Texas Instruments SN74LVTH16244AGRDR

Overview

SN74LVTH16244AGRDR from Texas Instruments is a 3.3-V ABT 16-bit noninverting buffer/driver with 3-state outputs, designed for mixed-mode (5-V input/3.3-V VCC) bus interfacing in high-density logic systems. It features bus-hold circuitry on all inputs, Ioff support for hot insertion, and operates across –40°C to 85°C. Its 54-ball microstar junior BGA (GRD) package enables compact PCB layout in telecom backplanes and industrial control modules.

For engineers reviewing the SN74LVTH16244AGRDR datasheet, SN74LVTH16244AGRDR pinout, SN74LVTH16244AGRDR application, or SN74LVTH16244AGRDR equivalent, key selection criteria include its 3.3-V ABT process enabling TTL-compatible 5-V signal translation, guaranteed 48 mA low-level output drive at 3.3 V, and GRD-package-specific thermal impedance of 36°C/W - critical for thermal-aware board-level integration.

Technical Context

This device implements four independent 4-bit noninverting buffers, each with active-low 3-state enable (OE), supporting flexible partitioning as one 16-bit, two 8-bit, or four 4-bit drivers. Its Advanced BiCMOS Technology (ABT) delivers low static power dissipation while maintaining TTL-level input thresholds (VIL = 0.8 V, VIH = 2.0 V) and 3.3-V rail compatibility.

The SN74LVTH16244AGRDR integrates Ioff and power-up 3-state logic to prevent current backflow during hot insertion and ensure high-impedance outputs during power ramp-up/down. Bus-hold circuitry eliminates external pullup/pulldown resistors by latching unused inputs at valid logic states, reducing component count and board area in memory interface and FPGA I/O expansion applications.

Key Specifications

Pinout & Package

SN74LVTH16244AGRDR uses a 54-ball microstar junior BGA (GRD package), 6 mm × 5 mm footprint, 0.5-mm ball pitch, JEDEC MO-225 compliant. Ball grid arranged in 6×9 array with corner balls omitted; top-side marking "LL244A".

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit buffer/driver applications.

Compared with SN74LVTH16244ADGVR and SN74LVC16244ADGGR, the SN74LVTH16244AGRDR offers superior thermal performance (36°C/W vs. 58/63°C/W), integrated bus-hold, and Ioff-enabled hot insertion - making it the only option qualified for high-reliability, high-density BGA-based telecom and industrial control designs.

Availability

SN74LVTH16244AGRDR is available at Aetrix Electronics and suitable for telecom backplane buffering, FPGA I/O bridging, and industrial PLC I/O modules requiring stable component supply across extended product lifecycles.

Supply support for SN74LVTH16244AGRDR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader delivering analog, embedded processing, and logic solutions for industrial, automotive, and communications markets.

The SN74LVTH16244AGRDR belongs to TI's Widebus™ ABT logic family, engineered specifically for high-speed, mixed-voltage bus interfacing in space-constrained, thermally demanding systems such as network switches and programmable automation controllers.

FAQ

What is the maximum operating temperature range for SN74LVTH16244AGRDR?

The SN74LVTH16244AGRDR is specified for operation from –40°C to +85°C ambient temperature. This industrial-grade range is validated across all electrical parameters including output drive, propagation delay, and bus-hold functionality. The GRD-package thermal resistance (θJA = 36°C/W) ensures reliable performance at the upper limit when proper PCB copper pour and airflow are implemented. SN74LVTH16244AGRDR maintains full functionality without derating within this range.

Does SN74LVTH16244AGRDR support hot insertion, and how is it implemented?

Yes, SN74LVTH16244AGRDR supports hot insertion via dual mechanisms: Ioff circuitry disables outputs when VCC = 0 V, preventing back-current flow from live backplanes; and power-up 3-state logic forces outputs into high-impedance during VCC ramp-up/down. These features are fully characterized per JESD78 and validated across the –40°C to 85°C range. SN74LVTH16244AGRDR requires no external circuitry to meet hot-swap compliance in modular telecom and server applications.

Can SN74LVTH16244AGRDR interface 5-V logic signals with a 3.3-V system bus?

Yes, SN74LVTH16244AGRDR is explicitly designed for mixed-mode operation: its inputs accept 0–5.5 V signals while powered from a 3.3-V VCC supply, and its outputs swing rail-to-rail (0 V to VCC) compatible with 3.3-V CMOS receivers. Input thresholds (VIH = 2.0 V, VIL = 0.8 V) match TTL logic, enabling direct connection to 5-V microcontrollers or FPGAs. SN74LVTH16244AGRDR eliminates external level translators in hybrid-voltage systems.

What is the purpose of bus-hold circuitry on SN74LVTH16244AGRDR inputs?

Bus-hold circuitry on SN74LVTH16244AGRDR actively maintains a valid logic state (high or low) on unused or unterminated inputs, eliminating the need for external pullup or pulldown resistors. It draws ±75 µA at VCC = 3.6 V to override noise or leakage currents. This feature reduces BOM count, saves PCB area, and prevents metastability in partially loaded data buses. SN74LVTH16244AGRDR bus-hold is enabled on all 32 data inputs and is disabled only when VCC < 1.5 V.

Is SN74LVTH16244AGRDR pin-compatible with other packages in the LVTH16244A family?

No, SN74LVTH16244AGRDR is not pin-compatible with DGG, DGV, DL, or WD packages due to its 54-ball GRD BGA footprint versus their 48-pin or 48-lead configurations. Terminal assignments differ significantly: GRD uses a 6×9 grid with NC balls and unique OE placement (e.g., A3 = 1OE, J6 = 4OE), while TSSOP/DL packages use linear 48-pin layouts. SN74LVTH16244AGRDR requires dedicated PCB layout and cannot be substituted without redesign.