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Texas Instruments SN74SSTL16847DGGR

Name: SN74SSTL16847DGGR
Brand: Texas Instruments
SKU: SN74SSTL16847DGGR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: SN74SSTL16847DGGR

Manufacturer:: Texas Instruments

Category:: Buffers, Drivers, Receivers, Transceivers

Package:: 64-TFSOP (0.240", 6.10mm Width)

Datasheet:: SN74SSTL16847DGGR.pdf

Description:: IC BUF NON-INVERT 3.6V 64TSSOP

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Product details

Overview

SN74SSTL16847DGGR from Texas Instruments is a 20-bit SSTL_3 interface buffer with 3-state outputs, designed for 3.0–3.6 V VCC and VDDQ operation, supporting SSTL_3 Class I/II signaling, 0°C to 70°C temperature range, and flow-through pinout for DDR memory subsystems in server DIMMs and workstation memory modules.

For engineers reviewing the SN74SSTL16847DGGR datasheet, SN74SSTL16847DGGR pinout, SN74SSTL16847DGGR application, or SN74SSTL16847DGGR equivalent, key selection criteria include SSTL_3 input/output compatibility, 3-state enable timing (ten ≤ 4.1 ns), VREF = 0.45 × VDDQ reference architecture, and thermal impedance (θJA = 73°C/W) for high-density memory buffering.

Technical Context

The SN74SSTL16847DGGR implements a noninverting, unidirectional A→Y data path controlled by a single active-low output-enable (OE) signal. It features dual supply domains: VCC (3.0–3.6 V) powers logic and control circuitry, while VDDQ (3.0–3.6 V) supplies the SSTL_3 I/O drivers.

It meets JEDEC SSTL_3 Class I (CL = 10 pF) and Class II (CL = 30 pF) specifications, with AC input thresholds referenced to VREF (1.3–1.7 V), and supports termination at VTT = VREF ± 50 mV. Latch-up performance exceeds 250 mA per JESD 17.

Key Specifications

Parameter	Value and Actual Design Meaning
VCC / VDDQ Range	3.0 V to 3.6 V - Enables interoperability with 3.3 V DDR memory systems and compatible with JEDEC SSTL_3 voltage rails.
VREF Range	1.3 V to 1.7 V (0.45 × VDDQ) - Sets precise AC input thresholds (VIH = VREF + 400 mV, VIL = VREF – 400 mV) for noise-immune SSTL_3 signaling.
tpd (A→Y)	1.5 ns to 3.0 ns - Ensures sub-3 ns propagation delay across full temperature and voltage range, critical for tight DDR timing budgets.
ten / tdis (OE→Y)	1.5 ns to 4.9 ns - Guarantees fast, predictable 3-state enable/disable transitions under both Class I and Class II loading conditions.
IOH / IOL	–20 mA / +20 mA - Delivers sufficient drive strength for point-to-point or lightly loaded SSTL_3 bus topologies without signal integrity degradation.
θJA	73°C/W - Specifies thermal performance in the DGGR (TSSOP-64) package, informing heatsink or airflow requirements in memory module PCB layouts.
Operating Temperature	0°C to 70°C - Qualified for commercial-grade memory subsystems including registered DIMMs and buffered memory modules.

Pinout & Package

Packaged in a 64-pin Plastic Thin Shrink Small-Outline Package (TSSOP), DGGR, with 0.5 mm pitch and exposed pad not present. Pin count and layout optimized for flow-through routing in high-speed memory interfaces.

Pin/Terminal	Circuit Role	Design Meaning
A1–A20	Data inputs	20-bit SSTL_3-compatible input port accepting VIH/VIL referenced to VREF; must be terminated or tied to VCC/GND when unused.
Y1–Y20	Data outputs	20-bit SSTL_3-compliant outputs driven from VDDQ; high-impedance when OE is high; support Class I/II load capacitance (10/30 pF).
OE	Output-enable (active low)	Asynchronous 3-state control; tie to VCC via pullup resistor during power-up/down to prevent bus contention.
VCC	Logic supply	3.0–3.6 V supply for internal logic and control circuitry; separate from VDDQ to isolate noise between logic and I/O domains.
VDDQ	I/O supply	3.0–3.6 V supply for SSTL_3 output drivers; must match VCC voltage for proper VREF derivation and signal level alignment.
VREF	Reference input	External reference (1.3–1.7 V) setting AC input thresholds; derived from VDDQ × 0.45 in compliant systems.
GND	Ground	Multiple dedicated GND pins (pins 3, 9, 15, 23, 31, 39, 47, 55, 63) provide low-inductance return paths for signal and power domains.
NC	No internal connection	Pins 33, 34, 49, 50 - Reserved; must remain unconnected to avoid parasitic coupling or ESD path disruption.

