|
|
Use Scenario: Bidirectional data exchange between a 3.3-V FPGA and legacy 5-V I/O modules on a modular PLC backplane. IC Role / Device Role / Timing Role: Bus transceiver managing direction-controlled, isolated data lanes with cycle-accurate timing alignment. Use Value: Eliminates level-shifter ICs and discrete resistors, reducing BOM count and board area while maintaining signal integrity up to 200 MHz. |
Use Scenario: Interfacing a Xilinx Artix-7 FPGA to 5-V SPI flash, UART peripherals, and GPIO expanders in an edge gateway. IC Role / Device Role / Timing Role: Voltage-translating transceiver enabling synchronous read/write cycles without clock domain crossing logic. Use Value: Supports 5-V peripheral compatibility without external pull-ups or voltage translators, simplifying firmware bring-up and validation. |
| Memory Subsystem Isolation | Hot-Swappable Module Interface |
|
Use Scenario: Isolating DDR2 SDRAM controller signals from shared system bus in a telecom line card with multiple memory banks. IC Role / Device Role / Timing Role: 3-state-enabled buffer providing deterministic bus release timing during memory arbitration transitions. Use Value: Prevents bus contention during bank switching; 2.1 ns propagation delay ensures setup/hold timing margins remain intact. |
Use Scenario: Enabling live replacement of compute modules in a redundant server chassis with powered-backplane architecture. IC Role / Device Role / Timing Role: Hot-insertion–qualified transceiver isolating module-local buses from main chassis backplane during insertion/removal. Use Value: Ioff protection limits inrush current to <100 µA at VCC = 0 V, meeting IEC 61000-4-2 ESD and MIL-STD-704 power integrity requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bus transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SN74LVTH16245ADGGR | Lower drive strength (IOL = 32 mA), LVCMOS input thresholds (VIH = 2.0 V, but no 5-V tolerance), same 48-pin TSSOP package. | Not suitable for 5-V system interfacing; limited to pure 3.3-V domains with lower fanout requirements. | Choose when cost reduction is prioritized over mixed-voltage capability and full LVTTL drive. |
| SN74ALVC164245DGGR | Higher speed (tPLH = 1.8 ns typ), dual-supply operation (VCCA = 1.65–3.6 V, VCCB = 2.3–3.6 V), no 5-V tolerance, same pin count. | Requires separate VCCA/VCCB rails; ideal for voltage translation between two low-voltage domains (e.g., 1.8 V ↔ 3.3 V). | Choose for ultra-low-voltage heterogeneous SoC interconnects where 5-V compatibility is unnecessary. |
Compared with SN74LVTH16245ADGGR and SN74ALVC164245DGGR, the SN74LVT16245BDGVR uniquely combines 5-V-tolerant I/Os, ±64 mA drive, and ABT process noise immunity - making it the only option among the three qualified for direct 3.3-V/5-V bus bridging in industrial backplanes.
Availability
SN74LVT16245BDGVR is available at Aetrix Electronics and suitable for industrial backplane interfaces, FPGA peripheral bridges, memory subsystem isolation, and hot-swappable module interfaces requiring stable component supply across extended temperature ranges (–40°C to 85°C).
Supply support for SN74LVT16245BDGVR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with decades of experience in high-reliability interface solutions.
The SN74LVT16245BDGVR belongs to TI's Widebus™ family of advanced bus interface devices, engineered specifically for robust, low-noise, mixed-voltage communication in industrial automation, telecom infrastructure, and programmable logic systems.
FAQ
What is the maximum operating temperature range for the SN74LVT16245BDGVR?
The SN74LVT16245BDGVR is rated for operation from –40°C to +85°C ambient temperature. This industrial-grade range is validated per TI's recommended operating conditions and supported by thermal characterization (θJA = 58 °C/W). The device maintains full electrical specifications-including 64 mA output drive and 2.1 ns propagation delay-across this entire range, making it suitable for deployment in enclosed control cabinets and outdoor telecom enclosures without derating.
Does the SN74LVT16245BDGVR support 5-V input signals while powered at 3.3 V?
Yes, the SN74LVT16245BDGVR supports 5-V-tolerant inputs and outputs when VCC = 3.3 V. Its ABT process allows VI and VO to reach up to 7 V (absolute max) and operate reliably at 5.5 V under recommended conditions. This enables direct connection to legacy 5-V TTL or LVTTL peripherals without external level shifters-confirmed by TI's Electrical Characteristics table showing VI = 5.5 V and VO = 5.5 V compliance.
How does the SN74LVT16245BDGVR handle power-up sequencing in systems with multiple voltage rails?
The SN74LVT16245BDGVR incorporates power-up 3-state logic that forces all outputs into high-impedance during VCC ramp-up (0–1.5 V), preventing bus conflicts before system stabilization. When VCC exceeds 1.5 V, OE must be pulled high (e.g., via resistor to VCC) to maintain high-Z until software asserts control. This behavior is documented in the Functional Description section and verified in TI's Recommended Operating Conditions table.
Can the SN74LVT16245BDGVR be used in hot-swap applications?
Yes, the SN74LVT16245BDGVR is explicitly designed for hot-insertion. Its Ioff circuitry disables outputs when VCC = 0 V, limiting reverse current to ±100 µA, and its power-up 3-state ensures outputs remain high-Z during power application. These features meet JESD78 Class II latch-up immunity and are validated per TI's Application Report SCBA004 on floating input implications.
What is the pin-compatible replacement for SN74LVT16245BDGVR in TSSOP packaging?
The SN74LVT16245BDGGR is the pin-compatible TSSOP (DGG) variant of the SN74LVT16245BDGVR. Both share identical pinout, electrical specifications, and functional behavior; only package dimensions differ (DGV: 3.6 × 9.7 mm, DGG: 6.1 × 12.5 mm). No PCB redesign is required when migrating between them-TI confirms mechanical compatibility in Package Option Addendum documentation.
SN74LVT16245BDGVR Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- 74LVT
- Package/Case:
- 48-TFSOP (0.173", 4.40mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Logic Type:
- Transceiver, Non-Inverting
- Number of Elements:
- 2
- Number of Bits per Element:
- 8
- Input Type:
- -
- Output Type:
- 3-State
- Current - Output High, Low:
- 32mA, 64mA
- Voltage - Supply:
- 2.7V ~ 3.6V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-TVSOP
SN74LVT16245BDGVR FAQ
1.How can I place an order for SN74LVT16245BDGVR through Aetrix?
Please submit a Request for Quotation (RFQ) for SN74LVT16245BDGVR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SN74LVT16245BDGVR reliable?
The price and inventory of SN74LVT16245BDGVR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74LVT16245BDGVR is usually 5 days.
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5.How can I obtain technical support or documentation for SN74LVT16245BDGVR?
For technical support, including SN74LVT16245BDGVR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74LVT16245BDGVR requirements.
6.How does Aetrix verify that SN74LVT16245BDGVR is sourced from the original manufacturer or authorized distributors?
All SN74LVT16245BDGVR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74LVT16245BDGVR meets industry standards.
7.What is the process for return or replacement of SN74LVT16245BDGVR?
All SN74LVT16245BDGVR units undergo pre-shipment inspection (PSI). If there is an issue with SN74LVT16245BDGVR, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SN74LVT16245BDGVR part is unused and in its original packaging.
Return procedure for SN74LVT16245BDGVR:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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