Texas Instruments SN74LVT245BNSR

Overview

SN74LVT245BNSR from Texas Instruments is a 3.3-V ABT octal bus transceiver with 3-state outputs, designed for asynchronous bidirectional data transfer between 3.3-V and 5-V logic domains. It features direction control (DIR), output enable (OE), ±100 µA Ioff at VCC = 0 V, and supports hot insertion via power-up 3-state. Used in mixed-voltage backplane interfaces and FPGA-to-ASIC interconnects.

For engineers reviewing the SN74LVT245BNSR datasheet, SN74LVT245BNSR pinout, SN74LVT245BNSR application, or SN74LVT245BNSR equivalent, key selection considerations include 20-pin SOP (NS) package thermal resistance (60°C/W), 3.5 ns max propagation delay at 3.3 V, Ioff-enabled isolation during power-down, and compatibility with TTL-level inputs while operating at 3.3-V VCC.

Technical Context

This device implements an advanced BiCMOS ABT (Advanced BiCMOS Technology) architecture enabling high-speed, low-noise bus interfacing across voltage domains. Its dual-rail tolerance allows 5-V signals on A/B ports while powered by 3.3-V VCC, with input clamp diodes rated to 7 V and output drive capability up to 64 mA sink per channel.

The integrated Ioff circuit disables outputs when VCC = 0 V, preventing backflow current during hot insertion, while power-up 3-state ensures outputs remain high-impedance until VCC stabilizes. Latch-up immunity exceeds 100 mA per JESD 78 Class II, and ESD protection meets 2000-V HBM, 200-V MM, and 1000-V CDM standards.

Key Specifications

Pinout & Package

SOP (NS) package: 20-pin small-outline plastic package, 7.4 mm × 5.3 mm body, 1.27 mm lead pitch, 2.65 mm max height, RoHS-compliant NiPdAu lead finish, MSL Level-1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal bus transceiver applications.

Compared with SN74LVTH245AQPWRQ1, SN74LVT245BNSR trades automotive qualification for lower cost and broader commercial availability; compared with 74ALVC16245PAG, it prioritizes mixed-voltage interoperability and hot-swap safety over bit-width and static power efficiency.

Availability

SN74LVT245BNSR is available at Aetrix Electronics and suitable for industrial PLC backplanes, FPGA-to-peripheral bridges, and server memory expansion slots requiring stable component supply, long-term lifecycle management, and RoHS-compliant sourcing.

Supply support for SN74LVT245BNSR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and connectivity technologies, with over 90 years of innovation in industrial, automotive, and communications markets.

The SN74LVT245BNSR belongs to TI's ABT logic family, engineered for high-speed, low-noise, mixed-voltage bus interfacing in mission-critical infrastructure and compute platforms where signal integrity and hot-swap reliability are essential.

FAQ

What is the maximum operating temperature for SN74LVT245BNSR?

The SN74LVT245BNSR is specified for operation from −40°C to +85°C ambient temperature. This range is validated per JEDEC JESD78 latch-up testing and thermal characterization at θJA = 60°C/W for the NS package. Operation beyond 85°C ambient may cause excessive junction temperature and parametric shift; derating is required above 70°C ambient in high-power-density layouts.

Does SN74LVT245BNSR support true 5-V to 3.3-V level translation?

Yes, SN74LVT245BNSR supports bidirectional level translation: its A and B ports accept 0–5.5-V input voltages while operating from a 3.3-V VCC supply. The device maintains valid TTL-compatible logic thresholds (VIH = 2 V, VIL = 0.8 V) and delivers 3.3-V CMOS output levels, enabling direct connection between 5-V peripherals and 3.3-V controllers without external resistors or translators.

How is hot insertion implemented in SN74LVT245BNSR?

SN74LVT245BNSR implements hot insertion through two complementary circuits: Ioff disables all outputs when VCC = 0 V, blocking reverse current flow from live buses; power-up 3-state holds outputs in high-impedance until VCC reaches ~1.5 V, preventing bus contention during power ramp. Both features are tested per JESD78 Class II and require OE pulled high via resistor during power-up.

What is the recommended decoupling for SN74LVT245BNSR?

TI recommends a minimum 0.1 µF X7R ceramic capacitor placed within 3 mm of the SN74LVT245BNSR VCC pin (pin 11) and GND pin (pin 10), with short, low-inductance traces. For systems with high-frequency switching or multiple transceivers, add a 4.7 µF tantalum or polymer capacitor per 5–10 devices on the same VCC rail to suppress low-frequency ripple and maintain stable supply during burst-mode operation.

Can SN74LVT245BNSR be used in place of SN74LVT245BDW?

Yes, SN74LVT245BNSR is functionally identical to SN74LVT245BDW but uses a different package: NS (SOP) instead of DW (SOIC). Both share identical logic behavior, timing, and electrical specs. However, the NS package has slightly higher thermal resistance (60°C/W vs. 58°C/W for DW) and different land pattern dimensions-PCB layout must be updated to match NS footprint and stencil design per TI's PW0020A outline.