Key Features

Feature	Design Value
SSTL_3 Class I & II compliance	Fully meets JEDEC SSTL_3 specifications for both 10 pF (Class I) and 30 pF (Class II) loads, enabling use in DDR SDRAM memory channels with varying trace lengths and stub counts.
Flow-through pinout	Input (A) and output (Y) pins arranged on opposite sides of the TSSOP-64 package to minimize layer count and crosstalk in memory module PCB routing.
VREF-referenced input thresholds	AC VIH/VIL defined relative to VREF (not VDDQ), allowing stable switching margins across voltage and temperature variations in high-speed memory buses.
High ESD robustness	Exceeds 2000 V HBM and 200 V machine model ESD ratings, enhancing reliability during board assembly and field operation in memory module manufacturing environments.
Latch-up immunity	Rated >250 mA per JESD 17, ensuring resilience against transient overcurrent events common in hot-plug or power-rail sequencing scenarios.

Applications

Registered DIMM Buffering	Workstation Memory Subsystem
Use Scenario: Driving address/command/control signals from memory controller to multiple DDR SDRAM chips on a 240-pin RDIMM. IC Role / Device Role / Timing Role: Unidirectional SSTL_3 buffer isolating controller outputs and distributing clean, slew-controlled signals with matched propagation delay. Use Value: Enables reliable 200+ MHz DDR operation by maintaining signal integrity across 10+ DRAM loads and meeting Class II timing windows (tdis ≤ 4.8 ns).	Use Scenario: Level-shifting and fanout buffering for clock and command signals in dual-CPU workstation memory channels. IC Role / Device Role / Timing Role: SSTL_3-compliant repeater providing low-skew, 3-state-controllable signal distribution between controller and memory ranks. Use Value: Supports simultaneous access to multiple memory banks with <3 ns tpd and VREF-based threshold stability across wide temperature ranges (0°C–70°C).
DDR Memory Module Test Fixture	Industrial Control Memory Interface
Use Scenario: Emulating SSTL_3 driver behavior in automated test equipment for DDR SDRAM validation and margin testing. IC Role / Device Role / Timing Role: Programmable 3-state buffer used to inject calibrated timing skew, voltage margin, and enable/disable transients into memory bus signals. Use Value: Provides repeatable, datasheet-accurate tdis/ten timing (1.5–4.9 ns) and VOH/VOL levels (2.1 V/0.55 V) for production test correlation.	Use Scenario: Interfacing FPGA-based memory controllers to industrial DDR2 memory in programmable logic controllers with extended thermal cycling. IC Role / Device Role / Timing Role: Robust SSTL_3 translator ensuring signal integrity in harsh environments where latch-up immunity (>250 mA) and ESD tolerance (>2000 V) are mandatory. Use Value: Maintains functional reliability over 10,000+ thermal cycles due to specified 0°C–70°C operation and JESD 17 latch-up compliance.

Registered DIMM Buffering

Workstation Memory Subsystem

Use Scenario: Driving address/command/control signals from memory controller to multiple DDR SDRAM chips on a 240-pin RDIMM.

IC Role / Device Role / Timing Role: Unidirectional SSTL_3 buffer isolating controller outputs and distributing clean, slew-controlled signals with matched propagation delay.

Use Value: Enables reliable 200+ MHz DDR operation by maintaining signal integrity across 10+ DRAM loads and meeting Class II timing windows (tdis ≤ 4.8 ns).

Use Scenario: Level-shifting and fanout buffering for clock and command signals in dual-CPU workstation memory channels.

IC Role / Device Role / Timing Role: SSTL_3-compliant repeater providing low-skew, 3-state-controllable signal distribution between controller and memory ranks.

Use Value: Supports simultaneous access to multiple memory banks with <3 ns tpd and VREF-based threshold stability across wide temperature ranges (0°C–70°C).

DDR Memory Module Test Fixture

Industrial Control Memory Interface

Use Scenario: Emulating SSTL_3 driver behavior in automated test equipment for DDR SDRAM validation and margin testing.

IC Role / Device Role / Timing Role: Programmable 3-state buffer used to inject calibrated timing skew, voltage margin, and enable/disable transients into memory bus signals.

Use Value: Provides repeatable, datasheet-accurate tdis/ten timing (1.5–4.9 ns) and VOH/VOL levels (2.1 V/0.55 V) for production test correlation.

Use Scenario: Interfacing FPGA-based memory controllers to industrial DDR2 memory in programmable logic controllers with extended thermal cycling.

IC Role / Device Role / Timing Role: Robust SSTL_3 translator ensuring signal integrity in harsh environments where latch-up immunity (>250 mA) and ESD tolerance (>2000 V) are mandatory.

Use Value: Maintains functional reliability over 10,000+ thermal cycles due to specified 0°C–70°C operation and JESD 17 latch-up compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar SSTL_3 interface buffer applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
SN74SSTL16839DGGR	18-bit version (vs. 20-bit); identical VCC/VDDQ, VREF, and timing specs; same DGGR package.	Used where fewer address/control lines require buffering; lacks two Y outputs and corresponding A inputs.	Select SN74SSTL16839DGGR only when 18-bit channel count suffices and pin compatibility with existing 18-bit layouts is required.
SN74SSTL16848DGGR	Inverting function (A→Y inverted); otherwise identical electrical specs, pinout, and package.	Required in designs needing polarity inversion for setup/hold timing adjustment or signal phase correction.	Choose SN74SSTL16848DGGR when system-level timing analysis requires inverted output polarity-no change to PCB layout or power delivery.

