Texas Instruments SN74V273-7GGM

Overview

SN74V273-7GGM from Texas Instruments is a 16384 × 18 / 32768 × 9, 3.3-V CMOS FIFO memory with independent read/write clocks, 166-MHz operation, and user-selectable ×9/×18 bus sizing - deployed in high-throughput network buffering and DSP interfacing where deterministic latency and zero-latency retransmit are critical.

For engineers reviewing the SN74V273-7GGM datasheet, SN74V273-7GGM pinout, SN74V273-7GGM application, or SN74V273-7GGM equivalent, key selection criteria include FWFT vs. standard timing mode configuration, programmable almost-empty/full flag offsets, big/little-endian byte ordering, and 5-V-tolerant input compatibility with legacy logic interfaces.

Technical Context

This FIFO implements dual-clock asynchronous architecture with fully independent RCLK and WCLK domains (0–166 MHz), enabling simultaneous read/write without arbitration. It supports four bus-matching configurations (×9/×9, ×9/×18, ×18/×9, ×18/×18) via IW/OW pins during master reset.

It features fixed first-word latency (3 RCLK cycles in FWFT mode), zero-latency retransmit (enabled by RM pin), and dual-mode flag timing (synchronous/asynchronous PAE/PAF) controlled by PFM. Flag behavior (EF/OR, FF/IR, HF, PAE, PAF) is strictly mode-dependent and validated per SCAS669D Rev. FEBRUARY 2003.

Key Specifications

Pinout & Package

SN74V273-7GGM is packaged in a 100-pin Ball Grid Array (BGA), GGM package, with 18-bit data I/O (D0–D17, Q0–Q17), dual clock inputs (WCLK, RCLK), and dedicated flag/control pins including EF/OR, FF/IR, HF, PAE, PAF, MRS, PRS, RT, OE, and bus-width configuration pins IW/OW.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FIFO memory applications.

Compared with SN74V273-7GGM, SN74V263-7PZA reduces depth and changes package to enable compact designs, while SN74V283-7GGM doubles depth in identical GGM packaging - making both viable alternatives depending on capacity and mechanical constraints, not functional deviation.

Availability

SN74V273-7GGM is available at Aetrix Electronics and suitable for network packet buffering, DSP data streaming, and telecom line card applications requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for SN74V273-7GGM includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and logic solutions, with decades of expertise in high-speed interface ICs and DSP ecosystem components.

The SN74V273-7GGM belongs to TI's high-speed FIFO memory product line, engineered specifically for deterministic, low-latency data buffering in telecom infrastructure, video processing, and real-time signal acquisition systems.

FAQ

What memory organization does SN74V273-7GGM support?

SN74V273-7GGM supports two memory organizations selectable at master reset: 16384 × 18 (18-bit wide, 16k deep) or 32768 × 9 (9-bit wide, 32k deep). The configuration is determined by the states of IW and OW pins during MRS and remains fixed until next reset. This dual-mode capability enables flexible bus-matching in systems with asymmetric data paths.

Does SN74V273-7GGM support 5-V logic inputs?

Yes, SN74V273-7GGM features 5-V-tolerant inputs on all control and data pins (D0–D17, WEN, REN, MRS, etc.), allowing direct connection to 5-V CMOS/TTL logic without level-shifting circuitry. This simplifies integration with legacy controllers and mixed-voltage systems while maintaining full 3.3-V core operation and timing compliance.

How is first-word latency handled in SN74V273-7GGM?

SN74V273-7GGM offers two latency behaviors: in FWFT mode (FWFT/SI = high at MRS), the first word appears on Q0–Q17 after exactly three RCLK rising edges without REN assertion; in standard mode, every read - including the first - requires active REN. Both modes guarantee fixed, predictable latency critical for real-time synchronization.

Can SN74V273-7GGM be used in zero-latency retransmit mode?

Yes, SN74V273-7GGM supports zero-latency retransmit when RM is held low during master reset. In this mode, asserting RT low on a rising RCLK edge causes the first retransmitted word to appear on Q0–Q17 synchronously with that same RCLK edge - enabling immediate data replay without pipeline stalls in protocol recovery sequences.

What package type is SN74V273-7GGM supplied in?

SN74V273-7GGM is supplied exclusively in the 100-pin Ball Grid Array (BGA) package designated GGM, optimized for high-density routing and thermal dissipation in high-speed applications. It is not available in TQFP or other packages; the GGM footprint and solder-ball layout are defined in TI's SCAS669D datasheet revision February 2003.