Texas Instruments SN74LVTH245AMDBREP

Overview

SN74LVTH245AMDBREP from Texas Instruments is a radiation-hardened, high-reliability octal bus transceiver designed for 3.3-V VCC operation with mixed-mode 5-V TTL interface capability. It provides bidirectional data transmission between A and B buses via DIR control, features 3-state outputs enabled by OE, supports hot insertion via Ioff and power-up 3-state, and operates across –55°C to 125°C in SSOP-20 package.

For engineers reviewing the SN74LVTH245AMDBREP datasheet, SN74LVTH245AMDBREP pinout, SN74LVTH245AMDBREP application, or SN74LVTH245AMDBREP equivalent, key selection criteria include its extended temperature range (–55°C to 125°C), bus-hold inputs eliminating external resistors, support for unregulated battery operation down to 2.7 V, and compliance with military-grade reliability standards including HAST and biased 85/85 testing.

Technical Context

This device implements ABT (Advanced BiCMOS Technology) logic with active bus-hold circuitry on all A and B port inputs, enabling stable logic levels without external biasing. Its Ioff protection disables outputs during power-down to prevent backflow current, while power-up 3-state ensures high-impedance outputs during supply ramp-up.

The transceiver supports asynchronous bidirectional communication with propagation delays as low as 1.2 ns (tPLH/tPHL at VCC = 2.7 V) and enables isolation via OE high. It meets JESD 22 ESD ratings (2000-V HBM, 200-V MM) and latch-up immunity exceeding 500 mA per JESD 17.

Key Specifications

Pinout & Package

SN74LVTH245AMDBREP is housed in a 20-pin SSOP (Shrink Small Outline Package) with 0.65-mm lead pitch, 7.5-mm body width, and 2-mm maximum height per JEDEC MO-150. The package is RoHS-compliant, NIPDAU lead-finished, and rated MSL-1 (260°C peak reflow).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar octal bus transceiver applications.

Compared with SN74LVTH245AMDBREP, SN74LVTH245AIPWREP trades extended temperature capability for lower procurement cost and broader distributor availability, while SN54LVTH245A adds QML-V process controls and documentation overhead without altering electrical behavior - making SN74LVTH245AMDBREP the optimal balance of reliability, temperature range, and supply chain readiness for non-mandated but high-assurance programs.

Availability

SN74LVTH245AMDBREP is available at Aetrix Electronics and suitable for avionics data bus interface, defense system backplane bridge, and downhole telemetry controller applications requiring stable component supply across extended temperature and radiation-exposed environments.

Supply support for SN74LVTH245AMDBREP includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and high-reliability components for industrial, automotive, aerospace, and defense markets.

The SN74LVTH245A-EP product line delivers enhanced plastic packaged logic devices engineered for mission-critical systems demanding extended temperature operation, robust ESD/latch-up immunity, and long-term supply assurance.

FAQ

What is the maximum operating temperature range for SN74LVTH245AMDBREP?

The SN74LVTH245AMDBREP is specified for continuous operation from –55°C to 125°C. This extended temperature range is validated through JEDEC-qualified thermal cycling, biased 85/85, and HAST testing - confirming suitability for aerospace, defense, and downhole applications where ambient extremes exceed commercial-grade limits. The SN74LVTH245AMDBREP maintains full electrical performance across this entire range without derating.

Does SN74LVTH245AMDBREP support hot insertion, and how is it implemented?

Yes, SN74LVTH245AMDBREP supports hot insertion via two integrated features: Ioff circuitry disables outputs when VCC = 0 V, preventing backflow current from live buses into a powered-down device; and power-up 3-state holds all outputs in high-impedance until VCC reaches valid operating voltage. These functions are inherent to the SN74LVTH245AMDBREP silicon design and require no external components to enable safe live-card replacement in modular systems.

Can SN74LVTH245AMDBREP interface between 3.3-V and 5-V logic systems?

Yes, SN74LVTH245AMDBREP supports mixed-mode signal operation: its inputs tolerate 5-V TTL voltage levels (VI up to 5.5 V), and its outputs drive 5-V TTL loads (VOH ≥ 2.0 V at IOH = –24 mA) while powered from a 3.3-V supply. This capability is explicitly confirmed in the official TI datasheet for SN74LVTH245AMDBREP and eliminates the need for discrete level shifters in hybrid-voltage system architectures.

What package type and lead finish does SN74LVTH245AMDBREP use?

SN74LVTH245AMDBREP uses a 20-pin SSOP (Shrink Small Outline Package) with JEDEC MO-150 registration, 0.65-mm lead pitch, and 7.5-mm body width. Its leads are finished with matte tin (NIPDAU), and it carries an MSL Level-1 rating (unlimited floor life at ≤30°C/60% RH), allowing standard SMT assembly without baking. This package configuration is documented in TI's official packaging addendum for SN74LVTH245AMDBREP.

How does the bus-hold feature on SN74LVTH245AMDBREP eliminate external resistors?

The SN74LVTH245AMDBREP integrates active bus-hold circuitry on all A and B port inputs, providing ±750 µA dynamic hold current to maintain valid logic states on unused or floating lines. Because this function is built into the SN74LVTH245AMDBREP die, external pullup or pulldown resistors become redundant - reducing BOM cost, PCB real estate, and potential signal integrity degradation from resistor parasitics in high-speed bus designs.