Texas Instruments SN74LVT16245BDL

Overview

SN74LVT16245BDL from Texas Instruments is a 3.3-V ABT 16-bit dual-octal noninverting bus transceiver with 3-state outputs, designed for asynchronous bidirectional data transfer between two 8-bit buses in mixed-voltage systems. It supports 5-V-tolerant I/O with 3.3-V VCC, delivers ±64 mA output drive at 3.3 V, and features hot-insertion support via Ioff and power-up 3-state logic. Used in backplane interface, memory expansion, and FPGA-to-ASIC interconnect applications.

For engineers reviewing the SN74LVT16245BDL datasheet, SN74LVT16245BDL pinout, SN74LVT16245BDL application, or SN74LVT16245BDL equivalent, key selection considerations include its 48-pin SSOP (DL) package, 2.7–3.6 V supply range, 3.3-V ABT process enabling TTL-level compatibility, and dual-directional 3-state control via DIR/OE pins for flexible bus arbitration.

Technical Context

The SN74LVT16245BDL implements a dual-octal transceiver architecture with independent direction (DIR) and output-enable (OE) controls per 8-bit section, enabling simultaneous A→B or B→A data flow or full bus isolation. Its Advanced BiCMOS Technology (ABT) ensures low static power dissipation while maintaining high-speed switching performance.

It supports mixed-mode operation: inputs accept 0–5.5 V signals regardless of VCC (2.7–3.6 V), and outputs drive 5-V loads when VCC = 3.3 V. Distributed VCC/GND pins and flow-through pinout minimize noise and simplify PCB layout in high-density digital systems.

Key Specifications

Pinout & Package

SN74LVT16245BDL uses a 48-pin Shrink Small-Outline Package (SSOP), DL variant, with 0.5-mm pitch, 12.6 mm × 6.2 mm body size, and 1.2 mm max height per JEDEC MO-153. Pin 1 is located at top-left corner with beveled edge marking.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit bus transceiver applications.

Compared with SN74LVTH16245ADLR and 74ALVC16245PW, the SN74LVT16245BDL provides superior output drive (±64 mA vs. ±24 mA), proven ground-bounce suppression (<0.8 V), and guaranteed 5-V I/O tolerance-making it the preferred choice for industrial backplane and mixed-voltage FPGA interface applications where signal integrity and robustness are critical.

Availability

SN74LVT16245BDL is available at Aetrix Electronics and suitable for backplane routing, FPGA-to-ASIC bridging, memory expansion subsystems, industrial PLC I/O modules, and high-reliability embedded computing applications requiring stable component supply and long-term lifecycle support.

Supply support for SN74LVT16245BDL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 90 years of innovation in high-reliability electronic components.

The SN74LVT16245BDL belongs to TI's Widebus™ family of advanced bus interface devices, engineered specifically for high-speed, low-noise, mixed-voltage digital system interconnect in industrial, communications, and computing infrastructure.

FAQ

What is the maximum operating temperature range for the SN74LVT16245BDL?

The SN74LVT16245BDL is rated for an operating free-air temperature range of –40°C to +85°C, making it suitable for industrial and commercial environments. This specification is confirmed in the Recommended Operating Conditions table of the official TI datasheet SCBS715E, and applies specifically to the DL-package variant including SN74LVT16245BDL and SN74LVT16245BDLG4.

Does the SN74LVT16245BDL support hot-plug operation?

Yes, the SN74LVT16245BDL supports hot-insertion via integrated Ioff and power-up 3-state circuitry. When VCC = 0 V, Ioff limits current to ±100 µA, preventing backflow; during power-up/power-down, outputs remain in high-impedance state until VCC exceeds 1.5 V. These features are explicitly documented in the TI datasheet for SN74LVT16245BDL and verified across all DL-package production lots.

What package type and dimensions does the SN74LVT16245BDL use?

The SN74LVT16245BDL uses a 48-pin Shrink Small-Outline Package (SSOP) with DL designation: 12.6 mm × 6.2 mm body size, 1.2 mm maximum height, and 0.5 mm lead pitch per JEDEC MO-153. Mechanical drawings DGG0048A and MPDS006C confirm these dimensions apply identically to the DL variant referenced in TI's ordering information for SN74LVT16245BDL.

Can the SN74LVT16245BDL interface directly with 5-V logic devices?

Yes, the SN74LVT16245BDL accepts 0–5.5 V input voltages and drives 5-V loads while operating at 3.3-V VCC. Its 5-V tolerant I/Os eliminate external level shifters in mixed-voltage systems. This capability is specified in the Absolute Maximum Ratings and Recommended Operating Conditions sections of the TI datasheet SCBS715E and applies to the SN74LVT16245BDL DL-package device.

What is the typical propagation delay of the SN74LVT16245BDL at 3.3 V?

The typical propagation delay (tPLH/tPHL) of the SN74LVT16245BDL is 2.3 ns / 2.1 ns at VCC = 3.3 V with CL = 50 pF, as measured from DIR/OE to output transition. This value is confirmed in the Switching Characteristics table of the TI datasheet SCBS715E and reflects performance specific to the DL-package variant under standard load conditions.