Compared with SN74SSTL16839DGGR and SN74SSTL16848DGGR, the SN74SSTL16847DGGR provides the exact 20-bit noninverting buffering needed for full DDR address/command bus replication, avoiding redesign when 18-bit truncation or signal inversion would violate timing or protocol constraints.

Availability

SN74SSTL16847DGGR is available at Aetrix Electronics and suitable for registered DIMM manufacturing, workstation memory subsystem design, and DDR test fixture development requiring stable component supply and long-term obsolescence management.

Supply support for SN74SSTL16847DGGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, delivering analog, embedded processing, and logic solutions for industrial, automotive, and communications markets.

The SN74SSTL16847DGGR belongs to TI's Widebus™ family of high-speed interface logic devices, engineered specifically for DDR memory subsystem signal integrity, timing margin, and JEDEC-compliant SSTL-3 interfacing.

FAQ

What is the recommended VREF voltage for SN74SSTL16847DGGR in a 3.3 V DDR system?

The SN74SSTL16847DGGR requires VREF = 0.45 × VDDQ. For a nominal 3.3 V VDDQ, VREF must be set to 1.485 V, within the 1.3 V–1.7 V operating range. This value establishes AC input thresholds (VIH = VREF + 400 mV, VIL = VREF – 400 mV) and ensures correct SSTL_3 switching behavior. The SN74SSTL16847DGGR does not generate VREF internally-it must be supplied externally with low noise and tight regulation.

Can SN74SSTL16847DGGR operate with VCC and VDDQ at different voltages?

No-the SN74SSTL16847DGGR datasheet specifies that VCC and VDDQ must be equal (both 3.0–3.6 V) to ensure correct VREF derivation and internal logic-to-I/O level translation. Using mismatched supplies risks incorrect input sampling, output drive violation, or undefined 3-state behavior. The SN74SSTL16847DGGR is not designed for split-rail operation.

How should unused inputs be handled on SN74SSTL16847DGGR?

All unused inputs-including A1–A20 and OE-must be permanently tied to either VCC or GND to prevent floating nodes, which can cause excessive ICC current, oscillation, or ESD susceptibility. TI recommends using 1–10 kΩ pullup/pulldown resistors. The SN74SSTL16847DGGR has no internal termination or weak keepers; external biasing is mandatory per SCBA004 guidelines.

Does SN74SSTL16847DGGR support hot-swap or live-insertion in memory modules?

The SN74SSTL16847DGGR is not characterized for hot-swap operation. Its absolute maximum ratings assume controlled power sequencing. To avoid damage during insertion, OE must be held high (disabled) until VCC and VDDQ stabilize, and VREF must be established before applying inputs. TI does not guarantee safe live insertion for the SN74SSTL16847DGGR without external protection circuitry.

What is the maximum capacitive load the SN74SSTL16847DGGR can drive while meeting Class II timing?

The SN74SSTL16847DGGR is fully characterized for Class II operation up to 30 pF total load capacitance (including trace, stub, and DRAM input capacitance). Exceeding 30 pF violates the tdis ≤ 4.8 ns and ten ≤ 4.1 ns specifications. Layout best practices-such as minimizing stub length and using controlled-impedance routing-must be followed to keep net capacitance within this limit for reliable SN74SSTL16847DGGR operation.

SN74SSTL16847DGGR Specifications

Product attributes: Attribute value

Manufacturer:: Texas Instruments

Series:: 74SSTL

Package/Case:: 64-TFSOP (0.240", 6.10mm Width)

Packaging:: Tape & Reel (TR)

Product Status:: Obsolete

Logic Type:: Buffer, Non-Inverting

Number of Elements:: 1

Number of Bits per Element:: 20

Input Type:: -

Output Type:: 3-State

Current - Output High, Low:: 20mA, 20mA

Voltage - Supply:: 3V ~ 3.6V

Operating Temperature:: 0°C ~ 70°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: 64-TSSOP

SN74SSTL16847DGGR FAQ

1.How can I place an order for SN74SSTL16847DGGR through Aetrix?

Please submit a Request for Quotation (RFQ) for SN74SSTL16847DGGR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SN74SSTL16847DGGR reliable?

The price and inventory of SN74SSTL16847DGGR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SN74SSTL16847DGGR is usually 5 days.

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SN74SSTL16847DGGR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SN74SSTL16847DGGR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SN74SSTL16847DGGR?

For technical support, including SN74SSTL16847DGGR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SN74SSTL16847DGGR requirements.

6.How does Aetrix verify that SN74SSTL16847DGGR is sourced from the original manufacturer or authorized distributors?

All SN74SSTL16847DGGR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SN74SSTL16847DGGR meets industry standards.

7.What is the process for return or replacement of SN74SSTL16847DGGR?

All SN74SSTL16847DGGR units undergo pre-shipment inspection (PSI). If there is an issue with SN74SSTL16847DGGR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SN74SSTL16847DGGR part is unused and in its original packaging.

Return procedure for SN74SSTL16847DGGR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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