Texas Instruments SN74LVT16245BZRDR

Overview

SN74LVT16245BZRDR from Texas Instruments is a 3.3-V ABT 16-bit dual-octal noninverting bus transceiver with 3-state outputs, designed for asynchronous bidirectional data transfer between 3.3-V and 5-V logic domains. It features 48-pin VFBGA (ZRD) package, ±64 mA output drive at 3.3 V, and supports hot insertion via Ioff and power-up 3-state. Used in mixed-voltage backplane interfaces and FPGA-to-ASIC interconnects.

For engineers reviewing the SN74LVT16245BZRDR datasheet, SN74LVT16245BZRDR pinout, SN74LVT16245BZRDR application, or SN74LVT16245BZRDR equivalent, key selection criteria include 3.3-V VCC operation with 5-V tolerant I/O, 2.7–3.6 V supply range, tPLH/tPHL ≤ 3.7 ns at 3.3 V, and ZRD package thermal resistance of 36°C/W - critical for high-density board layouts requiring low ground bounce and distributed power integrity.

Technical Context

The SN74LVT16245BZRDR implements two independent 8-bit transceiver sections (A↔B), each controlled by dedicated DIR and OE inputs. Its Advanced BiCMOS Technology (ABT) enables TTL-level compatibility while operating from a 3.3-V supply, with input thresholds compatible with both 3.3-V and 5-V logic families.

Direction control is asynchronous and level-sensitive: DIR = L enables B→A data flow; DIR = H enables A→B flow; OE = H forces both ports into high-impedance state. The device remains in high-Z during power-up/down when VCC < 1.5 V, and includes distributed VCC/GND pins to suppress switching noise.

Key Specifications

Pinout & Package

SN74LVT16245BZRDR uses a 54-ball VFBGA package (ZRD, Pb-free), with 0.5-mm pitch, 7.0 × 5.5 mm body size, and 1.0-mm max height. Ball assignments follow JEDEC MO-153-compliant layout optimized for signal integrity and thermal dissipation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit bus transceiver applications.

Compared with SN74LVC16245ADGGR and SN74ALVC16245DGGR, the SN74LVT16245BZRDR uniquely combines 5-V I/O tolerance, ±64-mA drive, Ioff-enabled hot insertion, and ZRD-package thermal efficiency - making it the only option qualified for mixed-voltage industrial backplanes requiring zero-layout change during upgrade cycles.

Availability

SN74LVT16245BZRDR is available at Aetrix Electronics and suitable for industrial backplane interfaces, FPGA-to-ASIC bridging, hot-swappable module interconnects, and mixed-voltage memory expansion requiring stable component supply across extended product lifecycles.

Supply support for SN74LVT16245BZRDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and connectivity solutions for industrial, automotive, and communications markets.

The SN74LVT16245BZRDR belongs to TI's Widebus™ family of ABT transceivers, engineered specifically for high-speed, mixed-voltage bus interfacing in space-constrained industrial and telecom infrastructure equipment.

FAQ

What is the maximum operating temperature range for SN74LVT16245BZRDR?

The SN74LVT16245BZRDR is rated for operation from –40°C to +85°C ambient temperature. This range is validated per TI's recommended operating conditions and applies to all ZRD-package variants. Thermal performance is characterized with θJA = 36°C/W, enabling reliable function in sealed industrial enclosures without active cooling when power dissipation remains below 350 mW.

Does SN74LVT16245BZRDR support true 5-V output signaling?

Yes, SN74LVT16245BZRDR supports 5-V output signaling when driven by 5-V inputs, even with VCC = 3.3 V. Its ABT output stage is designed for 5-V TTL compatibility: VOH ≥ 2.0 V and VOL ≤ 0.55 V at 64-mA load ensure full logic-level compliance with legacy 5-V receivers. Input clamping diodes and 7-V absolute max rating further guarantee robustness.

How does SN74LVT16245BZRDR handle power sequencing during hot insertion?

SN74LVT16245BZRDR incorporates Ioff and power-up 3-state circuitry to manage hot insertion safely. When VCC is below 1.5 V, all outputs enter high-impedance mode regardless of OE/DIR states. At VCC = 0, Ioff limits reverse current to ±100 µA, preventing backdrive damage. OE should be tied to VCC via pullup resistor (>10 kΩ) to guarantee high-Z above 1.5 V during ramp-up.

Can SN74LVT16245BZRDR replace SN74LVT16245BDL in an existing design?

No direct replacement: SN74LVT16245BZRDR (54-ball ZRD VFBGA) and SN74LVT16245BDL (48-pin SSOP) differ in package, pinout, thermal profile, and board assembly requirements. While electrical functionality is identical, ZRD requires rework of land pattern, stencil, and reflow profile. Migration demands PCB redesign and validation - not drop-in substitution.

What is the significance of distributed VCC and GND pins in SN74LVT16245BZRDR?

SN74LVT16245BZRDR places six VCC and six GND balls across the perimeter of its 54-ball ZRD array to minimize simultaneous switching noise. This distribution reduces ground bounce (VOLP < 0.8 V) and improves power supply rejection ratio (PSRR) above 100 MHz - essential for maintaining signal integrity in high-speed parallel buses with >100 MHz clock rates and tight timing margins.