Texas Instruments SN74LVTH16374DLR

Overview

SN74LVTH16374DLR from Texas Instruments is a 3.3-V ABT 16-bit edge-triggered D-type flip-flop with 3-state outputs in SSOP-48 package, supporting mixed-mode 5-V input compatibility and bus-hold on all data inputs. It delivers 64 mA low-level output drive at VCC = 3.3 V, operates down to 2.7 V supply, and achieves 160 MHz clock frequency with 2.9 ns data setup time - ideal for high-speed bidirectional bus interfacing in industrial control backplanes.

For engineers reviewing the SN74LVTH16374DLR datasheet, SN74LVTH16374DLR pinout, SN74LVTH16374DLR application, or SN74LVTH16374DLR equivalent, key selection criteria include its 3-state enable timing (tPZL = 1.5 ns min), Ioff-enabled hot insertion support, distributed VCC/GND pin architecture for noise suppression, and bus-hold elimination of external pull resistors in point-to-point or stub-bus topologies.

Technical Context

This device implements two independent 8-bit edge-triggered D-type flip-flop banks, each with dedicated clock (CLK) and output-enable (OE) controls, enabling synchronous latching and tri-state bus management. Its Advanced BiCMOS Technology (ABT) ensures TTL-compatible thresholds (VIH = 2.0 V, VIL = 0.8 V) while operating from a 3.3-V supply - allowing direct interface to both 3.3-V logic and legacy 5-V systems without level shifters.

The flow-through pinout (input–clock–output sequence per byte) minimizes PCB trace skew, and distributed power/ground pins reduce simultaneous switching noise. Bus-hold circuitry actively maintains valid logic states on undriven D inputs, and Ioff protection disables outputs during power-down to prevent backdrive current - critical for live-insertion in modular I/O systems.

Key Specifications

Pinout & Package

SN74LVTH16374DLR uses a 48-pin SSOP (Shrink Small Outline Package) with 0.5-mm pitch, 12.6 mm × 6.2 mm body, and 1.2 mm max height - optimized for high-density PCB layouts with thermal resistance θJA = 63°C/W.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit registered bus interface applications.

Compared with SN74LVC16374DGGR and 74ALVCH16374MTD, SN74LVTH16374DLR uniquely combines 5-V input tolerance, strong bus-hold, and Ioff hot-insertion - making it the only option among the three qualified for mixed-voltage backplane and live-swap applications without supplemental circuitry.

Availability

SN74LVTH16374DLR is available at Aetrix Electronics and suitable for industrial backplane interfaces, programmable logic I/O expansion, hot-swappable module carriers, and test equipment digital pattern generation requiring stable component supply across extended temperature ranges (–40°C to 85°C).

Supply support for SN74LVTH16374DLR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with over 50 years of innovation in high-reliability interface and timing products.

The SN74LVTH16374DLR belongs to TI's Widebus™ family of advanced bus-interface logic, engineered specifically for robust, high-speed data transfer in mixed-voltage industrial, telecom, and test equipment systems.

FAQ

What is the maximum clock frequency supported by SN74LVTH16374DLR?

The SN74LVTH16374DLR supports a maximum clock frequency of 160 MHz across its full operating temperature range (–40°C to 85°C) when VCC = 3.3 V ± 0.3 V and CL = 50 pF. This rating is guaranteed by TI's switching characteristics table and validated under worst-case process/voltage/temperature corners - enabling reliable use in high-throughput data acquisition and real-time control loops where deterministic timing is critical. The SN74LVTH16374DLR maintains this performance without derating up to 85°C ambient.

Does SN74LVTH16374DLR support 5-V input signals while operating at 3.3-V VCC?

Yes, SN74LVTH16374DLR fully supports 5-V-tolerant inputs with 3.3-V VCC operation, as confirmed by its VI specification (–0.5 V to 7 V) and explicit design intent stated in the datasheet: "designed for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment." This allows direct connection to legacy 5-V microcontrollers, sensors, or logic without external level shifters - a core differentiator versus standard LVC or ALVC families.

How does the bus-hold feature on SN74LVTH16374DLR eliminate external pull resistors?

The SN74LVTH16374DLR integrates active bus-hold circuitry on all data inputs (1D1–1D8, 2D1–2D8), which sources or sinks up to ±750 μA to maintain the last-valid logic state when inputs float. This eliminates the need for external 4.7-kΩ pullup/pulldown resistors typically required to prevent undefined states - reducing BOM count, PCB area, and potential noise coupling. TI explicitly warns against using external resistors with bus-hold enabled, as they conflict with the internal hold current.

Can SN74LVTH16374DLR be used in hot-plug applications?

Yes, SN74LVTH16374DLR is explicitly designed for hot-insertion via dual protection: Ioff circuitry limits off-state leakage to ±100 μA when VCC = 0, preventing damaging back-current from live backplanes; and power-up 3-state forces outputs into high-impedance during VCC ramp (0–1.5 V), avoiding bus contention. These features are verified per JESD 78 latch-up and JESD 22 ESD standards - making SN74LVTH16374DLR suitable for modular carrier cards and field-replaceable units.

What package type and dimensions does SN74LVTH16374DLR use?

SN74LVTH16374DLR uses the SSOP-48 (DL) package: 12.6 mm × 6.2 mm body size, 1.2 mm maximum height, 0.5 mm lead pitch, and 48 gull-wing leads. Its mechanical drawing (DGG0048A) confirms compliance with JEDEC MO-153, and thermal resistance is specified at θJA = 63°C/W. The "R" suffix denotes tape-and-reel packaging (1000 units/reel), with pin 1 located in quadrant Q1 per TI's tape orientation standard.